タグ: High-component PCB depaneling

High-Component PCB Depaneling Is No Longer a Challenge!

Dual Solutions from Seprays – Online and Offline Milling Cutter Machines If you’re in PCBA production, you know the struggle. Tall components can be a nightmare during depaneling. Traditional machines either can’t reach or end up crashing into components, causing stress damage. Watching your precision boards stuck at this stage is frustrating, inefficient, and risky. But don’t worry — Seprays has the answer. We offer dual depaneling solutions specifically designed for high-component PCBs (≤75mm). Choose between the online GAM386AT and the offline GAM386 models. 💡 Key Innovation: Bottom-Up Milling Design Our cutter approaches the board from underneath.This smart design avoids collision with tall components on top.Perfect for mobile modules, automotive […]