English 
Spanish 
Japanese 
Korean 
Russian 
Chinese Latest Products
About Seprays
Founded in Taiwan in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support to customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000 square meter modern industrial plant, increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
The company is ISO9001, ISO14001, and ISO45001 certified, holds CE certification, and owns over 100 hardware and software patents. It operates two modern factories covering over 26,000 square meters in mainland China and has service locations in nine cities across China, providing nationwide after-sales service. Sales and service locations in 31 countries worldwide provide timely customer service.
Service For Global
PCB Depaneling Total Solution
31
Countries & Regions
32
Years of experience in SMT industrial equipment manufacturing
180+
Patents & Certificates
Partners
Seprays depaneling machines — trusted by over 3,000 industry leaders worldwide.
News
PCB Depaneling Insights & Manufacturing News
When Should You Choose Router Depaneling Over V-Cut?
Router depaneling over V-cut is a decision many PCB engineers face sooner or later. At first glance, V-cut looks simple and fast. It works well for many standard panels. But once board designs become more complex, or when component placement moves closer to the edge, router depaneling often becomes the safer choice. This is not about one process being universally better. In real manufacturing environments, the choice usually depends on PCB design constraints, component layout, and long-term yield stability. Let’s walk through the situations where router depaneling makes more sense. 🔍 Understanding the Two Processes Before deciding, it helps to understand how the two methods separate PCBs. V-cut depaneling Router depaneling Both processes are common in SMT production. The difference
When Should You Choose Laser Depaneling Instead of Router Depaneling?
Laser depaneling instead of router depaneling is a question many engineers ask when PCB designs start getting smaller and more complex. In early production stages, router cutting may work well. But as component density increases and reliability requirements tighten, manufacturers often evaluate laser solutions. This article shares practical insights from real production environments—looking at design limitations, cost considerations, and real-world manufacturing challenges. 🔍 Understanding the Two Depaneling Methods Before deciding which one to choose, it’s important to understand how the two processes differ. Router depaneling separates PCBs using a high-speed rotating cutting bit. It physically mills the board along a programmed path. Laser depaneling uses a focused laser beam to cut the PCB without mechanical contact. Both technologies are widely
Should You Use Laser or Router Depaneling for High-Density PCBs?
Laser or router depaneling for high-density PCBs? This question appears frequently when engineers design compact boards with tight component spacing. As PCBs become smaller and more complex, choosing the right depaneling method directly affects product reliability, yield rate, and long-term manufacturing cost. Many teams initially choose based on equipment price alone. In practice, the real decision often comes down to board structure, component distance to edge, stress tolerance, and production scale. 🔍 The Core Question Behind Depaneling Choice High-density PCBs usually place components close to the board edge. This makes mechanical stress during separation a critical concern. Two common solutions exist: Both methods are widely used in electronics manufacturing. The key question is not which is better overall, but which
Inline or Offline Laser PCB Depaneling — Which to Choose?
This is a common question when manufacturers start using laser depaneling seriously, not just as a lab tool. Both options work. The real issue is where they fit best in your production flow. This article shares practical experience from real SMT lines, not ideal diagrams. 🔍 What “Inline” and “Offline” Really Mean Before comparing, it helps to be clear. Inline laser depanelingThe depaneling system is connected directly to the SMT line. Panels move automatically from upstream processes and continue downstream without manual handling. Offline laser depanelingPanels are loaded manually or via a standalone loader. The machine works independently of the SMT line. The laser technology may be similar. The production logic is not. ⚠️ The Real Pain Points Behind This
Seprays — Your PCB Depaneling Expert.
Because we know that even the best products are only as strong as the people behind them.
That’s why we provide 24/7 expert technical support—whenever and wherever you need it.
