日: 2026年1月13日

Low-Stress Depaneling Solutions: Practical Approaches for Fragile and Dense PCBAs

Low-Stress Depaneling Solutions have become a priority as PCBAs grow thinner, denser, and more functionally integrated. In applications such as automotive electronics, industrial controls, and medical devices, depaneling is no longer viewed as a simple mechanical step—it is a process that can directly influence long-term reliability. This article shares practical approaches that engineers report actually working on fragile and high-density PCBAs. ⚙️ Why Fragile PCBAs React Differently to Depaneling Dense PCBAs often combine fine-pitch components, edge-mounted connectors, and multi-layer stackups. During depaneling, even moderate mechanical force can propagate stress into sensitive areas. Common pain points reported by SMT engineers include: Because these issues rarely appear during visual inspection, depaneling-related stress […]