ZM30L PCB Automatic Round Knife Depaneling
Product Features:
- Unique multi-stage cutting technology, divided into three groups of cutting units, A, B and C, and refined cutting in stages to ensure a smooth cutting surface.
- Reduces cutting stress by more than 80%, which greatly reduces the risk of board deformation.
- Cutting edges are flat and burr-free, the board surface remains flat without twisting or warping, which meets the strict requirements of high-precision circuit board manufacturing.
Contact us today! Learn about the SEPRAYS ZM30-L Walkaway Depaneler.
Model | ZM30-L |
---|---|
Cutting length | Unlimited length |
Thickness | 0.5~3mm |
Circuit board type | Aluminum substrate, Copper substrate, FR1~4, Glass fiber plate |
Feeding speed | 0~300mm/s |
Machine size | 800mm(L)*370mm(W)*240mm(H) |
Inlet/outlet tray table size | 2600mm(L)*370mm(W)*240(H) |
Blade type | SKH high speed steel |
Weight | 46 kg |
Power | 220V/50HZ,60W |
Hourly workload | 800 |
E-mail : sales@seprays.com
Tel : +86-0769-83284766
+86-13925527370
Address : 5th Floor, B2 Building Research Center Songshan Lake Intelligent Valley, Liaobu Town, Dongguan City, Guangdong Province, China