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About Seprays
Founded in Taiwan(Genitec) in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (which was upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support for customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000-square-meter modern industrial plant, thereby increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
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PCB Depaneling Total Solution
31
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33
Years of experience in SMT industrial equipment manufacturing
180+
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PCB Depaneling Insights & Manufacturing News
7 Mistakes to Avoid When Buying a PCB Milling Machine
Buying a PCB milling machine can look straightforward on paper. Compare cutting speed, working area, spindle power, price, and automation level. Pick the machine that appears to offer the most. In practice, that approach often leads to expensive surprises. A machine may be fast but poorly matched to the board design. A cheaper model may require more manual work. A highly automated system may be unnecessary for a factory running only a few hundred panels a day. The better question is not, “Which machine has the best specifications?” It is, “Which machine fits the way we actually produce PCBs?” Here are seven mistakes worth avoiding before making that decision. 🔎 1. Choosing the Machine Before Checking the PCB The first
ZM300ASV Fully Automatic V-Groove PCB Depaneling for High-Volume Electronics Manufacturing
ZM300ASV fully automatic V-groove PCB depaneling becomes interesting when production volume grows, operators can no longer keep up, and a simple separation step starts affecting the whole SMT line. For a low-volume workshop, manually separating V-scored boards may still be perfectly reasonable. At higher volumes, the calculation changes. Labor consistency, cycle time, board handling, edge quality, and downstream automation become part of the real cost. That is where a fully automated approach deserves a closer look. 🔍 When Does V-Groove Separation Become a Production Problem? V-groove boards are attractive because the separation path is already defined. The process is relatively straightforward compared with routing complex PCB outlines. But “simple” does not always mean “easy to scale.” Imagine a production line
Manual PCB Separation Stress Test: How to Evaluate PCB Damage and Depaneling Risk
Manual PCB Separation Stress Test is a practical way to understand how much mechanical stress a PCB assembly can tolerate before choosing a production depaneling method. For engineers, the question is rarely just “Can this PCB be separated?” A better question is: What happens to the board and its components during separation, and can the same result be repeated thousands of times? This matters even more for high-density PCBA used in automotive electronics, medical devices, industrial controls, communication equipment, and semiconductor-related systems. 🔍 Why Perform a Separation Stress Test? A PCB can look perfectly normal after separation while still having problems that are difficult to see immediately. Potential risks include: A useful test should therefore examine the complete assembly, not
How to Choose the Right PCB Depaneling Solution for High-Density PCBA Manufacturing
Choosing the right PCB Depaneling Solution has become a more important decision for electronics manufacturers as PCBA designs continue to become smaller, denser, and more complex. Many engineers discover that the cutting process itself is not the biggest challenge. The real challenge is maintaining stable quality when production volume increases. For high-density PCBA manufacturing, factors such as component protection, process consistency, production efficiency, and future automation capability often determine whether a solution can support long-term manufacturing goals. A method that works well for prototype production may not always perform well in mass production. 🔍 Why High-Density PCBA Manufacturing Creates New Depaneling Challenges Modern electronic products are becoming more integrated. AI devices, automotive electronics, medical equipment, communication systems, and industrial controllers
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