PCB、分割的解决方案
Hioh-精确的PCB、分割的解决方案现代化的电子产品的制造
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激光、分割的解决方案
高精度、压力的激光、分割的解决方案现代化的电子产品制造。
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路由器、分割的解决方案
高精度的路由器、分割的解决方案设计的清洁削减,低压力和稳定的生产。
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看到刀片、分割的解决方案
高效率的锯片、分割的解决方案设计用于切割和高容量的PCB的生产。
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关于Seprays

Founded in Taiwan(Genitec) in 1993, Seprays 重点是 技术的研发和创新. 在 2002设立了一个分支在东莞 (which was upgraded and reorganized into a 附属公司在2013年),完全负责 研发、生产、销售和售后的技术培训服务确保 快速反应和全面的支持 for customer needs. To further expand production, in 2003, it 购买了近20英亩的土地,在浙江省 并设立了一个 20,000-square-meter modern industrial plantthereby 增加生产能力和制造能力.

Seprays已经被专用于PCB/FPC、分割领域超过30年。 其主要产品包括 铣刀depanelers, 激光depanelers, V-槽depanelers冲压depanelers以及 自动化装载和卸载解决方案 对于前端和后端的分板,包括板的位置。 这是一个 高新技术企业的研发、生产、销售和服务。

Seprays提供一个完整的设备服务的全球财富500中国500家公司包括 富士康、Flextronics,国家电网,立讯,拉美竞争和消费者保护方案,纬创博世,中国电子产品、量子计算机,CRRC有限公司,中国航空航天科学和技术公司,具,并且中兴以及 小型和中小型企业. Seprays'完全小组分离线被广泛使用的工厂在国内和国际。

Dongguan Zhimao(Seprays) Company

服务全球

PCB拆板整体解决方案

31

国家和地区

33

多年的经验,在SMT工业设备的制造

180+

专利证书

合作伙伴

Seprays、分割机器—信任的3 000多行业的领导人。

Seprays Partners

Hear from our clients

Our clients love working with us, just read what they have to say!

“Edge chipping was a big issue for us before. After switching to the Seprays ZM300N router machine, the cut quality is much cleaner and more consistent.״
Daniel Miller
Process Engineer | Consumer Electronics Industry
“We needed a stress-free solution for sensitive boards. The Seprays ZAM330AT laser machine works great — no damage, very stable results.״
Quality Manager
Emily Carter
Quality Manager | Medical Devices Manufacturer
“Our boards are thick and complex, but the Seprays ZM300H runs very stably. Quality remains consistent even during long production runs.״
James Anderson
Production Manager | Automotive Electronics
“We used to rely on manual handling. After implementing Seprays' automation line, efficiency improved a lot, and the workflow is much smoother.״
Factory Director
Ryan Thompson
Factory Director | EMS Provider

新闻动态

PCB、分割的见解和制造新闻

保持更新最新的PCB、分割技术、路由选择解决方案和行业趋势,从真正的SMT生产环境。
Live at NEPCON Shanghai 2026: Fully Automated Inline PCB Depaneling Solution

Live at NEPCON Shanghai 2026: Fully Automated Inline PCB Depaneling Solution

Seprays & Genitec is exhibiting at NEPCON Shanghai 2026. Visitors can experience our fully automated Inline PCB Depaneling Solution running live on-site. The system automates the entire process from board loading to scrap collection. No manual intervention is required. This helps manufacturers reduce labor costs and improve production efficiency. A dual-worktable design enables simultaneous cutting and loading/unloading. The result is a smoother production flow and higher throughput. The solution can also be integrated with post-cut inspection and intelligent tray loading. This creates a complete automated inline depaneling process for modern SMT production lines. Our team is available at the booth to discuss applications, production challenges, and automation solutions. 📍 Hall 1, Booth 1H80📅 June 2–4, 2026🏢 Shanghai World Expo Exhibition

PCB Depaneling and Tray Handling Automation for Smart Factories in 2026

PCB Depaneling and Tray Handling Automation for Smart Factories in 2026

PCB depaneling and tray handling automation is becoming a critical topic for electronics manufacturers in 2026. As production volumes increase and product designs become more complex, manual depaneling and tray management are creating bottlenecks that many factories can no longer ignore. For SMT manufacturers, the challenge is no longer just cutting PCBs accurately. It is about maintaining continuous production flow, reducing labor dependency, ensuring traceability, and improving consistency from panel separation to final product collection. Many factories are now asking a different question: “How can we automate the entire post-SMT process instead of optimizing only the depaneling step?” The answer increasingly lies in integrated depaneling and tray handling systems. 🚀 Why Traditional PCB Depaneling Processes Are Becoming a Bottleneck A

Inline vs Offline PCB Separation — Which Is Better for SMT Factories

Inline vs Offline PCB Separation — Which Is Better for SMT Factories?

Inline PCB separation is becoming a hot topic among SMT manufacturers in 2026. Not because offline depaneling has disappeared. In fact, many successful factories still rely on offline systems every day. The real question is different: Which solution creates the best balance between productivity, flexibility, quality, and long-term operating costs? The answer depends on your production environment. A factory producing millions of identical automotive PCBs may need a completely different approach from an EMS provider handling dozens of product changes every week. This article explores the practical differences between inline and offline PCB separation from an engineer’s perspective. 🏭 Why More SMT Factories Are Re-Evaluating Their Depaneling Process Over the past few years, electronics manufacturing has changed significantly. Factories are

Low-Stress PCB Cutting for Medical Electronics

Low-Stress PCB Cutting for Medical Electronics

Low-stress PCB cutting is no longer optional in modern medical electronics production. Devices such as wearable monitors, implantable sensors, diagnostic instruments, and portable imaging systems demand not only precision but also extreme care during PCB separation. Even a small crack, micro-fracture, or stress-induced defect can compromise device reliability, regulatory compliance, and patient safety. In 2026, medical electronics manufacturers are focusing on cutting techniques that preserve PCB integrity while supporting high-throughput production. 🩺 Why Low-Stress PCB Cutting Matters in Medical Devices Medical electronics PCBs often have: High mechanical stress during depaneling can lead to: Factories that underestimate stress management risk: A low-stress cutting approach safeguards both quality and regulatory adherence. ⚙️ Common PCB Stress Points in Medical Production Even minor errors

Seprays—你PCB、分割的专家。

因为我们知道,即使是最好的产品只能作为强大的人在他们身后。

这就是为什么我们提供的 24/7专家技术支持—无论何时何地,只要你需要它。

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