ZAM310H Offline Precision Laser Depaneling Machine

В ZAM310H Offline Precision Laser Depaneling Machine provides high-accuracy, stress-free cutting for PCBs and FPCs using UV and CO₂ laser technology. It delivers clean, burr-free edges with minimal heat effect, supporting a wide range of materials including FR4, PI, LCP, ceramics, and RF substrates. With optimised cutting paths, advanced software, and a user-friendly interface, it ensures fast and reliable processing. Designed with cooling, dust extraction, and MES compatibility, the ZAM310H guarantees stable, efficient, and precise performance for batch and mass electronics production in automotive, telecom, and medical industries.

Категория: Лазерное Удаление панелей с печатных плат Тег: Offline Laser Depaneling, ZAM310H

Specifications

Предмет	ZAM310H
Platform Type	Single Platform
Processing Area	350 × 350 mm
Точность повторения	±2 μm
Overall Accuracy	±25 μm
X/Y Resolution	1 μm
Max. Material Thickness	≤2.0 mm
Platform Structure	Steel Structure
Motor Type	Servo Motor
Laser Type	Nanosecond
Laser Power	15 W
Telecentric Lens Range	50 × 50 mm f=100 mm (Domestic Galvo)
CCD Structure	Coaxial
Positioning Accuracy	0.01 mm
Camera Resolution	1.3 MP
Control Software	Создатель мечты 3
Программное обеспечение для обработки данных	Circuit CAM 7.5 Standard
File Formats	LMD, Standard Gerber (RS-274-D), Extended Gerber (RS-274-X), DXF, Excellon, Sieb & Meier, HP-GL, Barco DPF, ODB++
Working Environment	22℃ ± 2℃
Источник питания	380 VAC / 50 Hz / 2 kW
Вес	Approx. 580 kg
Dimensions (L × W × H)	930 × 1270 × 1600 mm

В ZAM310H Offline Precision Laser Depaneling Machine is a high-performance solution for precise, stress-free separation of PCBs and flexible circuits. Built for demanding industries, it combines advanced UV and CO₂ laser technology with intelligent software to deliver consistent, burr-free results.

⚡ Precision Laser Cutting

UV laser: ultra-fine cut width of 25–40 μm, minimal thermal impact, no carbonisation
CO₂ laser: cut width of 120–220 μm, excellent for resin-based materials
Non-contact cutting prevents mechanical stress and damage
Supports a wide range of materials, including PCBA, FPC, LCP, MPI, PI, PET, FR4, FR5, CEM, HTCC/LTCC ceramics, and RF materials

🔄 Flexible Offline Operation

Optimised cutting paths for higher efficiency and shorter cycle times
Powerful graphic editing software for fast data processing
Easy-to-use GUI interface with a low learning curve
Optional advanced functions: pulse following, drilling, and Skywriting for enhanced control

🛠 Versatile Applications

The ZAM310H is ideal for:

FPC outline cutting
PCBA depaneling
Coverlay window cutting
Gold finger processing
High-reliability applications in automotive, telecom, medical, and consumer electronics

🌍 Industrial-Grade Reliability

Stable platform and precision motion system for accuracy
Advanced cooling and dust extraction ensure clean operation
Seamless integration with MES systems for real-time data and traceability
Designed for batch and mass production with consistent performance

В ZAM310H Offline Precision Laser Depaneling Machine delivers unmatched precision, flexibility, and efficiency. Whether used for FPCs, PCBAs, or specialised materials, it is the perfect choice for manufacturers who demand superior quality and high productivity in electronic assembly.