![\"ZAM300AT\/330AT\/330AD](\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/09\/8\u670825\u65e53-1.gif\")
<\/p>\n
Why Choose the ZAM300AT\/330AT\/330AD?<\/strong><\/span><\/h3>\nNon-Contact Processing<\/strong><\/span><\/h4>\nNo mechanical cutting tool directly contacts the PCB during laser separation.<\/p>\n
Reduced Mechanical Stress<\/strong><\/span><\/h4>\nHelps reduce stress-related risks for sensitive components and electronic assemblies.<\/p>\n
Precision Cutting<\/strong><\/span><\/h4>\nSupports detailed cutting paths and complex PCB outlines.<\/p>\n
Consistent Results<\/strong><\/span><\/h4>\nControlled laser processing helps maintain repeatable cutting quality.<\/p>\n
Automated Production<\/strong><\/span><\/h4>\nIn-line integration helps reduce manual handling in PCBA manufacturing.<\/p>\n
![\"Why](\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\")
<\/p>\n
ZAM300AT\/330AT\/330AD<\/strong> Technical Specifications<\/strong><\/span><\/h3>\n\n\n\n\u041f\u0440\u0435\u0434\u043c\u0435\u0442<\/strong><\/td>\nZAM300AT<\/strong><\/td>\nZAM330AT<\/strong><\/td>\nZAM330AD<\/strong><\/td>\n<\/tr>\n\nValid cutting area
\n<\/strong><\/td>\n350*350mm(Double platforms)<\/td>\n 300*300mm(Double platforms)
\n<\/strong><\/td>\n<\/tr>\n\n\u041f\u0440\u043e\u0433\u0440\u0430\u043c\u043c\u043d\u043e\u0435 \u043e\u0431\u0435\u0441\u043f\u0435\u0447\u0435\u043d\u0438\u0435 \u0434\u043b\u044f \u043e\u0431\u0440\u0430\u0431\u043e\u0442\u043a\u0438 \u0434\u0430\u043d\u043d\u044b\u0445<\/td>\n CircuitCAM 7.5<\/td>\n<\/tr>\n \nOperation System<\/td>\n Windows10 Operation Interface (Chinese)<\/td>\n<\/tr>\n \nLaser Source<\/td>\n Optional: Green\/UV Laser, PS\/NS<\/td>\n<\/tr>\n \nMachine precision<\/td>\n +20um<\/td>\n<\/tr>\n \nRepeat precision<\/td>\n +3um<\/td>\n +2um<\/td>\n<\/tr>\n \nX\/Y axis resolution<\/td>\n +1um<\/td>\n<\/tr>\n \nReceive data format<\/td>\n Gerber, HPGL,Sieb&Meier,Excellon,ODB++<\/td>\n<\/tr>\n \nWavelength<\/td>\n 355nm\/532nm<\/td>\n<\/tr>\n \nLaser power<\/td>\n Laser related<\/td>\n<\/tr>\n \nEquipment driver software<\/td>\n \u0421\u043e\u0437\u0434\u0430\u0442\u0435\u043b\u044c \u043c\u0435\u0447\u0442\u044b<\/td>\n<\/tr>\n \nCCD Camera<\/td>\n 1.6 million-pixel industrial camera<\/td>\n<\/tr>\n \nAutomatic load&unload system<\/td>\n Standard<\/td>\n<\/tr>\n \nLaser height sensor<\/td>\n Option<\/td>\n<\/tr>\n \nCamera target alignment system<\/td>\n Standard<\/td>\n<\/tr>\n \nIndustrial vacuum system<\/td>\n Option<\/td>\n<\/tr>\n \nEnvironment temperature<\/td>\n 22\u00b0C\u00b12\u00b0C(71.6\u00b0F\u00b12\u00b0F)<\/td>\n<\/tr>\n \n\u0422\u0440\u0435\u0431\u0443\u0435\u043c\u043e\u0435 \u043d\u0430\u043f\u0440\u044f\u0436\u0435\u043d\u0438\u0435 \/ \u041c\u043e\u0449\u043d\u043e\u0441\u0442\u044c<\/td>\n 3x3800V+N+PE, 50Hz (voltage regulator optional for specific voltages)<\/td>\n<\/tr>\n \nDimensions (W \u00d7 H \u00d7 D)<\/td>\n 940x 1720x1650mm<\/td>\n 1750x 2320x1769mm<\/td>\n<\/tr>\n \n\u0412\u0435\u0441<\/td>\n 1500kg<\/td>\n 1350kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\nPrecision Laser Cutting for Complex PCB Designs<\/strong><\/span><\/h3>\nDifferent PCB materials and cutting requirements call for different laser configurations.<\/p>\n
The ZAM series supports UV and CO\u2082 laser options, depending on the application.<\/p>\n
With UV laser processing, the cutting width can be as fine as 25\u201340 \u03bcm<\/strong>, subject to material and process conditions.<\/p>\nThe system can be evaluated for applications involving copper, resin, ceramic, and RF materials.<\/p>\n
Actual cutting quality depends on material composition, thickness, geometry, and selected laser configuration.<\/p>\n
For demanding applications, share your PCB drawing and material specifications for evaluation.<\/p>\n
<\/p>\n
Built for Automated PCBA Production<\/strong><\/span><\/h3>\nThe ZAM300AT\/330AT\/330AD is designed for in-line PCB laser depaneling.<\/p>\n
It can be configured for automated loading and unloading with robotic handling.<\/p>\n
Dual worktables support continuous processing workflows.<\/p>\n
CCD vision positioning and height measurement help align the PCB before cutting.<\/p>\n
MES integration is available for production data tracking and quality management.<\/p>\n
The final configuration depends on your production line, PCB dimensions, and automation requirements.<\/p>\n
<\/p>\n
Applications of <\/strong><\/span>ZAM300AT\/330AT\/330AD<\/strong><\/span><\/h3>\nThe ZAM series can be evaluated for applications that require precise cutting and reduced mechanical stress.<\/p>\n
PCBA Depaneling<\/strong><\/p>\nFor separating individual boards from a PCB panel.<\/p>\n
FPC Outline Cutting<\/strong><\/p>\nFor suitable flexible printed circuit materials and geometries.<\/p>\n
Coverlay Window Opening<\/strong><\/p>\nFor selected flexible circuit processing applications.<\/p>\n
Gold Finger Cutting<\/strong><\/p>\nFor suitable board designs and defined cutting requirements.<\/p>\n
Advanced Materials<\/strong><\/p>\nPotential applications include LCP, MPI, PI, PET, FR4, FR5, CEM, and HTCC\/LTCC ceramics.<\/p>\n
Material compatibility and cutting quality should be confirmed through application testing.<\/p>\n
<\/p>\n
Is Laser Depaneling Right for Your PCB?<\/h2>\n
Laser depaneling may be suitable if your production involves:<\/p>\n
\n- Components placed close to the PCB edge<\/li>\n
- Thin or fragile substrates<\/li>\n
- High-density PCB layouts<\/li>\n
- Complex or irregular cutting paths<\/li>\n
- Strict cutting precision requirements<\/li>\n
- Sensitive assemblies where mechanical stress is a concern<\/li>\n
- Automated in-line production<\/li>\n<\/ul>\n
For conventional PCB designs with less demanding cutting requirements, PCB routing or V-groove separation may be more economical.<\/p>\n
The right method depends on PCB design, material, production volume, edge quality, and process requirements.<\/p>\n
Not sure which method fits your application?<\/strong><\/p>\nSend us your PCB drawing and material details. Our team can help evaluate the suitable depaneling method and machine configuration.<\/p>\n
<\/p>\n
Why Choose Seprays?<\/strong><\/span><\/h3>\nChoosing a laser depaneling machine involves more than cutting precision.<\/p>\n
You also need to consider application suitability, automation requirements, production stability, and long-term support.<\/p>\n
Seprays provides PCB depaneling equipment and automation solutions for different electronics manufacturing applications.<\/p>\n
\n- 30+ years<\/strong> of PCB depaneling experience<\/li>\n
- 26,000 m\u00b2<\/strong> manufacturing base<\/li>\n
- 100+ patents<\/strong><\/li>\n
- Customers and markets across 31 overseas markets<\/strong><\/li>\n<\/ul>\n
Our team can help assess your PCB requirements and discuss a suitable laser depaneling solution.<\/p>\n
<\/p>\n
Get a Quote for Your PCB Laser Depaneling Project<\/span><\/h3>\nLooking for an in-line PCB laser depaneling machine?<\/p>\n
Tell us about your PCB design and production requirements. We can help evaluate the appropriate model and configuration.<\/p>\n
To speed up the evaluation, please share:<\/p>\n
\n- PCB or FPC drawing<\/li>\n
- Material type and thickness<\/li>\n
- Panel dimensions<\/li>\n
- Cutting path and quality requirements<\/li>\n
- Expected production volume<\/li>\n
- Automation or MES integration requirements<\/li>\n<\/ul>\n
Send us your PCB drawing for an application review.<\/strong><\/p>\n\u0412\u043e\u043f\u0440\u043e\u0441\u044b \u0438 \u043e\u0442\u0432\u0435\u0442\u044b<\/strong><\/span><\/h3>\n1. How do I choose the right laser power for my PCB?<\/strong><\/p>\nThe required laser power depends on the PCB material, thickness, cutting path, and required processing speed. Our team can evaluate these factors before recommending a configuration.<\/p>\n
