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Acerca De Seprays
Founded in Taiwan(Genitec) in 1993, Seprays se centra en tecnológicas de I + D y la innovación. En 2002, se establecido una sucursal en Dongguan (which was upgraded and reorganized into a filial en 2013), totalmente responsable de R&D, producción, ventas y postventa de servicios de formación técnica, asegurando la rapidez de respuesta y apoyo integral for customer needs. To further expand production, in 2003, it comprado casi 20 acres de tierra en la Provincia de Zhejiang y estableció un 20,000-square-meter modern industrial plant, thereby aumentar la capacidad de producción y las capacidades de fabricación.
Seprays se ha dedicado a la PCB/FPC depaneling campo durante más de 30 años. Sus productos principales incluyen fresa depanelers, láser depanelers, V-groove depanelersy estampación depanelers, así como automatizado de carga y descarga de las soluciones para los extremos delantero y trasero de depaneling, incluyendo la placa de colocación. Es un la empresa de alta tecnología que integra el R&D, producción, ventas y servicio.
Seprays ofrece una línea completa de equipos de los servicios de Fortune Global 500 y China Top 500 empresas, incluyendo Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, Electrónica de China, Quanta Computer, CRRC Corporation Limited, China Aeroespacial de la Corporación de Ciencia y Tecnología, OPPO, y ZTE, así como las pequeñas y medianas empresas. Seprays' panel completo las líneas de separación son ampliamente utilizados en las fábricas, tanto a nivel nacional como internacional.
Servicio para Global
PCB Depaneling solución Total
31
Países Y Regiones
33
Años de experiencia en SMT de fabricación de equipos industriales
180+
Las Patentes Y Los Certificados De
Socios
Seprays depaneling máquinas de confianza por más de 3.000 líderes de la industria en todo el mundo.
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Noticias
PWB Depaneling Percepciones y la Fabricación de las Noticias

When Should You Choose a Fixtureless PCB Separator?
Fixtureless PCB separation sounds attractive when production teams are dealing with frequent PCB changes. No dedicated fixture to store. No fixture change every time the product changes. Less preparation before production. But there is a catch. A fixtureless process is not automatically the better choice. The real question is whether the PCB can be separated reliably without depending on a dedicated mechanical fixture. For some semiconductor and electronics manufacturers, that can save time and reduce recurring tooling costs. For others, a properly designed fixture still provides better support and repeatability. So when should you choose a fixtureless approach? 🏭 Start With the Production Problem Imagine a factory running eight PCB models during the same week. Model A runs in the

PCB Routing in Action: A Real-World Depaneling Solution at a Customer Production Site
PCB routing sounds simple until it becomes part of a real production line. A semiconductor electronics manufacturer was facing a familiar problem: the PCB panels were changing, production volume was increasing, and manual separation was becoming harder to control. The team did not simply need a faster cutter. They needed a process that could load the panel, locate it correctly, follow the programmed contour, and separate the boards with consistent edge quality. This is where a GAM330 automatic PCB router machine from Seprays Group was evaluated for the production application. 🏭 Customer Production Challenge The customer manufactures electronic assemblies used in a semiconductor-related application. At first, the depaneling process looked manageable. But several small problems started adding up. Operators had

PCB Milling in Action: A Real-World Depaneling Solution at a Customer Production Site
PCB milling is not always the first process engineers think about when choosing a depaneling method. But on a real production line, the question is usually more practical: Can we separate the boards cleanly without damaging components, slowing production, or creating unnecessary costs? That question became particularly relevant at a semiconductor electronics manufacturing site where the production team was working with different PCB outlines, relatively high-value assemblies, and frequent product changes. Instead of looking for the fastest cutting method on paper, the team focused on something more useful: which process could remain stable when the PCB design changed? 🏭 The Production Problem Was More Than Just Cutting The customer was producing electronic assemblies for semiconductor-related equipment. The PCB panels were

Automated Laser PCB Depaneling for AI Hardware and High-Performance Electronics Manufacturing
Automated Laser PCB Depaneling becomes much more interesting when the PCB is no longer a simple board. AI servers, semiconductor equipment, automotive electronics, and high-performance computing systems often use boards with dense components, fine traces, unusual outlines, and tighter quality requirements. In these applications, the question is not simply, “How fast can we separate the panel?” A better question is: Can the separation process keep up with the board’s accuracy, quality, and automation requirements? That is where laser processing starts to make practical sense. 🔍 Why AI Hardware Changes the Depaneling Problem AI hardware is pushing electronics manufacturing toward higher component density and more complex PCB structures. A small amount of mechanical stress can become a quality concern when components
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