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规格
| 项目 | ZAM310 |
|---|---|
| 切割区域 | 350*350mm |
| 移动方式 | 真空吸嘴吸附移动 |
| 流向 | single |
| 加工台面 | ±2μm |
| 机台重复精度 | ±20μm |
| 环境温度 | 22℃±2℃(71.6℉±2℉) |
| 设备平台 | 钢架 |
| 激光波长 | 355nm/532nm |
| 接收数据格式 | Gerber, HPGL, Sieb & Meier, Excellon, ODB++ |
| 操作系统 | Windows 7 / Windows 10 |
| 目标读取 | CCD automatic target cap. The true Target shape is irregular.
No Target, DIL is required. Modules |
| 切割软件 | DreamCreaTor |
| 数据处理软件 | CircuitCAM 7 |
| XYZ轴驱动方式 | Servo motor + lead screw |
| 电压/电源要求 | AC380V 50/60Hz 2.5KW 三相 |
| 气压要求 | 0.6MPa，50L/min |
| 尺寸（宽*深*高） | 1050mm x 1600mm x 1270mm |
| 设备重量 | 600KG |
High-precision, high-quality, new standards for small-format equipment. With the rapid development of electronic technology, designers are assembling more and more dense, smaller, and more components onto smaller, thinner, and more irregular circuit boards, which brings greater challenges to the subsequent board separation process. To this end, Zhimao provides a more environmentally friendly, fast, precise, and reliable solution to meet the needs of this trend.
Equipment features:
Direct data drive: immediate production, rapid product introduction
High degree of automation: equipped with a feeder, ready to enter the line at any time.High degree of automation
Breaking through mechanical limits: laser replaces molds to avoid distortion and break through mechanical limits
.
Non-contact processing: When light encounters the material, it sublimates without contact, eliminating stress damage.
Precise laser control: precise laser control, fixed depth and quantity, micron-level extreme structure
SEPRAYS introduces the ZAM310 PCB/FPC激光分板机 system—an advanced solution built for today’s increasingly compact, irregular, and high-density circuit board designs. Engineered for high precision and low impact, the ZAM310 is setting a new benchmark in small-format depaneling.
With a zero-stress laser cutting process, nearby components remain untouched, no matter how close they are to the cutting path. The system precisely controls thermal effects, optimizing laser settings to minimize heat spread and material deformation. The system extracts fumes and particles from laser ablation in real time during operation, ensuring a clean and safe production environment.
Optional UV or green lasers, height sensors, barcode scanning, MES integration, and inline upgrade options make this machine incredibly adaptable. The ZAM310 PCB/FPC激光分板机 solution is trusted by top manufacturers for its reliability and accuracy.
Contact us now and discover why over 3,000 leading companies trust SEPRAYS for their PCB depaneling needs.
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