2. Can I send PCB samples for a cutting test before placing an order?<\/strong><\/p>\nYes. You can provide PCB samples or drawings for an application evaluation. Sample testing can help verify cutting quality and processing suitability before you make a purchasing decision.<\/p>\n
3. Can the machine be customized for my existing production line?<\/strong><\/p>\nThe machine configuration can be evaluated according to your production line layout, transfer height, loading and unloading method, and communication requirements. Please share your current line layout if customization is needed.<\/p>\n
4. What is the expected processing speed for my PCB?<\/strong><\/p>\nProcessing speed depends on the cutting path, material, thickness, laser settings, and board complexity. We recommend evaluating your actual PCB design to estimate cycle time more accurately.<\/p>\n
5. What training and after-sales support are available?<\/strong><\/p>\nAvailable support can be discussed according to the purchase configuration and installation arrangement. Please contact our team to confirm operator training, technical assistance, maintenance guidance, and service options for your location.<\/p>","protected":false},"excerpt":{"rendered":"
\u0412 ZAM300AT\/330AT\/330AD In-Line PCB Laser Depaneling Machine<\/strong> is designed for high-precision PCB and FPC processing. It uses non-contact laser cutting to reduce mechanical stress and handle complex cutting paths.<\/p>\nSuitable for sensitive electronic assemblies and automated PCBA production lines.<\/p>\n
Laser Options:<\/strong> UV \/ CO\u2082
\nUV Laser Cutting Width:<\/strong> 25\u201340 \u03bcm
\nCutting Method:<\/strong> Non-contact laser cutting
\nPositioning:<\/strong> CCD vision and height measurement
\nAutomation:<\/strong> In-line processing with optional automated loading and unloading
\nApplications:<\/strong> PCB depaneling, FPC cutting, coverlay window opening<\/p>\n[Get a Quote] [Request Sample Test] [Talk to an Engineer]<\/strong><\/p>","protected":false},"featured_media":4935,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[24],"product_tag":[372,371],"class_list":{"0":"post-2676","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-pcb-laser-depaneling","7":"product_tag-pcb-laser-depaneling","8":"product_tag-zam330at","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"yoast_head":"\nZAM330AT PCB Laser Depaneling: Powerful Precision<\/title>\n<meta name=\"description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link 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No mechanical cutting tool directly contacts the PCB during laser separation.<\/p>\n
Reduced Mechanical Stress<\/strong><\/span><\/h4>\nHelps reduce stress-related risks for sensitive components and electronic assemblies.<\/p>\n
Precision Cutting<\/strong><\/span><\/h4>\nSupports detailed cutting paths and complex PCB outlines.<\/p>\n
Consistent Results<\/strong><\/span><\/h4>\nControlled laser processing helps maintain repeatable cutting quality.<\/p>\n
Automated Production<\/strong><\/span><\/h4>\nIn-line integration helps reduce manual handling in PCBA manufacturing.<\/p>\n
<\/p>\n
ZAM300AT\/330AT\/330AD<\/strong> Technical Specifications<\/strong><\/span><\/h3>\n\n\n\n\u041f\u0440\u0435\u0434\u043c\u0435\u0442<\/strong><\/td>\nZAM300AT<\/strong><\/td>\nZAM330AT<\/strong><\/td>\nZAM330AD<\/strong><\/td>\n<\/tr>\n\nValid cutting area
\n<\/strong><\/td>\n350*350mm(Double platforms)<\/td>\n 300*300mm(Double platforms)
\n<\/strong><\/td>\n<\/tr>\n\n\u041f\u0440\u043e\u0433\u0440\u0430\u043c\u043c\u043d\u043e\u0435 \u043e\u0431\u0435\u0441\u043f\u0435\u0447\u0435\u043d\u0438\u0435 \u0434\u043b\u044f \u043e\u0431\u0440\u0430\u0431\u043e\u0442\u043a\u0438 \u0434\u0430\u043d\u043d\u044b\u0445<\/td>\n CircuitCAM 7.5<\/td>\n<\/tr>\n \nOperation System<\/td>\n Windows10 Operation Interface (Chinese)<\/td>\n<\/tr>\n \nLaser Source<\/td>\n Optional: Green\/UV Laser, PS\/NS<\/td>\n<\/tr>\n \nMachine precision<\/td>\n +20um<\/td>\n<\/tr>\n \nRepeat precision<\/td>\n +3um<\/td>\n +2um<\/td>\n<\/tr>\n \nX\/Y axis resolution<\/td>\n +1um<\/td>\n<\/tr>\n \nReceive data format<\/td>\n Gerber, HPGL,Sieb&Meier,Excellon,ODB++<\/td>\n<\/tr>\n \nWavelength<\/td>\n 355nm\/532nm<\/td>\n<\/tr>\n \nLaser power<\/td>\n Laser related<\/td>\n<\/tr>\n \nEquipment driver software<\/td>\n \u0421\u043e\u0437\u0434\u0430\u0442\u0435\u043b\u044c \u043c\u0435\u0447\u0442\u044b<\/td>\n<\/tr>\n \nCCD Camera<\/td>\n 1.6 million-pixel industrial camera<\/td>\n<\/tr>\n \nAutomatic load&unload system<\/td>\n Standard<\/td>\n<\/tr>\n \nLaser height sensor<\/td>\n Option<\/td>\n<\/tr>\n \nCamera target alignment system<\/td>\n Standard<\/td>\n<\/tr>\n \nIndustrial vacuum system<\/td>\n Option<\/td>\n<\/tr>\n \nEnvironment temperature<\/td>\n 22\u00b0C\u00b12\u00b0C(71.6\u00b0F\u00b12\u00b0F)<\/td>\n<\/tr>\n \n\u0422\u0440\u0435\u0431\u0443\u0435\u043c\u043e\u0435 \u043d\u0430\u043f\u0440\u044f\u0436\u0435\u043d\u0438\u0435 \/ \u041c\u043e\u0449\u043d\u043e\u0441\u0442\u044c<\/td>\n 3x3800V+N+PE, 50Hz (voltage regulator optional for specific voltages)<\/td>\n<\/tr>\n \nDimensions (W \u00d7 H \u00d7 D)<\/td>\n 940x 1720x1650mm<\/td>\n 1750x 2320x1769mm<\/td>\n<\/tr>\n \n\u0412\u0435\u0441<\/td>\n 1500kg<\/td>\n 1350kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\nPrecision Laser Cutting for Complex PCB Designs<\/strong><\/span><\/h3>\nDifferent PCB materials and cutting requirements call for different laser configurations.<\/p>\n
The ZAM series supports UV and CO\u2082 laser options, depending on the application.<\/p>\n
With UV laser processing, the cutting width can be as fine as 25\u201340 \u03bcm<\/strong>, subject to material and process conditions.<\/p>\nThe system can be evaluated for applications involving copper, resin, ceramic, and RF materials.<\/p>\n
Actual cutting quality depends on material composition, thickness, geometry, and selected laser configuration.<\/p>\n
For demanding applications, share your PCB drawing and material specifications for evaluation.<\/p>\n
<\/p>\n
Built for Automated PCBA Production<\/strong><\/span><\/h3>\nThe ZAM300AT\/330AT\/330AD is designed for in-line PCB laser depaneling.<\/p>\n
It can be configured for automated loading and unloading with robotic handling.<\/p>\n
Dual worktables support continuous processing workflows.<\/p>\n
CCD vision positioning and height measurement help align the PCB before cutting.<\/p>\n
MES integration is available for production data tracking and quality management.<\/p>\n
The final configuration depends on your production line, PCB dimensions, and automation requirements.<\/p>\n
<\/p>\n
Applications of <\/strong><\/span>ZAM300AT\/330AT\/330AD<\/strong><\/span><\/h3>\nThe ZAM series can be evaluated for applications that require precise cutting and reduced mechanical stress.<\/p>\n
PCBA Depaneling<\/strong><\/p>\nFor separating individual boards from a PCB panel.<\/p>\n
FPC Outline Cutting<\/strong><\/p>\nFor suitable flexible printed circuit materials and geometries.<\/p>\n
Coverlay Window Opening<\/strong><\/p>\nFor selected flexible circuit processing applications.<\/p>\n
Gold Finger Cutting<\/strong><\/p>\nFor suitable board designs and defined cutting requirements.<\/p>\n
Advanced Materials<\/strong><\/p>\nPotential applications include LCP, MPI, PI, PET, FR4, FR5, CEM, and HTCC\/LTCC ceramics.<\/p>\n
Material compatibility and cutting quality should be confirmed through application testing.<\/p>\n
<\/p>\n
Is Laser Depaneling Right for Your PCB?<\/h2>\n
Laser depaneling may be suitable if your production involves:<\/p>\n
\n- Components placed close to the PCB edge<\/li>\n
