日: 2026年9月21日

From PCB Infeed to Tray Loading: A Fully Automated Laser Depaneling Solution

Laser depaneling becomes much more interesting when it is no longer a standalone cutting operation. In a modern electronics factory, the question is often bigger than how quickly a PCB can be separated. What happens before cutting? How is the PCB positioned? How are separated boards transferred? Who loads the trays? And what happens when the tray becomes full? For a semiconductor-related electronics manufacturer, these questions became increasingly important as production volume increased and manual handling started to interrupt an otherwise stable process. The solution was not simply a faster laser. It was a connected workflow—from PCB infeed to automated tray loading. 🏭 The Customer Production Challenge The customer manufactures […]