日: 2026年10月21日

How to Reduce PCB Depaneling Stress Around Sensitive Components

PCB depaneling stress is easy to overlook until a production line starts seeing cracked ceramic capacitors, unstable solder joints, or unexplained failures during reliability testing. For manufacturers producing compact, high-density electronic assemblies, separating boards is not just a cutting operation. It is part of quality control. The challenge becomes more serious when components sit close to the board edge. A small amount of bending or vibration can create problems that are difficult to detect during routine inspection. 🔍 1. Which Components Are Most at Risk? Not every component responds to separation forces in the same way. Multilayer ceramic capacitors (MLCCs), fine-pitch packages, BGAs, and heavy connectors deserve particular attention. Common […]