日: 2026年3月9日

When Should You Choose Laser Depaneling Instead of Router Depaneling?

Laser depaneling instead of router depaneling is a question many engineers ask when PCB designs start getting smaller and more complex. In early production stages, router cutting may work well. But as component density increases and reliability requirements tighten, manufacturers often evaluate laser solutions. This article shares practical insights from real production environments—looking at design limitations, cost considerations, and real-world manufacturing challenges. 🔍 Understanding the Two Depaneling Methods Before deciding which one to choose, it’s important to understand how the two processes differ. Router depaneling separates PCBs using a high-speed rotating cutting bit. It physically mills the board along a programmed path. Laser depaneling uses a focused laser beam to […]