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About Seprays
Founded in Taiwan in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support to customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000 square meter modern industrial plant, increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
The company is ISO9001, ISO14001, and ISO45001 certified, holds CE certification, and owns over 100 hardware and software patents. It operates two modern factories covering over 26,000 square meters in mainland China and has service locations in nine cities across China, providing nationwide after-sales service. Sales and service locations in 31 countries worldwide provide timely customer service.
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PCB Depaneling Total Solution
31
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32
Years of experience in SMT industrial equipment manufacturing
180+
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Seprays depaneling machines — trusted by over 3,000 industry leaders worldwide.
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PCB Depaneling Insights & Manufacturing News
How Do Engineers Decide If PCB Router Depaneling Is Necessary?
PCB router depaneling is one of the most widely used PCB separation methods in electronics manufacturing. But engineers rarely choose it automatically. In many projects, the decision is made only after reviewing PCB design details, production requirements, and reliability risks. Some boards work perfectly with V-cut separation. Others require laser cutting. In many cases, router depaneling is the most balanced option. So how do engineers actually make that decision in real production environments? 🔍 The First Question Engineers Ask — How Is the PCB Designed? The PCB layout usually determines the depaneling method. Engineers start by checking several key design factors: If the board outline includes curves, internal slots, or complex contours, router depaneling is often necessary because routers can follow
Is Laser PCB Depaneling the Best Choice for High-Density PCBA?
Laser PCB depaneling is often discussed when engineers start working with high-density PCBA designs. As boards become smaller and component spacing tighter, traditional mechanical separation methods sometimes reach their limits. Many production teams then begin evaluating laser cutting as an alternative. But is laser depaneling always the best option for high-density PCBA? In practice, the answer depends on board layout, reliability requirements, and production strategy. Let’s look at the issue from a real manufacturing perspective. 🔍 Why High-Density PCBA Changes the Depaneling Challenge High-density PCBA designs are very different from older PCB layouts. Components are packed closer together, and the space near the board edge becomes extremely limited. Common characteristics include: In these situations, depaneling becomes more than just a
Laser vs Router PCB Depaneling: Which Method Is Best for Modern PCBA?
Laser vs Router PCB Depaneling is a topic that comes up frequently when production teams start dealing with smaller, denser PCB designs. Years ago, router depaneling handled most boards without issue. But as components moved closer to the edge and product reliability requirements increased, many engineers began reconsidering the cutting method. So which one actually fits modern PCBA production better? The answer depends on board design, component placement, production scale, and cost priorities. Let’s break it down from a practical manufacturing perspective. 🔍 Two Common Depaneling Methods in PCBA Production Both router and laser depaneling are widely used in electronics manufacturing, but they work in very different ways. Router depaneling Laser depaneling Router systems dominate many traditional production lines. Laser
When Should You Choose Router Depaneling Over V-Cut?
Router depaneling over V-cut is a decision many PCB engineers face sooner or later. At first glance, V-cut looks simple and fast. It works well for many standard panels. But once board designs become more complex, or when component placement moves closer to the edge, router depaneling often becomes the safer choice. This is not about one process being universally better. In real manufacturing environments, the choice usually depends on PCB design constraints, component layout, and long-term yield stability. Let’s walk through the situations where router depaneling makes more sense. 🔍 Understanding the Two Processes Before deciding, it helps to understand how the two methods separate PCBs. V-cut depaneling Router depaneling Both processes are common in SMT production. The difference
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