日: 2026年1月9日

PCB Depaneling for High-Density PCBA: Common Routing Challenges and Best Fixes

PCB Depaneling for High-Density PCBA has become a critical process as component spacing continues to shrink and functional integration increases. In modern SMT lines, routing is often the preferred depaneling method for dense layouts, but real-world production reveals recurring challenges that can affect yield, reliability, and long-term stability. This article summarizes practical lessons and proven fixes shared by engineers across global manufacturing sites. ⚙️ Why High-Density PCBA Is Especially Sensitive to Routing High-density PCBAs typically feature fine-pitch components, edge-mounted connectors, and multi-layer structures. During routing, even minor vibration or tool wear can transfer stress into solder joints or ceramic components. Engineers frequently report: These issues often pass visual inspection but […]