日: 2025年8月5日

Is Laser Depaneling Machine Right for Your PCBA Process?

Laser depaneling machine technology is rapidly transforming how electronics manufacturers handle printed circuit board assemblies (PCBAs). If you’re seeking more precision, less mechanical stress, and higher throughput, this non-contact solution could be exactly what your production line needs. But is it the best fit for your process? Let’s explore the benefits, ideal applications, and key considerations. ⚙️ What Is a Laser Depaneling Machine? A laser depaneling machine uses high-energy laser beams to separate PCBs from a panel without physical contact. Unlike traditional routing or punching, there’s no tool wear, vibration, or dust. It works with various materials, including FR4, polyimide, ceramics, and even flexible substrates. Ideal for high-density or miniaturized […]

GAM336AT Automatic PCB Depaneling Machine – Dual Spindle & Flexible Tray Handling

The GAM336AT automatic PCB depaneling machine is redefining precision and efficiency in electronic manufacturing.Equipped with dual spindles and flexible tray handling, it meets the rising demand for speed, accuracy, and reliability. If you’re managing high-volume PCB production, this machine delivers real value. ⚙️ Dual Spindle Power for Double Throughput Speed is key in mass production.The GAM336AT comes with dual high-speed spindles, working in parallel to: It’s ideal for large or complex boards where time matters. 🧠 Smart Tray Handling System Flexibility is built in.With a flexible tray handling mechanism, this machine: This means fewer manual interventions and smoother production flow. 🔍 Precision That Delivers Powered by CCD vision alignment and […]