Japanese 
English 
Spanish 
Korean 
Russian 
Chinese 
説明
| モデル | ZAM310 |
|---|---|
| 有効切断サイズ | 350*350mm |
| 切削機能 | Tweeningを直線、L形、U形状、円弧 |
| 工程表" | シングル |
| 繰り返し精度 | ±2μm |
| 切断精度 | ±20µm |
| 周囲温度 | 22℃±2℃(71.6℉±2℉) |
| Platform | 鉄骨 |
| レーザー波長 | 355nm/532nm |
| データを受信フォーマ | ガーバー,HPGL,Sieb&Meier,Excellon,ODB++ |
| 操作システム | Windows7/Windows10 |
| 対象を読み込み | CCD automatic target cap. The true Target shape is irregular.
No Target, DIL is required. Modules |
| 切断ソフトウェア | DreamCreaTor |
| データ処理ソフトウェア | CircuitCAM7 |
| XYZ軸駆動モード | サーボモーター+ネジ |
| 電圧/電源 | AC380V50/60Hz2.5KW三相 |
| 空気圧の圧力の要件 | 0.6MPa，50L/min |
| 外形寸法(W*D*H) | 1050mm×1600mm x1270mm |
| 重量 | 600KG |
High-precision, high-quality, new standards for small-format equipment. With the rapid development of electronic technology, designers are assembling more and more dense, smaller, and more components onto smaller, thinner, and more irregular circuit boards, which brings greater challenges to the subsequent board separation process. To this end, Zhimao provides a more environmentally friendly, fast, precise, and reliable solution to meet the needs of this trend.
Equipment features:
Direct data drive: immediate production, rapid product introduction
High degree of automation: equipped with a feeder, ready to enter the line at any time.High degree of automation
Breaking through mechanical limits: laser replaces molds to avoid distortion and break through mechanical limits
.
Non-contact processing: When light encounters the material, it sublimates without contact, eliminating stress damage.
Precise laser control: precise laser control, fixed depth and quantity, micron-level extreme structure
SEPRAYS introduces the ZAM310 PCB/FPCレーザーデパネマシン system—an advanced solution built for today’s increasingly compact, irregular, and high-density circuit board designs. Engineered for high precision and low impact, the ZAM310 is setting a new benchmark in small-format depaneling.
With a zero-stress laser cutting process, nearby components remain untouched, no matter how close they are to the cutting path. The system precisely controls thermal effects, optimizing laser settings to minimize heat spread and material deformation. The system extracts fumes and particles from laser ablation in real time during operation, ensuring a clean and safe production environment.
Optional UV or green lasers, height sensors, barcode scanning, MES integration, and inline upgrade options make this machine incredibly adaptable. The ZAM310 PCB/FPCレーザーデパネマシン solution is trusted by top manufacturers for its reliability and accuracy.
Contact us now and discover why over 3,000 leading companies trust SEPRAYS for their PCB depaneling needs.
レビュー
レビューはまだありません。