{"id":6565,"date":"2026-10-28T01:54:50","date_gmt":"2026-10-28T01:54:50","guid":{"rendered":"https:\/\/seprays.com\/?p=6565"},"modified":"2026-10-28T01:54:51","modified_gmt":"2026-10-28T01:54:51","slug":"seprays-at-nepcon-asia-2026-connecting-through-pcb-depaneling-and-automation","status":"publish","type":"post","link":"https:\/\/seprays.com\/ko\/seprays-at-nepcon-asia-2026-connecting-through-pcb-depaneling-and-automation\/","title":{"rendered":"SEPRAYS at NEPCON ASIA 2026: Connecting Through PCB Depaneling and Automation"},"content":{"rendered":"<p><strong>October 27\u201329, 2026 | Shenzhen, China<\/strong><\/p>\n\n\n\n<p>SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition &amp; Convention Center.<\/p>\n\n\n\n<p>At <strong>Hall 13, Booth 13F76<\/strong>, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements.<\/p>\n\n\n\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_85 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"\ubaa9\ucc28 \ud1a0\uae00\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewbox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewbox=\"0 0 24 24\" version=\"1.2\" baseprofile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/seprays.com\/ko\/seprays-at-nepcon-asia-2026-connecting-through-pcb-depaneling-and-automation\/#Exploring_PCB_Depaneling_and_Automation\" >Exploring PCB Depaneling and Automation<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/seprays.com\/ko\/seprays-at-nepcon-asia-2026-connecting-through-pcb-depaneling-and-automation\/#Connecting_with_the_Electronics_Manufacturing_Community\" >Connecting with the Electronics Manufacturing Community<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/seprays.com\/ko\/seprays-at-nepcon-asia-2026-connecting-through-pcb-depaneling-and-automation\/#Visit_SEPRAYS_at_NEPCON_ASIA_2026\" >Visit SEPRAYS at NEPCON ASIA 2026<\/a><\/li><\/ul><\/nav><\/div>\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Exploring_PCB_Depaneling_and_Automation\"><\/span><strong>Exploring PCB Depaneling and Automation<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing.<\/p>\n\n\n\n<p>Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology.<\/p>\n\n\n\n<p>Laser depaneling and automated mechanical separation offer different advantages depending on the application. Understanding these differences helps manufacturers evaluate processing methods according to their specific production requirements.<\/p>\n\n\n\n<p>Industry exhibitions such as NEPCON ASIA create opportunities to discuss these technical considerations and learn how manufacturing technologies continue to evolve.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Connecting_with_the_Electronics_Manufacturing_Community\"><\/span><strong>Connecting with the Electronics Manufacturing Community<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Beyond equipment and technology, industry exhibitions are valuable for the conversations they bring together.<\/p>\n\n\n\n<p>Manufacturers, engineers, and industry professionals can share experiences, discuss production challenges, and learn about emerging manufacturing trends.<\/p>\n\n\n\n<p>For SEPRAYS, participating in NEPCON ASIA is an opportunity to engage with the wider electronics manufacturing community and follow developments in PCB depaneling and automation.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Visit_SEPRAYS_at_NEPCON_ASIA_2026\"><\/span><strong>Visit SEPRAYS at NEPCON ASIA 2026<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Event:<\/strong> NEPCON ASIA 2026<\/p>\n\n\n\n<p><strong>Dates:<\/strong> October 27\u201329, 2026<\/p>\n\n\n\n<p><strong>Venue:<\/strong> Shenzhen World Exhibition &amp; Convention Center, Shenzhen, China<\/p>\n\n\n\n<p><strong>Hall:<\/strong> 13<\/p>\n\n\n\n<p><strong>Booth:<\/strong> 13F76<\/p>\n\n\n\n<p>We look forward to meeting industry professionals, exchanging ideas, and exploring the evolving landscape of electronics manufacturing.<\/p>\n\n\n\n<p>NEPCON ASIA 2026 is another opportunity to connect technology with real-world manufacturing needs.<\/p>\n\n\n\n<figure class=\"wp-block-embed is-type-video is-provider-youtube wp-block-embed-youtube wp-embed-aspect-16-9 wp-has-aspect-ratio\"><div class=\"wp-block-embed__wrapper\">\n<iframe title=\"NEPCON ASIA 2026 | Meet SEPRAYS | PCB Depaneling &amp; Automation Solutions\" width=\"800\" height=\"450\" data-src=\"https:\/\/www.youtube.com\/embed\/Vggp0uTcD0w?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" class=\"lazyload\" data-load-mode=\"0\"><\/iframe>\n<\/div><\/figure>","protected":false},"excerpt":{"rendered":"<p>October 27\u201329, 2026 | Shenzhen, China SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition &amp; Convention Center. At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements. Exploring PCB [&hellip;]<\/p>","protected":false},"author":3,"featured_media":6566,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[392],"class_list":["post-6565","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-seprays-pcb-depaneling-machine","tag-nepcon-asia-2026"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>SEPRAYS at NEPCON ASIA 2026 | PCB Depaneling &amp; Automation<\/title>\n<meta name=\"description\" content=\"Meet SEPRAYS at NEPCON ASIA 2026 in Shenzhen, October 27\u201329. 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