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关于Seprays
Founded in Taiwan(Genitec) in 1993, Seprays 重点是 技术的研发和创新. 在 2002， 设立了一个分支在东莞 (which was upgraded and reorganized into a 附属公司在2013年)，完全负责 研发、生产、销售和售后的技术培训服务确保 快速反应和全面的支持 for customer needs. To further expand production, in 2003, it 购买了近20英亩的土地，在浙江省 并设立了一个 20,000-square-meter modern industrial plant, thereby 增加生产能力和制造能力.
Seprays已经被专用于PCB/FPC、分割领域超过30年。 其主要产品包括 铣刀depanelers, 激光depanelers, V-槽depanelers， 冲压depanelers以及 自动化装载和卸载解决方案 对于前端和后端的分板，包括板的位置。 这是一个 高新技术企业的研发、生产、销售和服务。
Seprays提供一个完整的设备服务的全球财富500中国500家公司包括 富士康、Flextronics，国家电网，立讯,拉美竞争和消费者保护方案，纬创博世，中国电子产品、量子计算机，CRRC有限公司，中国航空航天科学和技术公司，具，并且中兴以及 小型和中小型企业. Seprays'完全小组分离线被广泛使用的工厂在国内和国际。
服务全球
PCB拆板整体解决方案
31
国家和地区
33
多年的经验，在SMT工业设备的制造
180+
专利证书
合作伙伴
Seprays、分割机器—信任的3 000多行业的领导人。
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新闻动态
NEPCON ASIA 2026 Comes to a Close: Three Days of Conversations, Connections, and New Ideas
October 30, 2026 | Shenzhen, China Three days went by quickly. NEPCON ASIA 2026 has officially come to a close, and as we look back on our few days in Shenzhen, one thing stands out: the people we met. From October 27 to 29, the SEPRAYS team was at Hall 13, Booth 13F76, meeting visitors, connecting with industry professionals, and sharing ideas about PCB depaneling, automation, and electronics manufacturing. For us, an exhibition is never just about displaying equipment. It is also about listening, learning, and understanding what manufacturers are facing in their everyday production environments. 🤝 More Than an Exhibition: The Value of Meeting People Throughout the exhibition, we had the opportunity to meet people from different backgrounds and
SEPRAYS at NEPCON ASIA 2026: A Look Inside the Shenzhen Exhibition
October 27–29, 2026 | Shenzhen, China SEPRAYS is taking part in NEPCON ASIA 2026 in Shenzhen, China, joining industry professionals to explore developments in electronics manufacturing, surface-mount technology (SMT), and PCB processing. In this exhibition video, Wendy from SEPRAYS shares a glimpse of the event and the atmosphere at the exhibition venue. Exploring Electronics Manufacturing Trends Electronics manufacturing continues to evolve as manufacturers work to improve production efficiency, maintain consistent quality, and adapt to increasingly complex PCB designs. From SMT production to PCB processing and automation, manufacturing technologies play an important role in supporting modern electronics production. Industry exhibitions provide opportunities to observe new developments, exchange technical perspectives, and better understand the challenges manufacturers face across different production environments. Connecting
SEPRAYS at NEPCON ASIA 2026: Connecting Through PCB Depaneling and Automation
October 27–29, 2026 | Shenzhen, China SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition & Convention Center. At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements. Exploring PCB Depaneling and Automation As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing. Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology. Laser depaneling and automated mechanical separation offer different advantages depending on the application. Understanding these
How to Reduce PCB Depaneling Stress Around Sensitive Components
PCB depaneling stress is easy to overlook until a production line starts seeing cracked ceramic capacitors, unstable solder joints, or unexplained failures during reliability testing. For manufacturers producing compact, high-density electronic assemblies, separating boards is not just a cutting operation. It is part of quality control. The challenge becomes more serious when components sit close to the board edge. A small amount of bending or vibration can create problems that are difficult to detect during routine inspection. 🔍 1. Which Components Are Most at Risk? Not every component responds to separation forces in the same way. Multilayer ceramic capacitors (MLCCs), fine-pitch packages, BGAs, and heavy connectors deserve particular attention. Common warning signs include: The damage may not appear immediately after
