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설명
| 모델 | ZAM310 |
|---|---|
| 유효한 크기로 절단 | 350*350mm |
| 절단 기능 | 트위닝 스트레이트 라인,L 모양,U 모양,Circle,Arc |
| 프로세스 테이블 | 단일 |
| 반복 정밀도 | ±2μm |
| 절단 정밀도 | ±20μm |
| 주변 온도 | 22℃±2℃(71.6℉±2℉) |
| 플랫폼 | 강철 구조 |
| 레이저 파장 | 355nm/532nm |
| 수신 데이터의 외형 | Gerber,HPGL,료입&Meier,Excellon,ODB++ |
| 운영 체제 | Windows7/Windows10 |
| 대상 읽 | CCD automatic target cap. The true Target shape is irregular.
No Target, DIL is required. Modules |
| 절단 소프트웨어 | DreamCreaTor |
| 데이터 처리 소프트웨어 | CircuitCAM7 |
| XYZ 축 운전 모드 | 자동 귀환 제어 장치 모터+리드 스크류 |
| 전압/전원 요구사항 | AC380V50/60Hz2.5KW three phase |
| 압축 공기를 넣은 압력이 필요조건 | 0.6MPa，50L/min |
| 크기(W*D*H) | 1050mm x1600mm x1270mm |
| 체중 | 600KG |
High-precision, high-quality, new standards for small-format equipment. With the rapid development of electronic technology, designers are assembling more and more dense, smaller, and more components onto smaller, thinner, and more irregular circuit boards, which brings greater challenges to the subsequent board separation process. To this end, Zhimao provides a more environmentally friendly, fast, precise, and reliable solution to meet the needs of this trend.
Equipment features:
Direct data drive: immediate production, rapid product introduction
High degree of automation: equipped with a feeder, ready to enter the line at any time.High degree of automation
Breaking through mechanical limits: laser replaces molds to avoid distortion and break through mechanical limits
.
Non-contact processing: When light encounters the material, it sublimates without contact, eliminating stress damage.
Precise laser control: precise laser control, fixed depth and quantity, micron-level extreme structure
SEPRAYS introduces the ZAM310/PCB FPC 레이저 절단 system—an advanced solution built for today’s increasingly compact, irregular, and high-density circuit board designs. Engineered for high precision and low impact, the ZAM310 is setting a new benchmark in small-format depaneling.
With a zero-stress laser cutting process, nearby components remain untouched, no matter how close they are to the cutting path. The system precisely controls thermal effects, optimizing laser settings to minimize heat spread and material deformation. The system extracts fumes and particles from laser ablation in real time during operation, ensuring a clean and safe production environment.
Optional UV or green lasers, height sensors, barcode scanning, MES integration, and inline upgrade options make this machine incredibly adaptable. The ZAM310/PCB FPC 레이저 절단 solution is trusted by top manufacturers for its reliability and accuracy.
Contact us now and discover why over 3,000 leading companies trust SEPRAYS for their PCB depaneling needs.
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