日: 2026年6月17日

How to Depanel Mobile Phone Power Adapter PCBs Without Damaging Components – GAM330AT

Mobile phone power adapter PCBs are getting smaller every year. Faster charging requirements, adoption of GaN technology, and more compact product designs are pushing components closer together than many manufacturers expected a few years ago. On paper, the design looks efficient. On the production floor, it often creates a different discussion. Engineers start noticing small but frustrating problems: Cracked solder joints. Damaged edge components. Micro-stress around sensitive ICs. Unexpected yield drops. And sometimes the depaneling process becomes the last place people investigate. The issue is that power adapter boards are no longer simple rectangular PCBs with large empty margins. In many cases, components sit only a few millimeters—or even less—from […]