Лазерная резка печатных плат ZAM310/FPC

Seprays’ small-format high-precision laser depaneling solution sets a new benchmark for modern electronics manufacturing. Designed for today’s smaller, thinner, and irregular PCBs, it ensures stress-free cutting, precise thermal control, and clean processing with real-time exhaust of byproducts. Offering environmentally friendly, fast, and reliable performance, it is the ideal choice for next-generation PCB depaneling needs.

Категория: Лазерное Удаление панелей с печатных плат Тег: ZAM310 laser cutting

Specifications

Модель	ZAM310
Допустимый размер резки	350*350mm
Cutting function	Преобразование в прямую линию, L-образную, U-образную форму, Круг, Дугу
Таблица процессов	single
Repeat precision	±2μm
Cutting precision	±20μm
Ambient Temperatur	22℃±2℃(71.6℉±2℉)
Платформа	Steel frame
Laser wavelength	355nm/532nm
Receive Data Forma	Gerber, HPGL, Sieb & Meier, Excellon, ODB++
Operation system	Windows 7 / Windows 10
Target reads	CCD automatic target cap. The true Target shape is irregular. No Target, DIL is required. Modules
Cutting software	Создатель мечты
Data processing software	CircuitCAM 7
XYZ-axis driving mode	Servo motor + lead screw
Требуемое напряжение / Мощность	AC380V 50/60Hz 2.5KW three phase
Требования к пневматическому давлению	0.6MPa，50L/min
Размеры (Ш* Г*В)	1050mm x 1600mm x 1270mm
Вес	600KG

High-precision, high-quality, new standards for small-format equipment. With the rapid development of electronic technology, designers are assembling more and more dense, smaller, and more components onto smaller, thinner, and more irregular circuit boards, which brings greater challenges to the subsequent board separation process. To this end, Zhimao provides a more environmentally friendly, fast, precise, and reliable solution to meet the needs of this trend.

Equipment features:

Direct data drive: immediate production, rapid product introduction

High degree of automation: equipped with a feeder, ready to enter the line at any time.High degree of automation

Breaking through mechanical limits: laser replaces molds to avoid distortion and break through mechanical limits
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Non-contact processing: When light encounters the material, it sublimates without contact, eliminating stress damage.

Precise laser control: precise laser control, fixed depth and quantity, micron-level extreme structure

SEPRAYS introduces the Лазерная резка печатных плат ZAM310/FPC system—an advanced solution built for today’s increasingly compact, irregular, and high-density circuit board designs. Engineered for high precision and low impact, the ZAM310 is setting a new benchmark in small-format depaneling.

With a zero-stress laser cutting process, nearby components remain untouched, no matter how close they are to the cutting path. The system precisely controls thermal effects, optimizing laser settings to minimize heat spread and material deformation. The system extracts fumes and particles from laser ablation in real time during operation, ensuring a clean and safe production environment.

Optional UV or green lasers, height sensors, barcode scanning, MES integration, and inline upgrade options make this machine incredibly adaptable. The Лазерная резка печатных плат ZAM310/FPC solution is trusted by top manufacturers for its reliability and accuracy.