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About Seprays
Founded in Taiwan in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support to customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000 square meter modern industrial plant, increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
The company is ISO9001, ISO14001, and ISO45001 certified, holds CE certification, and owns over 100 hardware and software patents. It operates two modern factories covering over 26,000 square meters in mainland China and has service locations in nine cities across China, providing nationwide after-sales service. Sales and service locations in 31 countries worldwide provide timely customer service.
Service For Global
PCB Depaneling Total Solution
31
Countries & Regions
32
Years of experience in SMT industrial equipment manufacturing
180+
Patents & Certificates
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Seprays depaneling machines — trusted by over 3,000 industry leaders worldwide.
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PCB Depaneling Insights & Manufacturing News
Is laser depaneling suitable for flexible PCBs?
Laser depaneling for flexible PCBs is increasingly popular in high-density electronics. Flexible PCBs are thin, stress-sensitive, and often densely populated. Mechanical methods like routing or V-cut can introduce micro-cracks, fiber pull-out, or board warping. Laser depaneling removes these risks, making it highly suitable when applied correctly. This article shares practical insights, production challenges, and cost considerations, with examples from EMS and OEM lines, including selective use of Seprays-supported laser depaneling. 🔍 Why Flexible PCBs Need Special Care Flexible PCBs bend and twist easily. Even minor mechanical stress during depaneling can lead to: For high-value products—automotive sensors, wearables, medical electronics—avoiding stress is critical. Laser depaneling eliminates mechanical contact, directly addressing these pain points. ⚙️ How Laser Depaneling Works on Flexible PCBs
What PCB materials are suitable for laser depaneling?
PCB materials suitable for laser depaneling are not unlimited, and laser is not always the right answer. In real SMT production, laser depaneling performs extremely well for specific materials and use cases, while being less effective or inefficient for others. So instead of asking “Can laser cut this PCB?”, engineers usually ask a more practical question:“Is laser depaneling the most stable and cost-effective option for this material?” 🔍 The Short Answer First Laser depaneling is best suited for PCB materials that are: If your PCB falls into that category, a laser often solves problems that routing or V-cut cannot. ⚙️ PCB Materials That Work Well with Laser Depaneling From real production experience, these materials consistently perform well: 🟢 FPC and
How close can components be to the PCB edge when milling depaneling?
Milling depaneling component-to-edge clearance is one of the most frequently debated topics between PCB designers, SMT engineers, and manufacturing teams. Everyone wants smaller boards, higher density, and lower cost—but routing physics does not disappear just because layouts become tighter. So, how close can components realistically be to the PCB edge when using milling depaneling? The answer is not a single number. It depends on how manufacturers define acceptable yield, as well as their process control standards and risk tolerance in real production. This article shares experience-based insights from global SMT lines, focusing on manufacturability, cost impact, and practical design–process coordination rather than theoretical limits. 🔍 Why Edge Clearance Becomes a Critical Question As PCBAs grow denser, edge space is often
Will there be burrs after cutting the PCB with a milling cutter PCB depaneling machine?
Milling cutter PCB depaneling machine burr formation is one of the most common concerns raised by process engineers—especially when boards move directly into functional testing, coating, or final assembly. Burrs may look minor, but in high-density or high-reliability electronics, they can become a real quality risk. So, will burrs appear after milling and depaneling? The realistic answer is: they can—but they are controllable. This article shares production-level insights from EMS and OEM factories, focusing on industrial quality, durability, and practical process control rather than idealized claims. 🧠 What Engineers Mean by “Burrs” in PCB Depaneling In real production, burrs typically refer to: Not all burrs are equal. Some are cosmetic, while others can interfere with connectors, housings, or conformal coating.
Seprays — Your PCB Depaneling Expert.
Because we know that even the best products are only as strong as the people behind them.
That’s why we provide 24/7 expert technical support—whenever and wherever you need it.
