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Acerca De Seprays
Founded in Taiwan(Genitec) in 1993, Seprays se centra en tecnológicas de I + D y la innovación. En 2002, se establecido una sucursal en Dongguan (which was upgraded and reorganized into a filial en 2013), totalmente responsable de R&D, producción, ventas y postventa de servicios de formación técnica, asegurando la rapidez de respuesta y apoyo integral for customer needs. To further expand production, in 2003, it comprado casi 20 acres de tierra en la Provincia de Zhejiang y estableció un 20,000-square-meter modern industrial plant, thereby aumentar la capacidad de producción y las capacidades de fabricación.
Seprays se ha dedicado a la PCB/FPC depaneling campo durante más de 30 años. Sus productos principales incluyen fresa depanelers, láser depanelers, V-groove depanelersy estampación depanelers, así como automatizado de carga y descarga de las soluciones para los extremos delantero y trasero de depaneling, incluyendo la placa de colocación. Es un la empresa de alta tecnología que integra el R&D, producción, ventas y servicio.
Seprays ofrece una línea completa de equipos de los servicios de Fortune Global 500 y China Top 500 empresas, incluyendo Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, Electrónica de China, Quanta Computer, CRRC Corporation Limited, China Aeroespacial de la Corporación de Ciencia y Tecnología, OPPO, y ZTE, así como las pequeñas y medianas empresas. Seprays' panel completo las líneas de separación son ampliamente utilizados en las fábricas, tanto a nivel nacional como internacional.
Servicio para Global
PCB Depaneling solución Total
31
Países Y Regiones
33
Años de experiencia en SMT de fabricación de equipos industriales
180+
Las Patentes Y Los Certificados De
Socios
Seprays depaneling máquinas de confianza por más de 3.000 líderes de la industria en todo el mundo.
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Noticias
PWB Depaneling Percepciones y la Fabricación de las Noticias
NEPCON ASIA 2026 Comes to a Close: Three Days of Conversations, Connections, and New Ideas
October 30, 2026 | Shenzhen, China Three days went by quickly. NEPCON ASIA 2026 has officially come to a close, and as we look back on our few days in Shenzhen, one thing stands out: the people we met. From October 27 to 29, the SEPRAYS team was at Hall 13, Booth 13F76, meeting visitors, connecting with industry professionals, and sharing ideas about PCB depaneling, automation, and electronics manufacturing. For us, an exhibition is never just about displaying equipment. It is also about listening, learning, and understanding what manufacturers are facing in their everyday production environments. 🤝 More Than an Exhibition: The Value of Meeting People Throughout the exhibition, we had the opportunity to meet people from different backgrounds and
SEPRAYS at NEPCON ASIA 2026: A Look Inside the Shenzhen Exhibition
October 27–29, 2026 | Shenzhen, China SEPRAYS is taking part in NEPCON ASIA 2026 in Shenzhen, China, joining industry professionals to explore developments in electronics manufacturing, surface-mount technology (SMT), and PCB processing. In this exhibition video, Wendy from SEPRAYS shares a glimpse of the event and the atmosphere at the exhibition venue. Exploring Electronics Manufacturing Trends Electronics manufacturing continues to evolve as manufacturers work to improve production efficiency, maintain consistent quality, and adapt to increasingly complex PCB designs. From SMT production to PCB processing and automation, manufacturing technologies play an important role in supporting modern electronics production. Industry exhibitions provide opportunities to observe new developments, exchange technical perspectives, and better understand the challenges manufacturers face across different production environments. Connecting
SEPRAYS at NEPCON ASIA 2026: Connecting Through PCB Depaneling and Automation
October 27–29, 2026 | Shenzhen, China SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition & Convention Center. At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements. Exploring PCB Depaneling and Automation As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing. Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology. Laser depaneling and automated mechanical separation offer different advantages depending on the application. Understanding these
How to Reduce PCB Depaneling Stress Around Sensitive Components
PCB depaneling stress is easy to overlook until a production line starts seeing cracked ceramic capacitors, unstable solder joints, or unexplained failures during reliability testing. For manufacturers producing compact, high-density electronic assemblies, separating boards is not just a cutting operation. It is part of quality control. The challenge becomes more serious when components sit close to the board edge. A small amount of bending or vibration can create problems that are difficult to detect during routine inspection. 🔍 1. Which Components Are Most at Risk? Not every component responds to separation forces in the same way. Multilayer ceramic capacitors (MLCCs), fine-pitch packages, BGAs, and heavy connectors deserve particular attention. Common warning signs include: The damage may not appear immediately after
Seprays — Su PWB Depaneling de Expertos.
Porque sabemos que incluso los mejores productos son sólo tan fuerte como la gente detrás de ellos.
Es por eso que ofrecemos 24/7 de apoyo técnico experto—cuando y donde usted lo necesita.
