日: 2025年11月5日

SEPRAYS made its debut at NEPCON in Shenzhen, winning over countless fans with its innovative depaneling process

NEPCON Concludes Successfully SEPRAYS wins over many fans From October 28th to 30th, 2025, the three-day NEPCON Asia electronics exhibition successfully concluded at the Shenzhen World Exhibition & Convention Center. At this highly influential professional electronics manufacturing exhibition in Asia, SEPRAYS, under the theme “Intelligent Depaneling, Intelligent Manufacturing Future,” showcased seven innovative depaneling machines at booth 11B71 in Hall 11, bringing a spectacular technological feast to the attendees. On the first day of the exhibition, the SEPRAYS booth attracted a large number of professional visitors who stopped to inquire. Moreover, on-site technical consultants warmly welcomed every visitor, patiently answered various technical questions, and seamlessly demonstrated the equipment’s outstanding operational performance. […]

Router vs Laser PCB Depaneling — Which Fits Your Production Line?

PCB depaneling is one of the most critical stages in electronics manufacturing — it separates assembled boards from production panels while ensuring precision, speed, and minimal mechanical stress. But as technology advances, manufacturers face a key question: Should you choose router depaneling or laser depaneling for your production line? Both methods have unique advantages, costs, and ideal application scenarios. This article presents a real-world comparison of router versus laser PCB depaneling, providing insights from factory experiences, cost analysis, and performance data. 🔍 The Pain Points of Traditional Depaneling Before the advent of modern automation, many factories relied on manual cutting or V-scoring methods. These older techniques, though simple, caused several […]