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About Seprays
Founded in Taiwan(Genitec) in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (which was upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support for customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000-square-meter modern industrial plant, thereby increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
Service For Global
PCB Depaneling Total Solution
31
Countries & Regions
33
Years of experience in SMT industrial equipment manufacturing
180+
Patents & Certificates
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PCB Depaneling Insights & Manufacturing News
GAM330AT Inline PCB Router Machine Integrated with SMT Line for Smart Factory Electronics Manufacturing
PCB Router Machine integration has become an important topic for many electronics manufacturers as smart factories continue to develop. In the past, PCB depaneling was often treated as an independent finishing step after SMT assembly. A typical production flow looked like this: SMT placement → Reflow → Inspection → Manual transfer → PCB separation → Next process This approach can work well for small production volumes. However, as consumer electronics, industrial devices, communication products, and smart hardware continue to increase in complexity, many factories face a new challenge: The cutting process itself may not be the bottleneck. The real problem is the connection between processes. Manufacturers are now looking for solutions that can improve: The GAM330AT Inline PCB Router Machine
Automatic PCB Separation Solution for AI Devices and Next-Generation Electronics with GAM385AT
Automatic PCB Separation Solution is becoming increasingly important as AI devices and next-generation electronics continue to evolve. In the past, PCB separation was often treated as the final step after assembly. Today, many manufacturers see it differently. For AI hardware, smart devices, communication modules, and advanced electronic products, PCB separation directly influences: Modern electronic assemblies are becoming smaller while integrating more functions. AI devices, edge computing systems, and high-performance electronics often contain: This creates a new question for engineers: How can manufacturers efficiently separate PCBs without compromising product quality? The answer is not always choosing the fastest process. In many cases, the better solution is creating a stable and repeatable manufacturing workflow. ⚙️ Why AI Devices Require More Advanced PCB
GAM300 Offline Dual-Table PCB Router Machine for AI Hardware and High-Performance Electronics Manufacturing
PCB Router Machine selection is becoming an increasingly important decision for manufacturers producing AI hardware and high-performance electronics. The rapid growth of AI computing, data center infrastructure, and advanced electronic systems is changing how PCBs are designed and manufactured. Compared with traditional electronic products, modern AI and server-related hardware often requires: For many electronics manufacturers, PCB assembly is no longer only about increasing production speed. The real challenge is maintaining stable quality while handling increasingly complex PCB designs. A typical manufacturing situation looks like this: A factory receives a new generation of AI hardware orders. The PCB design becomes smaller, but the number of components increases. High-value processors, memory modules, and communication components are placed closer together. The production line
GAM380AT Multi-claw PCB Depaneling Solution for Automotive Electronics: Improving Precision and Production Stability
GAM380AT Multi-claw PCB Depaneling Solution is designed for automotive electronics manufacturers facing a common challenge: increasing PCB complexity while maintaining long-term production reliability. Automotive electronics are evolving quickly. Modern vehicles contain more electronic control units, sensors, communication modules, and intelligent systems than ever before. This change creates higher requirements for PCB manufacturing. Automotive PCB assemblies often include: Unlike consumer products that may be replaced within a few years, automotive electronic modules often need to operate reliably for a decade or longer. Because of this, PCB separation is no longer just a final production step. It has become an important factor affecting product quality. A small process variation during depaneling may not immediately appear during factory testing. However, it can become
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