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Chinese How to Reduce Mechanical Stress in PCB Depaneling
How to Reduce Mechanical Stress in PCB Depaneling has become a critical discussion in modern SMT production. As PCBs become thinner, denser, and populated with sensitive components, uncontrolled mechanical stress during separation can lead to micro-cracks, solder joint fatigue, and reduced reliability over time. This article shares insights from global SMT lines on minimizing stress, balancing cost, and improving yield. ⚙️ Understanding Mechanical Stress in Depaneling Mechanical stress arises whenever a PCB is separated from its panel using routers, V-cut, or blade depaneling systems. Common stress points include: Engineers emphasize that stress is not always visible at AOI but can manifest later during thermal cycling or vibration tests, especially in […]
