日: 2026年1月28日

Which PCB depaneling method causes the least stress?

This question comes up whenever PCBA reliability, fine-pitch components, or thin substrates are involved. The short, experience-based answer is: laser depaneling introduces the lowest mechanical stress, but it is not always the default choice. Below is a clear comparison to help engineers make a practical decision. 🧠 Why Depaneling Stress Matters More Than You Think Mechanical stress during depaneling is a hidden risk. It may not show up during visual inspection, but it often leads to: As component density increases and boards become thinner, depaneling stress becomes a design constraint, not a secondary process issue. ⚙️ Common PCB Depaneling Methods at a Glance In practice, manufacturers mainly choose between four […]