日: 2025年8月4日

Automated PCB Bottom Depaneling with GAM 380AT – Clean Cuts, Zero Stress

Automated PCB bottom depaneling is essential in modern electronics manufacturing.As boards get smaller and components denser, clean separation without damaging the PCB is a must. Enter the GAM 380AT—a bottom-side PCB depaneling machine designed for high-speed, high-precision production. ⚙️ What Is Bottom Depaneling? Bottom depaneling separates PCBs from below using a milling spindle or cutting tool.This method avoids contact with sensitive top-side components. The GAM 380AT achieves this with: It’s ideal for thin boards, tall components, or fragile assemblies. 🚀 Meet the GAM 380AT The GAM 380AT is Seprays’ flagship inline bottom depaneling system.It supports: The entire depaneling process is fully automated—load, cut, unload.No operator intervention needed. 🎯 Why Use […]