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About Seprays
Founded in Taiwan(Genitec) in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (which was upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support for customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000-square-meter modern industrial plant, thereby increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
Service For Global
PCB Depaneling Total Solution
31
Countries & Regions
33
Years of experience in SMT industrial equipment manufacturing
180+
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PCB Depaneling Insights & Manufacturing News
What Is Fixtureless PCB Depaneling and Why Is It Important for Modern Manufacturing?
Fixtureless PCB Depaneling is becoming an increasingly discussed topic among electronics manufacturers that need faster production, lower tooling costs, and more flexible PCB separation processes. For many factories, the challenge is not simply cutting a PCB panel. The real problem is how to maintain accuracy, protect sensitive components, and reduce downtime when product designs change frequently. Traditional depaneling methods often require dedicated fixtures for different PCB designs. This approach works well for stable mass production, but it can create additional costs when manufacturers handle multiple models, small batches, or frequent engineering changes. As electronics become smaller and more customized, many manufacturers are rethinking whether traditional fixture-based processes can still meet modern production requirements. 🔍 Why Traditional PCB Depaneling Creates Production
How PCB Milling Achieves Burr-Free and Precise PCB Separation
PCB milling sounds straightforward: a rotating cutter follows a programmed path and separates individual boards from a panel. In production, however, getting a clean edge is not simply a matter of increasing spindle speed. The real challenge is controlling cutting force, tool condition, positioning, support, dust, and board movement at the same time. A board can look acceptable after separation but still have small burrs, dimensional variation, lifted traces, or stress around sensitive components. These problems often become expensive later, especially when the PCB enters final assembly. So, what actually makes a milled PCB edge clean and repeatable? 🔍 Why Do Burrs Appear During PCB Separation? Burrs usually come from an unstable cutting process rather than a single machine setting.
Automated PCB Depaneling and Tray Handling for AI Hardware Manufacturing
Automated PCB depaneling is becoming more relevant as AI hardware moves from engineering samples into higher-volume production. For a factory, however, the challenge is not simply separating PCBs faster. The bigger question is what happens after separation. Who removes the finished boards?Where are they placed?How are trays exchanged?How much operator handling is still required? When production runs across multiple shifts, these small steps can become a surprisingly large part of the manufacturing cost. 🤖 Why AI Hardware Needs a Different Production Approach AI servers, accelerator systems, communication equipment, and other high-performance electronics often use densely populated PCB assemblies. Manufacturers can separate and transfer multiple boards from a single panel without unnecessary handling. At low volume, operators can manage this process
Automatic V-Cut PCB Depaneling for AI Hardware and High-Performance Electronics Manufacturing
Automatic V-Cut PCB depaneling becomes much more interesting when PCB production moves into AI servers, edge computing equipment, accelerator systems, and other high-performance electronics. The cutting operation itself is not complicated. The challenge is keeping the process consistent, clean, repeatable, and economical when production volumes increase. For manufacturers, the real question is not simply, “How fast can the boards be separated?” It is: Can the depaneling process keep up with production without creating quality or labor problems? 🤖 Why AI Hardware Changes the Production Equation AI hardware is putting more pressure on electronics manufacturers. High-performance computing systems can contain dense PCB assemblies, power-management boards, control boards, communication modules, and other electronic assemblies. These products often bring several manufacturing requirements together:
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