日: 2026年1月23日

Is laser depaneling suitable for flexible PCBs?

Laser depaneling for flexible PCBs is increasingly popular in high-density electronics. Flexible PCBs are thin, stress-sensitive, and often densely populated. Mechanical methods like routing or V-cut can introduce micro-cracks, fiber pull-out, or board warping. Laser depaneling removes these risks, making it highly suitable when applied correctly. This article shares practical insights, production challenges, and cost considerations, with examples from EMS and OEM lines, including selective use of Seprays-supported laser depaneling. 🔍 Why Flexible PCBs Need Special Care Flexible PCBs bend and twist easily. Even minor mechanical stress during depaneling can lead to: For high-value products—automotive sensors, wearables, medical electronics—avoiding stress is critical. Laser depaneling eliminates mechanical contact, directly addressing these […]