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説明
| モデル | GAM70 |
| Field of View | 2.5 mm × 1.8 mm |
| Magnification | X90 |
| Power Supply | Supplied by a computer |
| Dimensions | 350 (L) × 400 (W) × 290 (H) mm |
| 重量 | 30 kg |
| Inspection Method | Laser Vision |
| Table Size | 350 (W) × 265 (L) mm |
| Measurement Thickness | 0.5 mm ~ 0.007 mm |
| 分解能 | 0.003 mm |
| Repeatability Accuracy | (±) 0.0035 mm |
| Analysis System | GAM70 (Chinese Interface) |
| X, Y Moving Stage | Travel: X = 200 mm, Y = 100 mm; Glass Table (Optional): X = 230 mm, Y = 190 mm |
This product is a non-contact thickness measurement device. It is a quality management device designed to enhance Fine Pitch process capabilities, improve printing technology, and meet precision requirements. It can also provide various SPC statistical analysis values to improve process capabilities.
Features:
1. Automatic/manual measurement of solder paste thickness.
2. Manual measurement of paste length, width, and spacing.
3. Automatic calculation of solder paste area, cross-sectional area, and volume.
4. The measured values can be recorded, archived, and printed.
5. Capture images taken by the CCD and store them.
6. Automatic calculation of process capability indicators Cp, Cpk, and Cpm.
7. Provide a thickness distribution diagram and X-Bar/R-BAR control diagram.
8. Can measure and record separately according to different production lines at the same time.
9. Quickly adjust the focus according to the basic thickness measurement.
10. Can call sampling at a fixed time.
の GAM70 Solder Paste Measurement system is the ideal non-contact solution for accurately measuring solder paste thickness across a wide range of applications. Engineered for high precision, this tool can analyze the area, volume, and cross-section of solder paste deposits with excellent repeatability, supporting process stability and quality assurance in SMT production lines.
In addition to paste analysis, the system can also measure the length and thickness of other material objects, making it versatile for broader inspection tasks. The system automatically generates comprehensive statistical reports, including thickness data, distribution charts, X–R control charts, and process capability indices (Cp, Cpk, Cpm), providing engineers with valuable insights for quality optimization.
Perfect for manufacturers who demand accuracy, consistency, and traceability.
✅ Non-contact, highly accurate
✅ Powerful statistical analysis tools
✅ Supports SPC and quality control
Contact us now and discover why over 3,000 leading companies trust SEPRAYS for their PCB depaneling needs.
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