- Thin or fragile substrates<\/li>\n
- High-density PCB layouts<\/li>\n
- Complex or irregular cutting paths<\/li>\n
- Strict cutting precision requirements<\/li>\n
- Sensitive assemblies where mechanical stress is a concern<\/li>\n
- Automated in-line production<\/li>\n<\/ul>\n
For conventional PCB designs with less demanding cutting requirements, PCB routing or V-groove separation may be more economical.<\/p>\n
The right method depends on PCB design, material, production volume, edge quality, and process requirements.<\/p>\n
Not sure which method fits your application?<\/strong><\/p>\nSend us your PCB drawing and material details. Our team can help evaluate the suitable depaneling method and machine configuration.<\/p>\n
<\/p>\n
Why Choose Seprays?<\/strong><\/span><\/h3>\nChoosing a laser depaneling machine involves more than cutting precision.<\/p>\n
You also need to consider application suitability, automation requirements, production stability, and long-term support.<\/p>\n
Seprays provides PCB depaneling equipment and automation solutions for different electronics manufacturing applications.<\/p>\n
\n- 30+ years<\/strong> of PCB depaneling experience<\/li>\n
- 26,000 m\u00b2<\/strong> manufacturing base<\/li>\n
- 100+ patents<\/strong><\/li>\n
- Customers and markets across 31 overseas markets<\/strong><\/li>\n<\/ul>\n
Our team can help assess your PCB requirements and discuss a suitable laser depaneling solution.<\/p>\n
<\/p>\n
Get a Quote for Your PCB Laser Depaneling Project<\/span><\/h3>\nLooking for an in-line PCB laser depaneling machine?<\/p>\n
Tell us about your PCB design and production requirements. We can help evaluate the appropriate model and configuration.<\/p>\n
To speed up the evaluation, please share:<\/p>\n
\n- PCB or FPC drawing<\/li>\n
- Material type and thickness<\/li>\n
- Panel dimensions<\/li>\n
- Cutting path and quality requirements<\/li>\n
- Expected production volume<\/li>\n
- Automation or MES integration requirements<\/li>\n<\/ul>\n
Send us your PCB drawing for an application review.<\/strong><\/p>\n\u0412\u043e\u043f\u0440\u043e\u0441\u044b \u0438 \u043e\u0442\u0432\u0435\u0442\u044b<\/strong><\/span><\/h3>\n1. How do I choose the right laser power for my PCB?<\/strong><\/p>\nThe required laser power depends on the PCB material, thickness, cutting path, and required processing speed. Our team can evaluate these factors before recommending a configuration.<\/p>\n
2. Can I send PCB samples for a cutting test before placing an order?<\/strong><\/p>\nYes. You can provide PCB samples or drawings for an application evaluation. Sample testing can help verify cutting quality and processing suitability before you make a purchasing decision.<\/p>\n
3. Can the machine be customized for my existing production line?<\/strong><\/p>\nThe machine configuration can be evaluated according to your production line layout, transfer height, loading and unloading method, and communication requirements. Please share your current line layout if customization is needed.<\/p>\n
4. What is the expected processing speed for my PCB?<\/strong><\/p>\nProcessing speed depends on the cutting path, material, thickness, laser settings, and board complexity. We recommend evaluating your actual PCB design to estimate cycle time more accurately.<\/p>\n
5. What training and after-sales support are available?<\/strong><\/p>\nAvailable support can be discussed according to the purchase configuration and installation arrangement. Please contact our team to confirm operator training, technical assistance, maintenance guidance, and service options for your location.<\/p>","protected":false},"excerpt":{"rendered":"
\u0412 ZAM300AT\/330AT\/330AD In-Line PCB Laser Depaneling Machine<\/strong> is designed for high-precision PCB and FPC processing. It uses non-contact laser cutting to reduce mechanical stress and handle complex cutting paths.<\/p>\nSuitable for sensitive electronic assemblies and automated PCBA production lines.<\/p>\n
Laser Options:<\/strong> UV \/ CO\u2082
\nUV Laser Cutting Width:<\/strong> 25\u201340 \u03bcm
\nCutting Method:<\/strong> Non-contact laser cutting
\nPositioning:<\/strong> CCD vision and height measurement
\nAutomation:<\/strong> In-line processing with optional automated loading and unloading
\nApplications:<\/strong> PCB depaneling, FPC cutting, coverlay window opening<\/p>\n[Get a Quote] [Request Sample Test] [Talk to an Engineer]<\/strong><\/p>","protected":false},"featured_media":4935,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[24],"product_tag":[372,371],"class_list":{"0":"post-2676","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-pcb-laser-depaneling","7":"product_tag-pcb-laser-depaneling","8":"product_tag-zam330at","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"yoast_head":"\nZAM330AT PCB Laser Depaneling: Powerful Precision<\/title>\n<meta name=\"description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link 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Supports detailed cutting paths and complex PCB outlines.<\/p>\n
Consistent Results<\/strong><\/span><\/h4>\nControlled laser processing helps maintain repeatable cutting quality.<\/p>\n
Automated Production<\/strong><\/span><\/h4>\nIn-line integration helps reduce manual handling in PCBA manufacturing.<\/p>\n
<\/p>\n
ZAM300AT\/330AT\/330AD<\/strong> Technical Specifications<\/strong><\/span><\/h3>\n\n\n\n\u041f\u0440\u0435\u0434\u043c\u0435\u0442<\/strong><\/td>\nZAM300AT<\/strong><\/td>\nZAM330AT<\/strong><\/td>\nZAM330AD<\/strong><\/td>\n<\/tr>\n\nValid cutting area
\n<\/strong><\/td>\n350*350mm(Double platforms)<\/td>\n 300*300mm(Double platforms)
\n<\/strong><\/td>\n<\/tr>\n\n\u041f\u0440\u043e\u0433\u0440\u0430\u043c\u043c\u043d\u043e\u0435 \u043e\u0431\u0435\u0441\u043f\u0435\u0447\u0435\u043d\u0438\u0435 \u0434\u043b\u044f \u043e\u0431\u0440\u0430\u0431\u043e\u0442\u043a\u0438 \u0434\u0430\u043d\u043d\u044b\u0445<\/td>\n CircuitCAM 7.5<\/td>\n<\/tr>\n \nOperation System<\/td>\n Windows10 Operation Interface (Chinese)<\/td>\n<\/tr>\n \nLaser Source<\/td>\n Optional: Green\/UV Laser, PS\/NS<\/td>\n<\/tr>\n \nMachine precision<\/td>\n +20um<\/td>\n<\/tr>\n \nRepeat precision<\/td>\n +3um<\/td>\n +2um<\/td>\n<\/tr>\n \nX\/Y axis resolution<\/td>\n +1um<\/td>\n<\/tr>\n \nReceive data format<\/td>\n Gerber, HPGL,Sieb&Meier,Excellon,ODB++<\/td>\n<\/tr>\n \nWavelength<\/td>\n 355nm\/532nm<\/td>\n<\/tr>\n \nLaser power<\/td>\n Laser related<\/td>\n<\/tr>\n \nEquipment driver software<\/td>\n \u0421\u043e\u0437\u0434\u0430\u0442\u0435\u043b\u044c \u043c\u0435\u0447\u0442\u044b<\/td>\n<\/tr>\n \nCCD Camera<\/td>\n 1.6 million-pixel industrial camera<\/td>\n<\/tr>\n \nAutomatic load&unload system<\/td>\n Standard<\/td>\n<\/tr>\n \nLaser height sensor<\/td>\n Option<\/td>\n<\/tr>\n \nCamera target alignment system<\/td>\n Standard<\/td>\n<\/tr>\n \nIndustrial vacuum system<\/td>\n Option<\/td>\n<\/tr>\n \nEnvironment temperature<\/td>\n 22\u00b0C\u00b12\u00b0C(71.6\u00b0F\u00b12\u00b0F)<\/td>\n<\/tr>\n \n\u0422\u0440\u0435\u0431\u0443\u0435\u043c\u043e\u0435 \u043d\u0430\u043f\u0440\u044f\u0436\u0435\u043d\u0438\u0435 \/ \u041c\u043e\u0449\u043d\u043e\u0441\u0442\u044c<\/td>\n 3x3800V+N+PE, 50Hz (voltage regulator optional for specific voltages)<\/td>\n<\/tr>\n \nDimensions (W \u00d7 H \u00d7 D)<\/td>\n 940x 1720x1650mm<\/td>\n 1750x 2320x1769mm<\/td>\n<\/tr>\n \n\u0412\u0435\u0441<\/td>\n 1500kg<\/td>\n 1350kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\nPrecision Laser Cutting for Complex PCB Designs<\/strong><\/span><\/h3>\nDifferent PCB materials and cutting requirements call for different laser configurations.<\/p>\n
The ZAM series supports UV and CO\u2082 laser options, depending on the application.<\/p>\n
