October 30, 2026 | Shenzhen, China Three days went by quickly. NEPCON ASIA 2026 has officially come to a close, and as we look back on our few days in Shenzhen, one thing stands out: the people we met. From October 27 to 29, the SEPRAYS team was at Hall 13, Booth 13F76, meeting visitors, connecting with industry professionals, and sharing ideas about PCB depaneling, automation, and electronics manufacturing. For us, an exhibition is never just about displaying equipment. It is also about listening, learning, and understanding what manufacturers are facing in their everyday production environments. 🤝 More Than an Exhibition: The Value of Meeting People Throughout the exhibition, we had the opportunity to meet people from different backgrounds and

October 27–29, 2026 | Shenzhen, China SEPRAYS is taking part in NEPCON ASIA 2026 in Shenzhen, China, joining industry professionals to explore developments in electronics manufacturing, surface-mount technology (SMT), and PCB processing. In this exhibition video, Wendy from SEPRAYS shares a glimpse of the event and the atmosphere at the exhibition venue. Exploring Electronics Manufacturing Trends Electronics manufacturing continues to evolve as manufacturers work to improve production efficiency, maintain consistent quality, and adapt to increasingly complex PCB designs. From SMT production to PCB processing and automation, manufacturing technologies play an important role in supporting modern electronics production. Industry exhibitions provide opportunities to observe new developments, exchange technical perspectives, and better understand the challenges manufacturers face across different production environments. Connecting

October 27–29, 2026 | Shenzhen, China SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition & Convention Center. At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements. Exploring PCB Depaneling and Automation As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing. Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology. Laser depaneling and automated mechanical separation offer different advantages depending on the application. Understanding these