日: 2025年10月24日

Is Your PCB Depaneling Still Causing Cracks and Stress? Discover the Power of Laser Depaneling Machines

PCB depaneling remains a critical step in modern electronics manufacturing. PCB depaneling issues, such as cracks, delamination, or stress-induced warping, can disrupt production schedules, increase scrap rates, and drive up costs. Traditional depaneling methods—like mechanical routing or punching—often struggle with these challenges, especially when dealing with high-density boards or delicate components. This is where laser depaneling machines come in, offering precision, speed, and reliability. ✨ Understanding PCB Depaneling Challenges Depaneling is more than just cutting boards into manageable sizes. It involves maintaining component integrity and ensuring that electrical connections remain intact. Common challenges include: Many manufacturers underestimate the impact of these issues until they notice increased board failure rates during […]