With UV laser processing, the cutting width can be as fine as 25\u201340 \u03bcm<\/strong>, subject to material and process conditions.<\/p>\nThe system can be evaluated for applications involving copper, resin, ceramic, and RF materials.<\/p>\n
Actual cutting quality depends on material composition, thickness, geometry, and selected laser configuration.<\/p>\n
For demanding applications, share your PCB drawing and material specifications for evaluation.<\/p>\n
<\/p>\n
Built for Automated PCBA Production<\/strong><\/span><\/h3>\nThe ZAM300AT\/330AT\/330AD is designed for in-line PCB laser depaneling.<\/p>\n
It can be configured for automated loading and unloading with robotic handling.<\/p>\n
Dual worktables support continuous processing workflows.<\/p>\n
CCD vision positioning and height measurement help align the PCB before cutting.<\/p>\n
MES integration is available for production data tracking and quality management.<\/p>\n
The final configuration depends on your production line, PCB dimensions, and automation requirements.<\/p>\n
<\/p>\n
Applications of <\/strong><\/span>ZAM300AT\/330AT\/330AD<\/strong><\/span><\/h3>\nThe ZAM series can be evaluated for applications that require precise cutting and reduced mechanical stress.<\/p>\n
PCBA Depaneling<\/strong><\/p>\nFor separating individual boards from a PCB panel.<\/p>\n
FPC Outline Cutting<\/strong><\/p>\nFor suitable flexible printed circuit materials and geometries.<\/p>\n
Coverlay Window Opening<\/strong><\/p>\nFor selected flexible circuit processing applications.<\/p>\n
Gold Finger Cutting<\/strong><\/p>\nFor suitable board designs and defined cutting requirements.<\/p>\n
Advanced Materials<\/strong><\/p>\nPotential applications include LCP, MPI, PI, PET, FR4, FR5, CEM, and HTCC\/LTCC ceramics.<\/p>\n
Material compatibility and cutting quality should be confirmed through application testing.<\/p>\n
<\/p>\n
Is Laser Depaneling Right for Your PCB?<\/h2>\n
Laser depaneling may be suitable if your production involves:<\/p>\n
\n- Components placed close to the PCB edge<\/li>\n
- Thin or fragile substrates<\/li>\n
- High-density PCB layouts<\/li>\n
- Complex or irregular cutting paths<\/li>\n
- Strict cutting precision requirements<\/li>\n
- Sensitive assemblies where mechanical stress is a concern<\/li>\n
- Automated in-line production<\/li>\n<\/ul>\n
For conventional PCB designs with less demanding cutting requirements, PCB routing or V-groove separation may be more economical.<\/p>\n
The right method depends on PCB design, material, production volume, edge quality, and process requirements.<\/p>\n
Not sure which method fits your application?<\/strong><\/p>\nSend us your PCB drawing and material details. Our team can help evaluate the suitable depaneling method and machine configuration.<\/p>\n
<\/p>\n
Why Choose Seprays?<\/strong><\/span><\/h3>\nChoosing a laser depaneling machine involves more than cutting precision.<\/p>\n
You also need to consider application suitability, automation requirements, production stability, and long-term support.<\/p>\n
Seprays provides PCB depaneling equipment and automation solutions for different electronics manufacturing applications.<\/p>\n
\n- 30+ years<\/strong> of PCB depaneling experience<\/li>\n
- 26,000 m\u00b2<\/strong> manufacturing base<\/li>\n
- 100+ patents<\/strong><\/li>\n
- Customers and markets across 31 overseas markets<\/strong><\/li>\n<\/ul>\n
Our team can help assess your PCB requirements and discuss a suitable laser depaneling solution.<\/p>\n
<\/p>\n
Get a Quote for Your PCB Laser Depaneling Project<\/span><\/h3>\nLooking for an in-line PCB laser depaneling machine?<\/p>\n
Tell us about your PCB design and production requirements. We can help evaluate the appropriate model and configuration.<\/p>\n
To speed up the evaluation, please share:<\/p>\n
\n- PCB or FPC drawing<\/li>\n
- Material type and thickness<\/li>\n
- Panel dimensions<\/li>\n
- Cutting path and quality requirements<\/li>\n
- Expected production volume<\/li>\n
- Automation or MES integration requirements<\/li>\n<\/ul>\n
Send us your PCB drawing for an application review.<\/strong><\/p>\n\u0412\u043e\u043f\u0440\u043e\u0441\u044b \u0438 \u043e\u0442\u0432\u0435\u0442\u044b<\/strong><\/span><\/h3>\n1. How do I choose the right laser power for my PCB?<\/strong><\/p>\nThe required laser power depends on the PCB material, thickness, cutting path, and required processing speed. Our team can evaluate these factors before recommending a configuration.<\/p>\n
2. Can I send PCB samples for a cutting test before placing an order?<\/strong><\/p>\nYes. You can provide PCB samples or drawings for an application evaluation. Sample testing can help verify cutting quality and processing suitability before you make a purchasing decision.<\/p>\n
3. Can the machine be customized for my existing production line?<\/strong><\/p>\nThe machine configuration can be evaluated according to your production line layout, transfer height, loading and unloading method, and communication requirements. Please share your current line layout if customization is needed.<\/p>\n
4. What is the expected processing speed for my PCB?<\/strong><\/p>\nProcessing speed depends on the cutting path, material, thickness, laser settings, and board complexity. We recommend evaluating your actual PCB design to estimate cycle time more accurately.<\/p>\n
5. What training and after-sales support are available?<\/strong><\/p>\nAvailable support can be discussed according to the purchase configuration and installation arrangement. Please contact our team to confirm operator training, technical assistance, maintenance guidance, and service options for your location.<\/p>","protected":false},"excerpt":{"rendered":"
\u0412 ZAM300AT\/330AT\/330AD In-Line PCB Laser Depaneling Machine<\/strong> is designed for high-precision PCB and FPC processing. It uses non-contact laser cutting to reduce mechanical stress and handle complex cutting paths.<\/p>\nSuitable for sensitive electronic assemblies and automated PCBA production lines.<\/p>\n
Laser Options:<\/strong> UV \/ CO\u2082
\nUV Laser Cutting Width:<\/strong> 25\u201340 \u03bcm
\nCutting Method:<\/strong> Non-contact laser cutting
\nPositioning:<\/strong> CCD vision and height measurement
\nAutomation:<\/strong> In-line processing with optional automated loading and unloading
\nApplications:<\/strong> PCB depaneling, FPC cutting, coverlay window opening<\/p>\n[Get a Quote] [Request Sample Test] [Talk to an Engineer]<\/strong><\/p>","protected":false},"featured_media":4935,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[24],"product_tag":[372,371],"class_list":{"0":"post-2676","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-pcb-laser-depaneling","7":"product_tag-pcb-laser-depaneling","8":"product_tag-zam330at","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"yoast_head":"\nZAM330AT PCB Laser Depaneling: Powerful Precision<\/title>\n<meta name=\"description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link 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In-line integration helps reduce manual handling in PCBA manufacturing.<\/p>\n
![\"Why](\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/08\/Laser-processing-advantages-1024x574.jpg\")
<\/p>\n
ZAM300AT\/330AT\/330AD<\/strong> Technical Specifications<\/strong><\/span><\/h3>\n\n\n\n\u041f\u0440\u0435\u0434\u043c\u0435\u0442<\/strong><\/td>\nZAM300AT<\/strong><\/td>\nZAM330AT<\/strong><\/td>\nZAM330AD<\/strong><\/td>\n<\/tr>\n\nValid cutting area
\n<\/strong><\/td>\n350*350mm(Double platforms)<\/td>\n 300*300mm(Double platforms)
