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About Seprays
Founded in Taiwan in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support to customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000 square meter modern industrial plant, increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
The company is ISO9001, ISO14001, and ISO45001 certified, holds CE certification, and owns over 100 hardware and software patents. It operates two modern factories covering over 26,000 square meters in mainland China and has service locations in nine cities across China, providing nationwide after-sales service. Sales and service locations in 31 countries worldwide provide timely customer service.
Service For Global
PCB Depaneling Total Solution
31
Countries & Regions
32
Years of experience in SMT industrial equipment manufacturing
180+
Patents & Certificates
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Seprays depaneling machines — trusted by over 3,000 industry leaders worldwide.
News
PCB Depaneling Insights & Manufacturing News
Why Laser PCB Depaneling Is Growing in Modern Electronics Manufacturing (Explained)
Why laser PCB depaneling is growing in modern electronics manufacturing is something many engineers are noticing on the shop floor. It’s not a trend driven by marketing. It’s driven by real production pressure—smaller devices, tighter layouts, and higher reliability requirements. In the past, mechanical depaneling worked well enough.Today, “good enough” is no longer enough. 🔍 What’s Changing in Electronics Manufacturing Modern electronics are evolving fast. Key shifts include: These changes expose the limits of traditional depaneling methods. What used to be a minor step is now a critical process. ⚙️ The Limits of Mechanical Depaneling Mechanical methods—such as router, saw, and punching—are still widely used. But they come with challenges: For simple boards, these issues are manageable. For high-density PCBs,
Laser vs Mechanical Depaneling: Top Methods for High‑Density PCBA in 2026
Laser vs mechanical depaneling has become a key discussion among PCB assembly engineers in 2026. With PCBs getting denser and components smaller, selecting the right depaneling method directly affects yield, cost, and reliability. Understanding the trade-offs between laser and mechanical approaches can save manufacturers from costly defects. 🔹 Why Depaneling Choice Matters Depaneling is not just cutting boards.It affects: High-density PCBA, especially for EVs, medical devices, and advanced consumer electronics, demands precise handling. Mistakes here can ripple downstream. ⚡ Mechanical Depaneling — Saw, Router, and Punch Mechanical depaneling remains widely used due to: Common Issues: Optimization Tips: Mechanical methods work well for standard PCBs but struggle with fragile or flexible substrates. 🔬 Laser Depaneling — Precision without Contact Laser depaneling
Common PCB Depaneling Problems and Solutions
Common PCB depaneling problems and solutions often come into focus only after yield starts to drop. At first, everything looks fine—SMT runs smoothly, inspection passes. Then small issues begin to appear. Edge cracks. Component failures. Inconsistent quality. Depaneling is usually the last step.But it can undo everything done before. 🔍 Why Depaneling Problems Are Often Overlooked Depaneling doesn’t always show immediate defects. Many issues are: This makes troubleshooting difficult. And often, the root cause points back to how the PCB was separated. ⚙️ Problem 1 — Mechanical Stress Damage One of the most common issues. Symptoms include: Cause: Solution: Stress cannot be eliminated.But it can be controlled. 💥 Problem 2 — Edge Chipping and Burrs Edge quality matters more than
Is Laser PCB Depaneling Worth the Investment?
Laser PCB depaneling is a question many manufacturers face when considering process upgrades. Is it really worth the investment? Especially for high-density, flexible, or multi-layer boards, the cost of mechanical damage can be high. Boards cracked during depaneling, components stressed, or rising rework costs all point to hidden losses in the production line. Investing in laser depaneling isn’t just buying a machine.It’s about reducing stress, improving yield, and stabilizing quality. 🔍 Why Manufacturers Consider Laser Depaneling Laser PCB depaneling is gaining popularity because it directly addresses several pain points: For boards with sensitive components, laser depaneling often prevents costly failures downstream. ⚙️ Hidden Costs of Traditional Methods Traditional depaneling, such as routers, saws, or manual snapping, carries hidden costs: These
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