日: 2026年1月12日

PCB Depaneling Stress Reduction Techniques: What Actually Works in High-Density PCBA

PCB Depaneling Stress Reduction Techniques have become a crucial topic in high-density PCBA production. As boards become more compact, populated with sensitive components, and multi-layered, mechanical stress during depaneling can lead to micro-cracks, solder joint fatigue, and long-term reliability issues. This article presents field-tested approaches, practical fixes, and engineering insights from global SMT lines. ⚙️ Understanding Stress in High-Density PCBA Depaneling High-density PCBA presents unique stress challenges: Engineers report that even minor deviations in tool alignment or panel support can trigger latent defects, which often remain hidden until thermal cycling or vibration testing. 🧩 Technique 1: Optimized Router Parameters Routing remains a widely used depaneling method for dense boards. Key […]