PCB Depaneling Methods and Their Characteristics

Laser Depaneling

PCB depaneling is a critical process in electronics manufacturing. It directly affects board quality and component reliability. This article analyzes seven common depaneling methods: manual breaking, die cutting, sliding-type depaneling, guillotine cutting, saw blade separation, milling (router) depaneling, and laser cutting. 1. Manual Depaneling Manual depaneling includes two types: by hand or with tools such as pliers or fixtures. Using fixtures improves efficiency compared to cutting with pliers. This method is often referred to as manual breaking. Advantages: Disadvantages: Manual depaneling is best for “stamp hole” connected PCBs with low-stress connections. For other connection types, this method is not advised. 2. Die Cutting Die cutting uses specialized molds for fast, […]

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