日: 2025年12月15日

PCB Panel Cutting Machine: Lessons from Handling Thin and High-Density PCB Panels

PCB Panel Cutting Machine performance becomes increasingly critical as modern electronics move toward thinner substrates and higher component density. In recent years, SMT engineers across Europe, North America, and Asia have shared similar challenges: maintaining cut accuracy without introducing stress, protecting fine-pitch components, and controlling long-term operating costs. This article summarizes practical lessons learned from real production environments rather than theoretical specifications. 🔬 Thin PCB Panels — Stability Before Speed Thin PCB panels, often below 1.0 mm, behave very differently during depaneling. Engineers frequently report micro-vibration, panel flexing, and edge chipping as major risks. Common pain points include: In practice, factories mitigate these risks by prioritizing rigid support structures, controlled […]