{"id":2676,"date":"2025-09-08T02:02:31","date_gmt":"2025-09-08T02:02:31","guid":{"rendered":"https:\/\/seprays.com\/?post_type=product&p=2676"},"modified":"2026-08-25T09:37:39","modified_gmt":"2026-08-25T09:37:39","slug":"zam330at-330ad-online-laser-depaneling-machine-solution","status":"publish","type":"product","link":"https:\/\/seprays.com\/ko\/product\/zam330at-330ad-online-laser-depaneling-machine-solution\/","title":{"rendered":"ZAM330AT\/330AD In-Line PCB Laser Depaneling Machine"},"content":{"rendered":"\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Item<\/strong><\/td>\nZAM330AT<\/strong><\/td>\n<\/tr>\n
Data Processing Software<\/td>\nCircuitCAM7<\/td>\n<\/tr>\n
Operation Software<\/td>\nDreamCeaTor 3<\/td>\n<\/tr>\n
Laser Source<\/td>\nOptional UV \/ Green \/ Infrared, Picosecond \/ Nanosecond<\/td>\n<\/tr>\n
Max. Processing Area<\/td>\n300 mm \u00d7 300 mm (Dual Work Platforms)<\/td>\n<\/tr>\n
Scan Galvo<\/td>\nintelliSCAN + RTC5<\/td>\n<\/tr>\n
Telecentric Lens<\/td>\nWavelength-dependent<\/td>\n<\/tr>\n
Reflector<\/td>\nWavelength & Power-dependent<\/td>\n<\/tr>\n
\ubaa8<\/td>\nServo motor<\/td>\n<\/tr>\n
Motion Control Card<\/td>\nGTS-400<\/td>\n<\/tr>\n
CCD Light Source<\/td>\nRing light<\/td>\n<\/tr>\n
Industrial PC<\/td>\nCPU: i5, Memory: 4G DDR3, HDD: 1TB<\/td>\n<\/tr>\n
Display<\/td>\n17-inch LCD<\/td>\n<\/tr>\n
Platform Structure<\/td>\nGranite<\/td>\n<\/tr>\n
Dimensions (W \u00d7 H \u00d7 D)<\/td>\n1620 mm \u00d7 1770 mm \u00d7 2250 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

High-Precision PCB Laser Depaneling<\/strong><\/span><\/h3>\n

The ZAM330AT\/330AD is an in-line PCB laser depaneling solution designed for manufacturers that require precise, low-stress, and repeatable PCB separation.<\/p>\n

Unlike mechanical depaneling methods that rely on physical contact with the board, laser depaneling uses a controlled non-contact cutting process. This makes it particularly suitable for high-density PCBs, thin or sensitive substrates, complex board outlines, and applications where components are positioned close to the cutting path.<\/p>\n

The ZAM330AT\/330AD combines precision laser processing with automated positioning and in-line production integration, helping electronics manufacturers reduce manual handling while maintaining consistent cutting quality.<\/p>\n

\"ZAM330AT\"<\/p>\n

Why Choose Laser Depaneling?<\/strong><\/span><\/h3>\n

Laser depaneling is particularly valuable when mechanical cutting may create unwanted stress or when PCB designs require highly precise cutting paths.<\/p>\n

Compared with mechanical PCB routing or V-groove separation, laser processing provides a non-contact cutting method that can be advantageous for sensitive, thin, high-density, and complex PCB designs.<\/p>\n

Key advantages include:<\/p>\n