\n<\/strong><\/td>\n<\/tr>\n\n\u041f\u0440\u043e\u0433\u0440\u0430\u043c\u043c\u043d\u043e\u0435 \u043e\u0431\u0435\u0441\u043f\u0435\u0447\u0435\u043d\u0438\u0435 \u0434\u043b\u044f \u043e\u0431\u0440\u0430\u0431\u043e\u0442\u043a\u0438 \u0434\u0430\u043d\u043d\u044b\u0445<\/td>\n CircuitCAM 7.5<\/td>\n<\/tr>\n \nOperation System<\/td>\n Windows10 Operation Interface (Chinese)<\/td>\n<\/tr>\n \nLaser Source<\/td>\n Optional: Green\/UV Laser, PS\/NS<\/td>\n<\/tr>\n \nMachine precision<\/td>\n +20um<\/td>\n<\/tr>\n \nRepeat precision<\/td>\n +3um<\/td>\n +2um<\/td>\n<\/tr>\n \nX\/Y axis resolution<\/td>\n +1um<\/td>\n<\/tr>\n \nReceive data format<\/td>\n Gerber, HPGL,Sieb&Meier,Excellon,ODB++<\/td>\n<\/tr>\n \nWavelength<\/td>\n 355nm\/532nm<\/td>\n<\/tr>\n \nLaser power<\/td>\n Laser related<\/td>\n<\/tr>\n \nEquipment driver software<\/td>\n \u0421\u043e\u0437\u0434\u0430\u0442\u0435\u043b\u044c \u043c\u0435\u0447\u0442\u044b<\/td>\n<\/tr>\n \nCCD Camera<\/td>\n 1.6 million-pixel industrial camera<\/td>\n<\/tr>\n \nAutomatic load&unload system<\/td>\n Standard<\/td>\n<\/tr>\n \nLaser height sensor<\/td>\n Option<\/td>\n<\/tr>\n \nCamera target alignment system<\/td>\n Standard<\/td>\n<\/tr>\n \nIndustrial vacuum system<\/td>\n Option<\/td>\n<\/tr>\n \nEnvironment temperature<\/td>\n 22\u00b0C\u00b12\u00b0C(71.6\u00b0F\u00b12\u00b0F)<\/td>\n<\/tr>\n \n\u0422\u0440\u0435\u0431\u0443\u0435\u043c\u043e\u0435 \u043d\u0430\u043f\u0440\u044f\u0436\u0435\u043d\u0438\u0435 \/ \u041c\u043e\u0449\u043d\u043e\u0441\u0442\u044c<\/td>\n 3x3800V+N+PE, 50Hz (voltage regulator optional for specific voltages)<\/td>\n<\/tr>\n \nDimensions (W \u00d7 H \u00d7 D)<\/td>\n 940x 1720x1650mm<\/td>\n 1750x 2320x1769mm<\/td>\n<\/tr>\n \n\u0412\u0435\u0441<\/td>\n 1500kg<\/td>\n 1350kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\nPrecision Laser Cutting for Complex PCB Designs<\/strong><\/span><\/h3>\nDifferent PCB materials and cutting requirements call for different laser configurations.<\/p>\n
The ZAM series supports UV and CO\u2082 laser options, depending on the application.<\/p>\n
With UV laser processing, the cutting width can be as fine as 25\u201340 \u03bcm<\/strong>, subject to material and process conditions.<\/p>\nThe system can be evaluated for applications involving copper, resin, ceramic, and RF materials.<\/p>\n
Actual cutting quality depends on material composition, thickness, geometry, and selected laser configuration.<\/p>\n
For demanding applications, share your PCB drawing and material specifications for evaluation.<\/p>\n
<\/p>\n
Built for Automated PCBA Production<\/strong><\/span><\/h3>\nThe ZAM300AT\/330AT\/330AD is designed for in-line PCB laser depaneling.<\/p>\n
It can be configured for automated loading and unloading with robotic handling.<\/p>\n
Dual worktables support continuous processing workflows.<\/p>\n
CCD vision positioning and height measurement help align the PCB before cutting.<\/p>\n
MES integration is available for production data tracking and quality management.<\/p>\n
The final configuration depends on your production line, PCB dimensions, and automation requirements.<\/p>\n
<\/p>\n
Applications of <\/strong><\/span>ZAM300AT\/330AT\/330AD<\/strong><\/span><\/h3>\nThe ZAM series can be evaluated for applications that require precise cutting and reduced mechanical stress.<\/p>\n
PCBA Depaneling<\/strong><\/p>\nFor separating individual boards from a PCB panel.<\/p>\n
FPC Outline Cutting<\/strong><\/p>\nFor suitable flexible printed circuit materials and geometries.<\/p>\n
Coverlay Window Opening<\/strong><\/p>\nFor selected flexible circuit processing applications.<\/p>\n
Gold Finger Cutting<\/strong><\/p>\nFor suitable board designs and defined cutting requirements.<\/p>\n
Advanced Materials<\/strong><\/p>\nPotential applications include LCP, MPI, PI, PET, FR4, FR5, CEM, and HTCC\/LTCC ceramics.<\/p>\n
Material compatibility and cutting quality should be confirmed through application testing.<\/p>\n
<\/p>\n
Is Laser Depaneling Right for Your PCB?<\/h2>\n
Laser depaneling may be suitable if your production involves:<\/p>\n
\n- Components placed close to the PCB edge<\/li>\n
- Thin or fragile substrates<\/li>\n
- High-density PCB layouts<\/li>\n
- Complex or irregular cutting paths<\/li>\n
- Strict cutting precision requirements<\/li>\n
- Sensitive assemblies where mechanical stress is a concern<\/li>\n
- Automated in-line production<\/li>\n<\/ul>\n
For conventional PCB designs with less demanding cutting requirements, PCB routing or V-groove separation may be more economical.<\/p>\n
The right method depends on PCB design, material, production volume, edge quality, and process requirements.<\/p>\n
Not sure which method fits your application?<\/strong><\/p>\nSend us your PCB drawing and material details. Our team can help evaluate the suitable depaneling method and machine configuration.<\/p>\n
<\/p>\n
Why Choose Seprays?<\/strong><\/span><\/h3>\nChoosing a laser depaneling machine involves more than cutting precision.<\/p>\n
You also need to consider application suitability, automation requirements, production stability, and long-term support.<\/p>\n
Seprays provides PCB depaneling equipment and automation solutions for different electronics manufacturing applications.<\/p>\n
\n- 30+ years<\/strong> of PCB depaneling experience<\/li>\n
- 26,000 m\u00b2<\/strong> manufacturing base<\/li>\n
- 100+ patents<\/strong><\/li>\n
- Customers and markets across 31 overseas markets<\/strong><\/li>\n<\/ul>\n
Our team can help assess your PCB requirements and discuss a suitable laser depaneling solution.<\/p>\n
<\/p>\n
Get a Quote for Your PCB Laser Depaneling Project<\/span><\/h3>\nLooking for an in-line PCB laser depaneling machine?<\/p>\n
Tell us about your PCB design and production requirements. We can help evaluate the appropriate model and configuration.<\/p>\n
To speed up the evaluation, please share:<\/p>\n
\n- PCB or FPC drawing<\/li>\n
- Material type and thickness<\/li>\n
- Panel dimensions<\/li>\n
- Cutting path and quality requirements<\/li>\n
- Expected production volume<\/li>\n
- Automation or MES integration requirements<\/li>\n<\/ul>\n
Send us your PCB drawing for an application review.<\/strong><\/p>\n\u0412\u043e\u043f\u0440\u043e\u0441\u044b \u0438 \u043e\u0442\u0432\u0435\u0442\u044b<\/strong><\/span><\/h3>\n1. How do I choose the right laser power for my PCB?<\/strong><\/p>\nThe required laser power depends on the PCB material, thickness, cutting path, and required processing speed. Our team can evaluate these factors before recommending a configuration.<\/p>\n
2. Can I send PCB samples for a cutting test before placing an order?<\/strong><\/p>\nYes. You can provide PCB samples or drawings for an application evaluation. Sample testing can help verify cutting quality and processing suitability before you make a purchasing decision.<\/p>\n
3. Can the machine be customized for my existing production line?<\/strong><\/p>\nThe machine configuration can be evaluated according to your production line layout, transfer height, loading and unloading method, and communication requirements. Please share your current line layout if customization is needed.<\/p>\n
4. What is the expected processing speed for my PCB?<\/strong><\/p>\nProcessing speed depends on the cutting path, material, thickness, laser settings, and board complexity. We recommend evaluating your actual PCB design to estimate cycle time more accurately.<\/p>\n
5. What training and after-sales support are available?<\/strong><\/p>\nAvailable support can be discussed according to the purchase configuration and installation arrangement. Please contact our team to confirm operator training, technical assistance, maintenance guidance, and service options for your location.<\/p>","protected":false},"excerpt":{"rendered":"
