日: 2026年1月29日

Safety issues to watch in laser PCB depaneling

Laser PCB depaneling is increasingly used for low-stress, high-precision applications. However, choosing laser technology does not automatically mean “risk-free.” Based on real production experience, most problems come not from the laser itself, but from overlooked safety details in setup, operation, and process design. This checklist-style article highlights where teams often get it wrong—and how to avoid those pitfalls. ⚠️ Why Safety Is Often Underestimated in Laser Depaneling Laser depaneling is a non-contact process, so it feels safer than routing or sawing. No blades, no vibration, no mechanical force.That perception can lead to relaxed standards, especially during early deployment. Common pain points engineers report include: Safety in laser depaneling is not […]