ZAM330 PCB/FPC Laser Cutting

ZAM330 Double Platform Laser Depaneling Equipment

ZAM330 adopts dual-table design, which saves the loading and unloading time, and keeps the laser always in the processing state. The processing area is 350mmx520mm, which is suitable for depaneling placed PCBs, open cover film window and other processes in SMT industry. It can also be equipped with camera target pre-positioning system, saving the processing time due to target positioning.

Optional

UV laser 15w, 20w, 25w or Green laser 35w, 60w
Laser Height Sensor
Barcode reader and MES system integration
Laser cam power detection
upgrade to Inline

Model	ZAM330
Vaild cutting size	350mm×520mm
Cutting function	Tweening to staight line,L shape,U shape,Circle,Arc
Process table	Two
Repeat precision	±2μm
Cutting precision	±20μm
Ambient Temperatur	22℃±2℃(71.6℉±2℉)
Platform	Marble table
Transfer model（option）	Mechanical transfer arm（scrap board throwing）
Laser wavelength	355nm/532nm
Receive Data Forma	Gerber, HPGL, Sieb & Meier, Excellon, ODB++
Operation system	Windows 7 / Windows 10
Target reads	CCD automatic target capture Target shape is irregular, no Target, DIL is required Modules
Cutting software	DreamCreaTor
Data processing software	CircuitCAM 7
XYZ-axis driving mode	linear +servo motor
Voltage/Power requirement	AC380V 50/60Hz 2.5KW three phase
Pneumatic pressure requirement	0.6MPa，50L/min
Dimensions(WDH)	1600mm x2100mm x1600mm
Weight	2000KG