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에 대한 Seprays
Founded in Taiwan(Genitec) in 1993, Seprays 에 초점을 맞추고 기술 R&D 혁신. 에 2002그 에 지점을 설립하 Dongguan (which was upgraded and reorganized into a 2013 년에는 자회사),에 대해 책임을 져야 R&D,생산,판매 및 판매 후 기술 교육 서비스보 신속한 응답이고 포괄적인 지원 for customer needs. To further expand production, in 2003, it 구매하는 거의 20 에이커의 땅에서는 절강성 설립 20,000-square-meter modern industrial plant, thereby 증가하고 생산 능력 및 제조 능력.
Seprays 전념하고있/PCB FPC 진 분야에 대한 30 년 이상이다. 그것의 주요 제품은 다음을 포함합니다 밀링 커터 depanelers, 레이저 depanelers, V-groove depanelers고 스탬핑 depanelers뿐만 아니라, 자동화 로딩 및 언 로딩 솔루션 에 대한 전면 및 후면 끝의 구분 포함하여 플레이트에 배치했다. 그것은 high-tech enterprise integrating R&D,생산,판매하고,서비스가 프로페셔널하다.
Seprays 제공합의 완전한 라인 장비 서비스를 Fortune Global500 그리고 중국 최고 회사 500함 Foxconn,Flextronics,상태,그리드 강제 여전히 완화,컴팔,Wistron,Bosch,중국 전자공학,양자 컴퓨터,CRRC Corporation 제한된,중국 항공 우주 과학과 기술 Corporation,OPPO,및 ZTE뿐만 아니라, 중소기업. Seprays'완판 분리 선에서에서 널리 이용 된 공장이 모두 국내 및 국제적으로 합니다.
Global을 위한 서비스
PCB 디판링 토탈 솔루션입니다
31
국가&지역
33
는 경험의 년에서 SMT 산업 장비 제조
180+
특허 및 인증서
파트너
Seprays 진 기계—신뢰할 수 있 3,000 개 이상의 업계 지도자들은 세계적입니다.
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뉴스
Live at NEPCON Shanghai 2026: Fully Automated Inline PCB Depaneling Solution
Seprays & Genitec is exhibiting at NEPCON Shanghai 2026. Visitors can experience our fully automated Inline PCB Depaneling Solution running live on-site. The system automates the entire process from board loading to scrap collection. No manual intervention is required. This helps manufacturers reduce labor costs and improve production efficiency. A dual-worktable design enables simultaneous cutting and loading/unloading. The result is a smoother production flow and higher throughput. The solution can also be integrated with post-cut inspection and intelligent tray loading. This creates a complete automated inline depaneling process for modern SMT production lines. Our team is available at the booth to discuss applications, production challenges, and automation solutions. 📍 Hall 1, Booth 1H80📅 June 2–4, 2026🏢 Shanghai World Expo Exhibition
PCB Depaneling and Tray Handling Automation for Smart Factories in 2026
PCB depaneling and tray handling automation is becoming a critical topic for electronics manufacturers in 2026. As production volumes increase and product designs become more complex, manual depaneling and tray management are creating bottlenecks that many factories can no longer ignore. For SMT manufacturers, the challenge is no longer just cutting PCBs accurately. It is about maintaining continuous production flow, reducing labor dependency, ensuring traceability, and improving consistency from panel separation to final product collection. Many factories are now asking a different question: “How can we automate the entire post-SMT process instead of optimizing only the depaneling step?” The answer increasingly lies in integrated depaneling and tray handling systems. 🚀 Why Traditional PCB Depaneling Processes Are Becoming a Bottleneck A
Inline vs Offline PCB Separation — Which Is Better for SMT Factories?
Inline PCB separation is becoming a hot topic among SMT manufacturers in 2026. Not because offline depaneling has disappeared. In fact, many successful factories still rely on offline systems every day. The real question is different: Which solution creates the best balance between productivity, flexibility, quality, and long-term operating costs? The answer depends on your production environment. A factory producing millions of identical automotive PCBs may need a completely different approach from an EMS provider handling dozens of product changes every week. This article explores the practical differences between inline and offline PCB separation from an engineer’s perspective. 🏭 Why More SMT Factories Are Re-Evaluating Their Depaneling Process Over the past few years, electronics manufacturing has changed significantly. Factories are
Low-Stress PCB Cutting for Medical Electronics
Low-stress PCB cutting is no longer optional in modern medical electronics production. Devices such as wearable monitors, implantable sensors, diagnostic instruments, and portable imaging systems demand not only precision but also extreme care during PCB separation. Even a small crack, micro-fracture, or stress-induced defect can compromise device reliability, regulatory compliance, and patient safety. In 2026, medical electronics manufacturers are focusing on cutting techniques that preserve PCB integrity while supporting high-throughput production. 🩺 Why Low-Stress PCB Cutting Matters in Medical Devices Medical electronics PCBs often have: High mechanical stress during depaneling can lead to: Factories that underestimate stress management risk: A low-stress cutting approach safeguards both quality and regulatory adherence. ⚙️ Common PCB Stress Points in Medical Production Even minor errors
Seprays—의 PCB 구분 전문가입니다.
기 때문에 우리가 알고 있는 최고의 제품으로 사람들입니다.
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