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約Seprays
Founded in Taiwan(Genitec) in 1993, Seprays 主 技術のR&Dとイノベーション. に 2002ので、 支店を開設し東莞 (which was upgraded and reorganized into a 子会社2013年)全責任者 研究開発、生産、販売、販売後の技術トレーニングサービスを確保 急速な対応を総合的に支援 for customer needs. To further expand production, in 2003, it 購入した20ヘクタールの畑に浙江省 を設置 20,000-square-meter modern industrial plant, thereby 生産能力と製造能力.
Sepraysは、PCB/FPC depaneling分野で30年以上に渡 その主な製品 フライスカッター depanelers, レーザー depanelers, V溝depanelersは、 プレス加工depanelersなど 自動入出庫シ 前後両端depanelingを含むプレートを配置。 です ハイテクノロジー企業の融合研究開発、生産、販売、サービスです。
Sepraysの提供全ての機器サービスにフォーチュン-グローバル500に、中国のトップ500社含む Foxconn,Flextronics、グリッドLuxshare,Compal,Wistron、ボッシュは、中国電子量子コンピュータCRRC株式会社、中国航空宇宙科学技術株式会社、OPPO、ZTEなど 中堅-中小企業. Seprays全パネル分離ラインに広く使用されて工場の工-販売事業を行っております。
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pcbの完全なソリューションをdepaneling
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Seprays depaneling機から信頼される3,000点以上の業界リーダーです。
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新着情報
Automated PCB Depaneling and Board Unloading for Efficient Electronics Manufacturing
In modern electronics manufacturing, improving production efficiency involves more than increasing cutting speed. Material handling, product transfer, and process coordination also play important roles. The Seprays GAM336AT In-Line Automatic PCB Router Depaneling Machine, combined with a PCB Board Unloader, provides an integrated approach to PCB separation and downstream board handling. This solution is designed to help manufacturers streamline PCB depaneling, reduce repetitive manual operations, and create a more continuous production workflow. Why PCB Unloading Matters in Automated Electronics Manufacturing PCB depaneling is an important step in PCBA production. After components are assembled and the PCB panel passes through the required inspection processes, individual boards need to be separated and transferred to the next production stage. However, manual unloading can create
NEPCON ASIA 2026 Comes to a Close: Three Days of Conversations, Connections, and New Ideas
October 30, 2026 | Shenzhen, China Three days went by quickly. NEPCON ASIA 2026 has officially come to a close, and as we look back on our few days in Shenzhen, one thing stands out: the people we met. From October 27 to 29, the SEPRAYS team was at Hall 13, Booth 13F76, meeting visitors, connecting with industry professionals, and sharing ideas about PCB depaneling, automation, and electronics manufacturing. For us, an exhibition is never just about displaying equipment. It is also about listening, learning, and understanding what manufacturers are facing in their everyday production environments. 🤝 More Than an Exhibition: The Value of Meeting People Throughout the exhibition, we had the opportunity to meet people from different backgrounds and
SEPRAYS at NEPCON ASIA 2026: A Look Inside the Shenzhen Exhibition
October 27–29, 2026 | Shenzhen, China SEPRAYS is taking part in NEPCON ASIA 2026 in Shenzhen, China, joining industry professionals to explore developments in electronics manufacturing, surface-mount technology (SMT), and PCB processing. In this exhibition video, Wendy from SEPRAYS shares a glimpse of the event and the atmosphere at the exhibition venue. Exploring Electronics Manufacturing Trends Electronics manufacturing continues to evolve as manufacturers work to improve production efficiency, maintain consistent quality, and adapt to increasingly complex PCB designs. From SMT production to PCB processing and automation, manufacturing technologies play an important role in supporting modern electronics production. Industry exhibitions provide opportunities to observe new developments, exchange technical perspectives, and better understand the challenges manufacturers face across different production environments. Connecting
SEPRAYS at NEPCON ASIA 2026: Connecting Through PCB Depaneling and Automation
October 27–29, 2026 | Shenzhen, China SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition & Convention Center. At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements. Exploring PCB Depaneling and Automation As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing. Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology. Laser depaneling and automated mechanical separation offer different advantages depending on the application. Understanding these
