日: 2026年1月21日

How close can components be to the PCB edge when milling depaneling?

Milling depaneling component-to-edge clearance is one of the most frequently debated topics between PCB designers, SMT engineers, and manufacturing teams. Everyone wants smaller boards, higher density, and lower cost—but routing physics does not disappear just because layouts become tighter. So, how close can components realistically be to the PCB edge when using milling depaneling? The answer is not a single number. It depends on how manufacturers define acceptable yield, as well as their process control standards and risk tolerance in real production. This article shares experience-based insights from global SMT lines, focusing on manufacturability, cost impact, and practical design–process coordination rather than theoretical limits. 🔍 Why Edge Clearance Becomes a […]