\u0412 ZAM300AT\/330AT\/330AD In-Line PCB Laser Depaneling Machine<\/strong> is designed for high-precision PCB and FPC processing. It uses non-contact laser cutting to reduce mechanical stress and handle complex cutting paths.<\/p>\nSuitable for sensitive electronic assemblies and automated PCBA production lines.<\/p>\n
Laser Options:<\/strong> UV \/ CO\u2082
\nUV Laser Cutting Width:<\/strong> 25\u201340 \u03bcm
\nCutting Method:<\/strong> Non-contact laser cutting
\nPositioning:<\/strong> CCD vision and height measurement
\nAutomation:<\/strong> In-line processing with optional automated loading and unloading
\nApplications:<\/strong> PCB depaneling, FPC cutting, coverlay window opening<\/p>\n[Get a Quote] [Request Sample Test] [Talk to an Engineer]<\/strong><\/p>","protected":false},"featured_media":4935,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[24],"product_tag":[372,371],"class_list":{"0":"post-2676","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-pcb-laser-depaneling","7":"product_tag-pcb-laser-depaneling","8":"product_tag-zam330at","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"yoast_head":"\nZAM330AT PCB Laser Depaneling: Powerful Precision<\/title>\n<meta name=\"description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/seprays.com\/ru\/product\/zam330at-330ad-online-laser-depaneling-machine-solution\/\" \/>\n<meta property=\"og:locale\" content=\"ru_RU\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ZAM330AT PCB Laser Depaneling: Powerful Precision\" \/>\n<meta property=\"og:description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/seprays.com\/ru\/product\/zam330at-330ad-online-laser-depaneling-machine-solution\/\" \/>\n<meta property=\"og:site_name\" content=\"Seprays\" \/>\n<meta property=\"article:modified_time\" content=\"2026-10-24T03:59:51+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/09\/ZAM330AT_.webp\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" 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\n<\/strong><\/td>\n
\n<\/strong><\/td>\n<\/tr>\n
Precision Laser Cutting for Complex PCB Designs<\/strong><\/span><\/h3>\nDifferent PCB materials and cutting requirements call for different laser configurations.<\/p>\n
The ZAM series supports UV and CO\u2082 laser options, depending on the application.<\/p>\n
With UV laser processing, the cutting width can be as fine as 25\u201340 \u03bcm<\/strong>, subject to material and process conditions.<\/p>\nThe system can be evaluated for applications involving copper, resin, ceramic, and RF materials.<\/p>\n
Actual cutting quality depends on material composition, thickness, geometry, and selected laser configuration.<\/p>\n
For demanding applications, share your PCB drawing and material specifications for evaluation.<\/p>\n
<\/p>\n
Built for Automated PCBA Production<\/strong><\/span><\/h3>\nThe ZAM300AT\/330AT\/330AD is designed for in-line PCB laser depaneling.<\/p>\n
It can be configured for automated loading and unloading with robotic handling.<\/p>\n
Dual worktables support continuous processing workflows.<\/p>\n
CCD vision positioning and height measurement help align the PCB before cutting.<\/p>\n
MES integration is available for production data tracking and quality management.<\/p>\n
The final configuration depends on your production line, PCB dimensions, and automation requirements.<\/p>\n
<\/p>\n
Applications of <\/strong><\/span>ZAM300AT\/330AT\/330AD<\/strong><\/span><\/h3>\nThe ZAM series can be evaluated for applications that require precise cutting and reduced mechanical stress.<\/p>\n
PCBA Depaneling<\/strong><\/p>\nFor separating individual boards from a PCB panel.<\/p>\n
FPC Outline Cutting<\/strong><\/p>\nFor suitable flexible printed circuit materials and geometries.<\/p>\n
Coverlay Window Opening<\/strong><\/p>\nFor selected flexible circuit processing applications.<\/p>\n
Gold Finger Cutting<\/strong><\/p>\nFor suitable board designs and defined cutting requirements.<\/p>\n
Advanced Materials<\/strong><\/p>\nPotential applications include LCP, MPI, PI, PET, FR4, FR5, CEM, and HTCC\/LTCC ceramics.<\/p>\n
Material compatibility and cutting quality should be confirmed through application testing.<\/p>\n
<\/p>\n
Is Laser Depaneling Right for Your PCB?<\/h2>\n
Laser depaneling may be suitable if your production involves:<\/p>\n
\n- Components placed close to the PCB edge<\/li>\n
- Thin or fragile substrates<\/li>\n
- High-density PCB layouts<\/li>\n
- Complex or irregular cutting paths<\/li>\n
- Strict cutting precision requirements<\/li>\n
- Sensitive assemblies where mechanical stress is a concern<\/li>\n
- Automated in-line production<\/li>\n<\/ul>\n
For conventional PCB designs with less demanding cutting requirements, PCB routing or V-groove separation may be more economical.<\/p>\n
The right method depends on PCB design, material, production volume, edge quality, and process requirements.<\/p>\n
Not sure which method fits your application?<\/strong><\/p>\nSend us your PCB drawing and material details. Our team can help evaluate the suitable depaneling method and machine configuration.<\/p>\n
<\/p>\n
Why Choose Seprays?<\/strong><\/span><\/h3>\nChoosing a laser depaneling machine involves more than cutting precision.<\/p>\n
You also need to consider application suitability, automation requirements, production stability, and long-term support.<\/p>\n
Seprays provides PCB depaneling equipment and automation solutions for different electronics manufacturing applications.<\/p>\n
\n- 30+ years<\/strong> of PCB depaneling experience<\/li>\n
- 26,000 m\u00b2<\/strong> manufacturing base<\/li>\n
- 100+ patents<\/strong><\/li>\n
- Customers and markets across 31 overseas markets<\/strong><\/li>\n<\/ul>\n
Our team can help assess your PCB requirements and discuss a suitable laser depaneling solution.<\/p>\n
<\/p>\n
Get a Quote for Your PCB Laser Depaneling Project<\/span><\/h3>\nLooking for an in-line PCB laser depaneling machine?<\/p>\n
Tell us about your PCB design and production requirements. We can help evaluate the appropriate model and configuration.<\/p>\n
To speed up the evaluation, please share:<\/p>\n
\n- PCB or FPC drawing<\/li>\n
- Material type and thickness<\/li>\n
- Panel dimensions<\/li>\n
- Cutting path and quality requirements<\/li>\n
- Expected production volume<\/li>\n
- Automation or MES integration requirements<\/li>\n<\/ul>\n
Send us your PCB drawing for an application review.<\/strong><\/p>\n\u0412\u043e\u043f\u0440\u043e\u0441\u044b \u0438 \u043e\u0442\u0432\u0435\u0442\u044b<\/strong><\/span><\/h3>\n1. How do I choose the right laser power for my PCB?<\/strong><\/p>\nThe required laser power depends on the PCB material, thickness, cutting path, and required processing speed. Our team can evaluate these factors before recommending a configuration.<\/p>\n
2. Can I send PCB samples for a cutting test before placing an order?<\/strong><\/p>\nYes. You can provide PCB samples or drawings for an application evaluation. Sample testing can help verify cutting quality and processing suitability before you make a purchasing decision.<\/p>\n
3. Can the machine be customized for my existing production line?<\/strong><\/p>\nThe machine configuration can be evaluated according to your production line layout, transfer height, loading and unloading method, and communication requirements. Please share your current line layout if customization is needed.<\/p>\n
4. What is the expected processing speed for my PCB?<\/strong><\/p>\nProcessing speed depends on the cutting path, material, thickness, laser settings, and board complexity. We recommend evaluating your actual PCB design to estimate cycle time more accurately.<\/p>\n
