日: 2026年10月28日

SEPRAYS at NEPCON ASIA 2026: Connecting Through PCB Depaneling and Automation

October 27–29, 2026 | Shenzhen, China SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition & Convention Center. At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements. Exploring PCB Depaneling and Automation As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing. Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology. Laser depaneling and automated mechanical […]