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About Seprays
Founded in Taiwan(Genitec) in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (which was upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support for customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000-square-meter modern industrial plant, thereby increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
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PCB Depaneling Total Solution
31
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33
Years of experience in SMT industrial equipment manufacturing
180+
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PCB Depaneling Insights & Manufacturing News
How to Reduce PCB Stress in High-Density Assemblies
PCB stress has quietly become one of the biggest reliability risks in high-density assemblies. A board may pass AOI.The solder joints may look perfect.Functional testing may even pass. But hidden mechanical stress inside the PCB can still create long-term failures later. In 2026, this problem is becoming more common because electronics are getting: Components are now placed closer to PCB edges.Multilayer boards are more fragile.And the depaneling processes that worked years ago may no longer be safe enough. For manufacturers working with automotive electronics, medical devices, communication modules, semiconductor systems, or industrial control boards, reducing PCB stress is no longer optional. It directly affects SMT yield and product reliability. 🔍 What Causes PCB Stress in High-Density Assemblies? PCB stress usually
Why PCB Edge Quality Affects SMT Yield
PCB edge quality is often ignored until production problems start showing up on the SMT line. Boards pass AOI.Placement accuracy looks normal.Reflow profiles are stable. But yield still drops. In many factories, the real issue is not the solder paste or the placement machine. It is the PCB edge itself. Poor depaneling quality can create burrs, stress cracks, edge deformation, and hidden micro-damage that directly affect SMT yield. As PCB designs become thinner and more compact in 2026, this issue is becoming harder to ignore. Especially in: Many engineers are now paying closer attention to how panels are separated — not just how fast. 🔍 What Does “PCB Edge Quality” Really Mean? PCB edge quality refers to the condition of
Why More Electronics Manufacturers Are Switching to Automated PCB Depaneling
Automated PCB depaneling is becoming a serious topic in electronics manufacturing circles in 2026. Not because it is “new,” but because production realities have changed. Labor costs are rising.PCB designs are getting denser.SMT lines are running faster.And manual separation methods are starting to create bottlenecks. Many factories that once relied on manual routing or standalone cutting stations are now rethinking the entire depaneling process. Especially in automotive electronics, communication devices, medical PCBA, and consumer electronics production. The shift is not only about speed.It is about consistency, yield, and long-term manufacturing stability. 🔍 Why Manual PCB Depaneling Is Becoming a Problem A common issue in many SMT factories looks like this: Orders increase.Placement machines run continuously.But depaneling still depends on operators
Best PCB Depaneling Machines for High-Density PCBA in 2026
Best PCB Depaneling Machines are becoming a much bigger discussion in 2026 — especially for manufacturers working with high-density PCBA. A few years ago, many factories mainly focused on: Today, the situation is different. Modern PCBAs are becoming: That changes the entire depaneling equation. In some cases, a cutting process that worked perfectly five years ago may now create hidden reliability risks. And many manufacturers only discover those problems after products enter real-world use. 🔍 Why High-Density PCBA Is Harder to Depanel High-density PCBAs pose several challenges simultaneously. Typical boards now include: This means even small mechanical stress can affect product reliability. The difficult part? Damage is not always visible immediately. A board may pass functional testing, but later develop:
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