日: 2026年1月8日

FPC Depaneling Solutions for Industrial Electronics: Field-Tested Strategies for Yield Stability

FPC Depaneling Solutions for Industrial Electronics are gaining attention as flexible circuits become more common in control systems, power modules, sensors, and human–machine interfaces. Compared with rigid PCBs, FPCs introduce unique challenges during depaneling due to their thin substrates, mixed materials, and sensitivity to mechanical stress. This article shares field-tested insights from industrial SMT environments focused on yield stability rather than short-term throughput. 🧠 Why FPC Depaneling Is a Yield-Sensitive Process Industrial electronics often operate in harsh conditions, making early-stage process stability critical. Engineers report that FPC-related yield loss frequently originates not in assembly, but during panel separation. Common challenges include: Unlike rigid boards, FPC defects may not be immediately […]