5. What training and after-sales support are available?<\/strong><\/p>\nAvailable support can be discussed according to the purchase configuration and installation arrangement. Please contact our team to confirm operator training, technical assistance, maintenance guidance, and service options for your location.<\/p>","protected":false},"excerpt":{"rendered":"
\u0412 ZAM300AT\/330AT\/330AD In-Line PCB Laser Depaneling Machine<\/strong> is designed for high-precision PCB and FPC processing. It uses non-contact laser cutting to reduce mechanical stress and handle complex cutting paths.<\/p>\nSuitable for sensitive electronic assemblies and automated PCBA production lines.<\/p>\n
Laser Options:<\/strong> UV \/ CO\u2082
\nUV Laser Cutting Width:<\/strong> 25\u201340 \u03bcm
\nCutting Method:<\/strong> Non-contact laser cutting
\nPositioning:<\/strong> CCD vision and height measurement
\nAutomation:<\/strong> In-line processing with optional automated loading and unloading
\nApplications:<\/strong> PCB depaneling, FPC cutting, coverlay window opening<\/p>\n[Get a Quote] [Request Sample Test] [Talk to an Engineer]<\/strong><\/p>","protected":false},"featured_media":4935,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[24],"product_tag":[372,371],"class_list":{"0":"post-2676","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-pcb-laser-depaneling","7":"product_tag-pcb-laser-depaneling","8":"product_tag-zam330at","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"yoast_head":"\nZAM330AT PCB Laser Depaneling: Powerful Precision<\/title>\n<meta name=\"description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/seprays.com\/ru\/product\/zam330at-330ad-online-laser-depaneling-machine-solution\/\" \/>\n<meta property=\"og:locale\" content=\"ru_RU\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ZAM330AT PCB Laser Depaneling: Powerful Precision\" \/>\n<meta property=\"og:description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/seprays.com\/ru\/product\/zam330at-330ad-online-laser-depaneling-machine-solution\/\" \/>\n<meta property=\"og:site_name\" content=\"Seprays\" \/>\n<meta property=\"article:modified_time\" content=\"2026-10-24T03:59:51+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/09\/ZAM330AT_.webp\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" 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The system can be evaluated for applications involving copper, resin, ceramic, and RF materials.<\/p>\n
Actual cutting quality depends on material composition, thickness, geometry, and selected laser configuration.<\/p>\n
For demanding applications, share your PCB drawing and material specifications for evaluation.<\/p>\n
![\"Precision](\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/09\/Comparison-of-panel-cutting.jpg\")
<\/p>\n
Built for Automated PCBA Production<\/strong><\/span><\/h3>\nThe ZAM300AT\/330AT\/330AD is designed for in-line PCB laser depaneling.<\/p>\n
It can be configured for automated loading and unloading with robotic handling.<\/p>\n
Dual worktables support continuous processing workflows.<\/p>\n
CCD vision positioning and height measurement help align the PCB before cutting.<\/p>\n
MES integration is available for production data tracking and quality management.<\/p>\n
The final configuration depends on your production line, PCB dimensions, and automation requirements.<\/p>\n
<\/p>\n
Applications of <\/strong><\/span>ZAM300AT\/330AT\/330AD<\/strong><\/span><\/h3>\nThe ZAM series can be evaluated for applications that require precise cutting and reduced mechanical stress.<\/p>\n
PCBA Depaneling<\/strong><\/p>\nFor separating individual boards from a PCB panel.<\/p>\n
FPC Outline Cutting<\/strong><\/p>\nFor suitable flexible printed circuit materials and geometries.<\/p>\n
Coverlay Window Opening<\/strong><\/p>\nFor selected flexible circuit processing applications.<\/p>\n
Gold Finger Cutting<\/strong><\/p>\nFor suitable board designs and defined cutting requirements.<\/p>\n
Advanced Materials<\/strong><\/p>\nPotential applications include LCP, MPI, PI, PET, FR4, FR5, CEM, and HTCC\/LTCC ceramics.<\/p>\n
Material compatibility and cutting quality should be confirmed through application testing.<\/p>\n
<\/p>\n
Is Laser Depaneling Right for Your PCB?<\/h2>\n
Laser depaneling may be suitable if your production involves:<\/p>\n
\n- Components placed close to the PCB edge<\/li>\n
- Thin or fragile substrates<\/li>\n
- High-density PCB layouts<\/li>\n
- Complex or irregular cutting paths<\/li>\n
- Strict cutting precision requirements<\/li>\n
- Sensitive assemblies where mechanical stress is a concern<\/li>\n
- Automated in-line production<\/li>\n<\/ul>\n
For conventional PCB designs with less demanding cutting requirements, PCB routing or V-groove separation may be more economical.<\/p>\n
The right method depends on PCB design, material, production volume, edge quality, and process requirements.<\/p>\n
Not sure which method fits your application?<\/strong><\/p>\nSend us your PCB drawing and material details. Our team can help evaluate the suitable depaneling method and machine configuration.<\/p>\n
<\/p>\n
Why Choose Seprays?<\/strong><\/span><\/h3>\nChoosing a laser depaneling machine involves more than cutting precision.<\/p>\n
You also need to consider application suitability, automation requirements, production stability, and long-term support.<\/p>\n
Seprays provides PCB depaneling equipment and automation solutions for different electronics manufacturing applications.<\/p>\n
\n- 30+ years<\/strong> of PCB depaneling experience<\/li>\n
- 26,000 m\u00b2<\/strong> manufacturing base<\/li>\n
- 100+ patents<\/strong><\/li>\n
- Customers and markets across 31 overseas markets<\/strong><\/li>\n<\/ul>\n
Our team can help assess your PCB requirements and discuss a suitable laser depaneling solution.<\/p>\n
<\/p>\n
Get a Quote for Your PCB Laser Depaneling Project<\/span><\/h3>\nLooking for an in-line PCB laser depaneling machine?<\/p>\n
Tell us about your PCB design and production requirements. We can help evaluate the appropriate model and configuration.<\/p>\n
To speed up the evaluation, please share:<\/p>\n
\n- PCB or FPC drawing<\/li>\n
- Material type and thickness<\/li>\n
- Panel dimensions<\/li>\n
- Cutting path and quality requirements<\/li>\n
- Expected production volume<\/li>\n
- Automation or MES integration requirements<\/li>\n<\/ul>\n
Send us your PCB drawing for an application review.<\/strong><\/p>\n\u0412\u043e\u043f\u0440\u043e\u0441\u044b \u0438 \u043e\u0442\u0432\u0435\u0442\u044b<\/strong><\/span><\/h3>\n1. How do I choose the right laser power for my PCB?<\/strong><\/p>\nThe required laser power depends on the PCB material, thickness, cutting path, and required processing speed. Our team can evaluate these factors before recommending a configuration.<\/p>\n
2. Can I send PCB samples for a cutting test before placing an order?<\/strong><\/p>\nYes. You can provide PCB samples or drawings for an application evaluation. Sample testing can help verify cutting quality and processing suitability before you make a purchasing decision.<\/p>\n
3. Can the machine be customized for my existing production line?<\/strong><\/p>\nThe machine configuration can be evaluated according to your production line layout, transfer height, loading and unloading method, and communication requirements. Please share your current line layout if customization is needed.<\/p>\n
4. What is the expected processing speed for my PCB?<\/strong><\/p>\nProcessing speed depends on the cutting path, material, thickness, laser settings, and board complexity. We recommend evaluating your actual PCB design to estimate cycle time more accurately.<\/p>\n
