レーザーデパネリング：PCBを切断するスマートな方法

何の動作原理のレーザー Depaneling?

の動作原理のレーザー depaneling用した高エネルギーのレーザービームを精密にカットの接続タブまたはルーティングチャンネルの基板パネル、分離個々のボードな機械です。 レーザー光源など、CO2を排出しない紫外線レーザーを集光させることは、材質の基板を導き出すことができる 

When the laser interacts with the material, its energy is absorbed, causing localized heating and vaporization (ablation) along the programmed cutting path. This process is controlled by software that guides the laser head with high precision, enabling the creation of complex shapes and fine details to be cut cleanly. Since laser depaneling is a non-contact method, it eliminates mechanical stress, reduces the risk of damage to sensitive components, and produces minimal debris, making it ideal for high-density and delicate PCB designs.

どんな種類のレーザーのレーザー Depaneling?

CO2レーザー:

• Best for cutting non-metal materials, such as FR-4 (a common PCB material).
• Fast and cost-effective, but can’t cut metals well.

紫外線レーザー:

• Great for high-precision cutting, especially for flexible PCBs or materials with copper.
• Very accurate with minimal heat damage, but slower and more expensive.

緑色レーザー:

• Used for specific materials like flexible circuits.
• Offers good precision but is less common and more costly.

ファイバーレーザ:

• Used for cutting metal-based PCBs.
• Efficient for metals but not suitable for non-metal materials.

フェムト秒レーザー:

• Ultra-high precision with almost no heat damage.
• Ideal for delicate materials, but very expensive and slow.

ピコ秒レーザー:

• Similar to femtosecond lasers but slightly less precise.
• Still high-cost and used for advanced applications.

エキシマレーザー:

• Used for very precise cutting of special materials.
• High resolution but expensive and complex to maintain.

とどう違うのでCO2レーザー、紫外線レーザーにDepaneling。

の違いを教えてレーザー Depaneling、伝統的な機械Depaneling?

Seprays'レーザー基板Depaneling解

ZAM310 PCB/FPCレーザーデパネマシン

SEPRAYS’ZAM310 PCB/FPC Laser cutting machines ensure that no stress is imparted to nearby components, even when the cutting path is very close to them. To further minimize thermal impact, lasers are carefully selected based on thermal requirements, and their processing parameters are precisely matched to optimize performance.

ZAM320 PCB/FPCレーザー切断機

SEPRAYS’ZAM320 PCB/FPC Laser Cutting Machine has a compact design and can save factory space. A variety of nanosecond, picosecond UV, and green lasers are available to meet various processing needs.

結論

レーザー depaneling is a major improvement in PCB manufacturing, offering precise, clean cuts without damaging sensitive components. By understanding how it works and the types of lasers used, manufacturers can choose the best method for their needs. As electronics continue to get smaller and more complex, laser depaneling will become even more important. With its ability to cut delicate designs without stress or debris, laser depaneling is shaping the future of electronics production.