ZM30L PCB Automatic Round Knife Depaneling

Product Features:

- Unique multi-stage cutting technology, divided into three groups of cutting units, A, B and C, and refined cutting in stages to ensure a smooth cutting surface.

- Reduces cutting stress by more than 80%, which greatly reduces the risk of board deformation.

- Cutting edges are flat and burr-free, the board surface remains flat without twisting or warping, which meets the strict requirements of high-precision circuit board manufacturing.


Contact us today! Learn about the SEPRAYS ZM30-L Walkaway Depaneler.

ModelZM30-L
Cutting lengthUnlimited length
Thickness0.5~3mm
Circuit board typeAluminum substrate, Copper substrate, FR1~4, Glass fiber plate
Feeding speed0~300mm/s
Machine size800mm(L)*370mm(W)*240mm(H)
Inlet/outlet tray table size2600mm(L)*370mm(W)*240(H)
Blade typeSKH high speed steel
Weight46 kg
Power220V/50HZ,60W
Hourly workload800


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