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О Seprays
Founded in Taiwan(Genitec) in 1993, Сепреи фокусируется на технологические исследования и разработки и инновации. В 2002, это открыл филиал в Дунгуане (which was upgraded and reorganized into a дочерняя компания в 2013 году), полностью ответственный за Услуги по НИОКР, производству, продажам и послепродажному техническому обучению, обеспечивающий быстрое реагирование и всесторонняя поддержка for customer needs. To further expand production, in 2003, it приобрел почти 20 акров земли в провинции Чжэцзян и установил 20,000-square-meter modern industrial plant, thereby увеличение производственных мощностей и производственных возможностей.
Компания Seprays занимается удалением панелей с печатных плат / FPC уже более 30 лет. Его основные продукты включают в себя съемники фрез, лазерные депанеллеры, Съемники с V-образными пазами, и штемпелюющие депанеллеры, а также автоматизированные решения для погрузки и разгрузочных работ для снятия панелей с переднего и заднего концов, включая установку пластин. Это высокотехнологичное предприятие, объединяющее исследования и разработки, производство, продажи и сервисное обслуживание.
Seprays предоставляет полный спектр услуг по оборудованию компаниям из списка Fortune Global 500 и 500 крупнейших компаний Китая, включая Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO и ZTE, а также малые и средние предприятия. Комплексные линии разделения панелей Seprays широко используются на заводах как внутри страны, так и за рубежом.
Сервис для Глобальных
Комплексное решение для снятия панелей с печатных плат
31
Страны и регионы
33
Многолетний опыт в производстве промышленного оборудования SMT
180+
Патенты и сертификаты
Партнеры
Отделочные машины Seprays — им доверяют более 3000 лидеров отрасли по всему миру.
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Новости
Информация о Снятии панелей С печатных Плат и новости производства
NEPCON ASIA 2026 Comes to a Close: Three Days of Conversations, Connections, and New Ideas
October 30, 2026 | Shenzhen, China Three days went by quickly. NEPCON ASIA 2026 has officially come to a close, and as we look back on our few days in Shenzhen, one thing stands out: the people we met. From October 27 to 29, the SEPRAYS team was at Hall 13, Booth 13F76, meeting visitors, connecting with industry professionals, and sharing ideas about PCB depaneling, automation, and electronics manufacturing. For us, an exhibition is never just about displaying equipment. It is also about listening, learning, and understanding what manufacturers are facing in their everyday production environments. 🤝 More Than an Exhibition: The Value of Meeting People Throughout the exhibition, we had the opportunity to meet people from different backgrounds and
SEPRAYS at NEPCON ASIA 2026: A Look Inside the Shenzhen Exhibition
October 27–29, 2026 | Shenzhen, China SEPRAYS is taking part in NEPCON ASIA 2026 in Shenzhen, China, joining industry professionals to explore developments in electronics manufacturing, surface-mount technology (SMT), and PCB processing. In this exhibition video, Wendy from SEPRAYS shares a glimpse of the event and the atmosphere at the exhibition venue. Exploring Electronics Manufacturing Trends Electronics manufacturing continues to evolve as manufacturers work to improve production efficiency, maintain consistent quality, and adapt to increasingly complex PCB designs. From SMT production to PCB processing and automation, manufacturing technologies play an important role in supporting modern electronics production. Industry exhibitions provide opportunities to observe new developments, exchange technical perspectives, and better understand the challenges manufacturers face across different production environments. Connecting
SEPRAYS at NEPCON ASIA 2026: Connecting Through PCB Depaneling and Automation
October 27–29, 2026 | Shenzhen, China SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition & Convention Center. At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements. Exploring PCB Depaneling and Automation As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing. Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology. Laser depaneling and automated mechanical separation offer different advantages depending on the application. Understanding these
How to Reduce PCB Depaneling Stress Around Sensitive Components
PCB depaneling stress is easy to overlook until a production line starts seeing cracked ceramic capacitors, unstable solder joints, or unexplained failures during reliability testing. For manufacturers producing compact, high-density electronic assemblies, separating boards is not just a cutting operation. It is part of quality control. The challenge becomes more serious when components sit close to the board edge. A small amount of bending or vibration can create problems that are difficult to detect during routine inspection. 🔍 1. Which Components Are Most at Risk? Not every component responds to separation forces in the same way. Multilayer ceramic capacitors (MLCCs), fine-pitch packages, BGAs, and heavy connectors deserve particular attention. Common warning signs include: The damage may not appear immediately after
Seprays — Ваш специалист по удалению печатных плат.
Потому что мы знаем, что даже самые лучшие продукты настолько сильны, насколько сильны люди, стоящие за ними.
Вот почему мы предоставляем экспертная техническая поддержка 24/7— когда и где бы вам это ни понадобилось.