5. What training and after-sales support are available?<\/strong><\/p>\nAvailable support can be discussed according to the purchase configuration and installation arrangement. Please contact our team to confirm operator training, technical assistance, maintenance guidance, and service options for your location.<\/p>","protected":false},"excerpt":{"rendered":"
\u0412 ZAM300AT\/330AT\/330AD In-Line PCB Laser Depaneling Machine<\/strong> is designed for high-precision PCB and FPC processing. It uses non-contact laser cutting to reduce mechanical stress and handle complex cutting paths.<\/p>\nSuitable for sensitive electronic assemblies and automated PCBA production lines.<\/p>\n
Laser Options:<\/strong> UV \/ CO\u2082
\nUV Laser Cutting Width:<\/strong> 25\u201340 \u03bcm
\nCutting Method:<\/strong> Non-contact laser cutting
\nPositioning:<\/strong> CCD vision and height measurement
\nAutomation:<\/strong> In-line processing with optional automated loading and unloading
\nApplications:<\/strong> PCB depaneling, FPC cutting, coverlay window opening<\/p>\n[Get a Quote] [Request Sample Test] [Talk to an Engineer]<\/strong><\/p>","protected":false},"featured_media":4935,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[24],"product_tag":[372,371],"class_list":{"0":"post-2676","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-pcb-laser-depaneling","7":"product_tag-pcb-laser-depaneling","8":"product_tag-zam330at","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"yoast_head":"\nZAM330AT PCB Laser Depaneling: Powerful Precision<\/title>\n<meta name=\"description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/seprays.com\/ru\/product\/zam330at-330ad-online-laser-depaneling-machine-solution\/\" \/>\n<meta property=\"og:locale\" content=\"ru_RU\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ZAM330AT PCB Laser Depaneling: Powerful Precision\" \/>\n<meta property=\"og:description\" content=\"ZAM330AT\/330AD delivers precise inline PCB laser depaneling with low mechanical stress for efficient, reliable PCBA production.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/seprays.com\/ru\/product\/zam330at-330ad-online-laser-depaneling-machine-solution\/\" \/>\n<meta property=\"og:site_name\" content=\"Seprays\" \/>\n<meta property=\"article:modified_time\" content=\"2026-10-24T03:59:51+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/09\/ZAM330AT_.webp\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" 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![\"Built](\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/09\/Laser_Depaneling___Precision_for_Sensitive_Designs.webp\")
<\/p>\nThe ZAM series can be evaluated for applications that require precise cutting and reduced mechanical stress.<\/p>\n
PCBA Depaneling<\/strong><\/p>\n For separating individual boards from a PCB panel.<\/p>\n FPC Outline Cutting<\/strong><\/p>\n For suitable flexible printed circuit materials and geometries.<\/p>\n Coverlay Window Opening<\/strong><\/p>\n For selected flexible circuit processing applications.<\/p>\n Gold Finger Cutting<\/strong><\/p>\n For suitable board designs and defined cutting requirements.<\/p>\n Advanced Materials<\/strong><\/p>\n Potential applications include LCP, MPI, PI, PET, FR4, FR5, CEM, and HTCC\/LTCC ceramics.<\/p>\n Material compatibility and cutting quality should be confirmed through application testing.<\/p>\n Laser depaneling may be suitable if your production involves:<\/p>\n For conventional PCB designs with less demanding cutting requirements, PCB routing or V-groove separation may be more economical.<\/p>\n The right method depends on PCB design, material, production volume, edge quality, and process requirements.<\/p>\n Not sure which method fits your application?<\/strong><\/p>\n Send us your PCB drawing and material details. Our team can help evaluate the suitable depaneling method and machine configuration.<\/p>\n Choosing a laser depaneling machine involves more than cutting precision.<\/p>\n You also need to consider application suitability, automation requirements, production stability, and long-term support.<\/p>\n Seprays provides PCB depaneling equipment and automation solutions for different electronics manufacturing applications.<\/p>\n Our team can help assess your PCB requirements and discuss a suitable laser depaneling solution.<\/p>\n Looking for an in-line PCB laser depaneling machine?<\/p>\n Tell us about your PCB design and production requirements. We can help evaluate the appropriate model and configuration.<\/p>\n To speed up the evaluation, please share:<\/p>\n Send us your PCB drawing for an application review.<\/strong><\/p>\n 1. How do I choose the right laser power for my PCB?<\/strong><\/p>\n The required laser power depends on the PCB material, thickness, cutting path, and required processing speed. Our team can evaluate these factors before recommending a configuration.<\/p>\n 2. Can I send PCB samples for a cutting test before placing an order?<\/strong><\/p>\n Yes. You can provide PCB samples or drawings for an application evaluation. Sample testing can help verify cutting quality and processing suitability before you make a purchasing decision.<\/p>\n 3. Can the machine be customized for my existing production line?<\/strong><\/p>\n The machine configuration can be evaluated according to your production line layout, transfer height, loading and unloading method, and communication requirements. Please share your current line layout if customization is needed.<\/p>\n 4. What is the expected processing speed for my PCB?<\/strong><\/p>\n Processing speed depends on the cutting path, material, thickness, laser settings, and board complexity. We recommend evaluating your actual PCB design to estimate cycle time more accurately.<\/p>\n 5. What training and after-sales support are available?<\/strong><\/p>\n Available support can be discussed according to the purchase configuration and installation arrangement. Please contact our team to confirm operator training, technical assistance, maintenance guidance, and service options for your location.<\/p>","protected":false},"excerpt":{"rendered":" \u0412 ZAM300AT\/330AT\/330AD In-Line PCB Laser Depaneling Machine<\/strong> is designed for high-precision PCB and FPC processing. It uses non-contact laser cutting to reduce mechanical stress and handle complex cutting paths.<\/p>\n Suitable for sensitive electronic assemblies and automated PCBA production lines.<\/p>\n Laser Options:<\/strong> UV \/ CO\u2082 [Get a Quote] [Request Sample Test] [Talk to an Engineer]<\/strong><\/p>","protected":false},"featured_media":4935,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[24],"product_tag":[372,371],"class_list":{"0":"post-2676","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-pcb-laser-depaneling","7":"product_tag-pcb-laser-depaneling","8":"product_tag-zam330at","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"yoast_head":"\n![\"Applications](\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/04\/2-13.jpg\")
<\/p>\nIs Laser Depaneling Right for Your PCB?<\/h2>\n
\n
![\"Is](\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/04\/Laser-Cutting-Case.jpg\")
<\/p>\nWhy Choose Seprays?<\/strong><\/span><\/h3>\n
\n
![\"Why](\"https:\/\/seprays.com\/wp-content\/uploads\/2025\/09\/seprays_group.webp\")
<\/p>\nGet a Quote for Your PCB Laser Depaneling Project<\/span><\/h3>\n
\n
\u0412\u043e\u043f\u0440\u043e\u0441\u044b \u0438 \u043e\u0442\u0432\u0435\u0442\u044b<\/strong><\/span><\/h3>\n
\nUV Laser Cutting Width:<\/strong> 25\u201340 \u03bcm
\nCutting Method:<\/strong> Non-contact laser cutting
\nPositioning:<\/strong> CCD vision and height measurement
\nAutomation:<\/strong> In-line processing with optional automated loading and unloading
\nApplications:<\/strong> PCB depaneling, FPC cutting, coverlay window opening<\/p>\n