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Russian Inline PCB Depaneling in Action: A Real-World Customer Application
Inline PCB depaneling becomes interesting when production is no longer limited by the cutting process itself, but by everything happening around it. In a high-volume electronics factory, operators may still need to load panels, align boards, separate finished PCBs, collect waste, and move products to the next process. Each action looks small. Across thousands of […]
🇨🇳 Celebrating China’s National Day 2026
October 1 marks China’s National Day, a time to reflect on the country’s journey, achievements, and continued development. In 2026, China celebrates the 77th anniversary of the founding of the People’s Republic of China. Over the decades, the country has experienced significant changes across manufacturing, technology, infrastructure, and international trade. For Seprays, this occasion is […]
Custom PCB Depaneler for Safer Production: A Real-World Customer Application
Custom PCB Depaneler is not always about building a completely new machine. In many production lines, the real requirement is much simpler: make the existing PCB separation process safer, more repeatable, and easier for operators to control. This becomes especially important when a PCB has a V-groove, sensitive components close to the cutting line, or […]
Celebrating Mid-Autumn Festival Together at Seprays & Genitec
Before the Mid-Autumn Festival, there is one tradition we never want to miss at Seprays & Genitec: making mooncakes together. We have kept this tradition for many years. It is a simple activity, but it has become one of the moments our team looks forward to every year. This year, the mooncake ingredients were prepared […]
PCB Depaneling for Leading Smartphone Manufacturers: A Real-World Customer Application
PCB depaneling becomes much less forgiving when the board is part of a modern smartphone. The boards are smaller. Components are packed closer together. Production volumes are high. And a small problem at the separation stage can create much more work downstream. That is why a smartphone PCB should not be treated simply as “another […]
From PCB Infeed to Tray Loading: A Fully Automated Laser Depaneling Solution
Laser depaneling becomes much more interesting when it is no longer a standalone cutting operation. In a modern electronics factory, the question is often bigger than how quickly a PCB can be separated. What happens before cutting? How is the PCB positioned? How are separated boards transferred? Who loads the trays? And what happens when […]
When Should You Choose a Fixtureless PCB Separator?
Fixtureless PCB separation sounds attractive when production teams are dealing with frequent PCB changes. No dedicated fixture to store. No fixture change every time the product changes. Less preparation before production. But there is a catch. A fixtureless process is not automatically the better choice. The real question is whether the PCB can be separated […]
PCB Routing in Action: A Real-World Depaneling Solution at a Customer Production Site
PCB routing sounds simple until it becomes part of a real production line. A semiconductor electronics manufacturer was facing a familiar problem: the PCB panels were changing, production volume was increasing, and manual separation was becoming harder to control. The team did not simply need a faster cutter. They needed a process that could load […]
PCB Milling in Action: A Real-World Depaneling Solution at a Customer Production Site
PCB milling is not always the first process engineers think about when choosing a depaneling method. But on a real production line, the question is usually more practical: Can we separate the boards cleanly without damaging components, slowing production, or creating unnecessary costs? That question became particularly relevant at a semiconductor electronics manufacturing site where […]
Automated Laser PCB Depaneling for AI Hardware and High-Performance Electronics Manufacturing
Automated Laser PCB Depaneling becomes much more interesting when the PCB is no longer a simple board. AI servers, semiconductor equipment, automotive electronics, and high-performance computing systems often use boards with dense components, fine traces, unusual outlines, and tighter quality requirements. In these applications, the question is not simply, “How fast can we separate the […]
