Новейшие продукты
О Seprays
Founded in Taiwan(Genitec) in 1993, Сепреи фокусируется на технологические исследования и разработки и инновации. В 2002, это открыл филиал в Дунгуане (which was upgraded and reorganized into a дочерняя компания в 2013 году), полностью ответственный за Услуги по НИОКР, производству, продажам и послепродажному техническому обучению, обеспечивающий быстрое реагирование и всесторонняя поддержка for customer needs. To further expand production, in 2003, it приобрел почти 20 акров земли в провинции Чжэцзян и установил 20,000-square-meter modern industrial plant, thereby увеличение производственных мощностей и производственных возможностей.
Компания Seprays занимается удалением панелей с печатных плат / FPC уже более 30 лет. Его основные продукты включают в себя съемники фрез, лазерные депанеллеры, Съемники с V-образными пазами, и штемпелюющие депанеллеры, а также автоматизированные решения для погрузки и разгрузочных работ для снятия панелей с переднего и заднего концов, включая установку пластин. Это высокотехнологичное предприятие, объединяющее исследования и разработки, производство, продажи и сервисное обслуживание.
Seprays предоставляет полный спектр услуг по оборудованию компаниям из списка Fortune Global 500 и 500 крупнейших компаний Китая, включая Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO и ZTE, а также малые и средние предприятия. Комплексные линии разделения панелей Seprays широко используются на заводах как внутри страны, так и за рубежом.
Сервис для Глобальных
Комплексное решение для снятия панелей с печатных плат
31
Страны и регионы
33
Многолетний опыт в производстве промышленного оборудования SMT
180+
Патенты и сертификаты
Партнеры
Отделочные машины Seprays — им доверяют более 3000 лидеров отрасли по всему миру.
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Новости
Информация о Снятии панелей С печатных Плат и новости производства

GAM336AT + ZM830 Automated PCB Depaneling Solution for Automotive Tire Pressure Sensors
Automotive electronics manufacturers are under constant pressure in 2026.Higher production volumes.Smaller PCB designs.Stricter quality requirements. For products like Tire Pressure Monitoring System (TPMS) sensors, stable PCB depaneling and automated handling are becoming just as important as SMT placement accuracy. This is where the combination of the GAM336AT PCB depaneling machine and the ZM830 Automatic Tray Stacking Machine helps improve line efficiency. 🚗 Why TPMS PCB Production Needs More Automation TPMS boards are small.But production challenges are not. Many factories still face problems such as: In automotive electronics manufacturing, even small interruptions can affect delivery schedules and yield rates. Especially for high-volume sensor products. ⚙️ GAM336AT + ZM830 Integrated Production Workflow The automated workflow combines PCB depaneling, pallet conveying, and tray

How to Reduce PCB Stress in High-Density Assemblies
PCB stress has quietly become one of the biggest reliability risks in high-density assemblies. A board may pass AOI.The solder joints may look perfect.Functional testing may even pass. But hidden mechanical stress inside the PCB can still create long-term failures later. In 2026, this problem is becoming more common because electronics are getting: Components are now placed closer to PCB edges.Multilayer boards are more fragile.And the depaneling processes that worked years ago may no longer be safe enough. For manufacturers working with automotive electronics, medical devices, communication modules, semiconductor systems, or industrial control boards, reducing PCB stress is no longer optional. It directly affects SMT yield and product reliability. 🔍 What Causes PCB Stress in High-Density Assemblies? PCB stress usually

Why PCB Edge Quality Affects SMT Yield
PCB edge quality is often ignored until production problems start showing up on the SMT line. Boards pass AOI.Placement accuracy looks normal.Reflow profiles are stable. But yield still drops. In many factories, the real issue is not the solder paste or the placement machine. It is the PCB edge itself. Poor depaneling quality can create burrs, stress cracks, edge deformation, and hidden micro-damage that directly affect SMT yield. As PCB designs become thinner and more compact in 2026, this issue is becoming harder to ignore. Especially in: Many engineers are now paying closer attention to how panels are separated — not just how fast. 🔍 What Does “PCB Edge Quality” Really Mean? PCB edge quality refers to the condition of

Why More Electronics Manufacturers Are Switching to Automated PCB Depaneling
Automated PCB depaneling is becoming a serious topic in electronics manufacturing circles in 2026. Not because it is “new,” but because production realities have changed. Labor costs are rising.PCB designs are getting denser.SMT lines are running faster.And manual separation methods are starting to create bottlenecks. Many factories that once relied on manual routing or standalone cutting stations are now rethinking the entire depaneling process. Especially in automotive electronics, communication devices, medical PCBA, and consumer electronics production. The shift is not only about speed.It is about consistency, yield, and long-term manufacturing stability. 🔍 Why Manual PCB Depaneling Is Becoming a Problem A common issue in many SMT factories looks like this: Orders increase.Placement machines run continuously.But depaneling still depends on operators
Seprays — Ваш специалист по удалению печатных плат.
Потому что мы знаем, что даже самые лучшие продукты настолько сильны, насколько сильны люди, стоящие за ними.
Вот почему мы предоставляем экспертная техническая поддержка 24/7— когда и где бы вам это ни понадобилось.


