PCB、分割的解决方案
Hioh-精确的PCB、分割的解决方案现代化的电子产品的制造
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激光、分割的解决方案
高精度、压力的激光、分割的解决方案现代化的电子产品制造。
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路由器、分割的解决方案
高精度的路由器、分割的解决方案设计的清洁削减,低压力和稳定的生产。
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看到刀片、分割的解决方案
高效率的锯片、分割的解决方案设计用于切割和高容量的PCB的生产。
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关于Seprays

成立于台湾在1993年, Seprays 重点是 技术的研发和创新. 在 2002设立了一个分支在东莞 (升级,并重组为一个 附属公司在2013年),完全负责 研发、生产、销售和售后的技术培训服务确保 快速反应和全面的支持 客户的需求。 为进一步扩大生产, 2003购买了近20英亩的土地,在浙江省 并设立了一个 20,000平方米的现代化工厂, 增加生产能力和制造能力.

Seprays已经被专用于PCB/FPC、分割领域超过30年。 其主要产品包括 铣刀depanelers, 激光depanelers, V-槽depanelers冲压depanelers以及 自动化装载和卸载解决方案 对于前端和后端的分板,包括板的位置。 这是一个 高新技术企业的研发、生产、销售和服务。

Seprays提供一个完整的设备服务的全球财富500中国500家公司包括 富士康、Flextronics,国家电网,立讯,拉美竞争和消费者保护方案,纬创博世,中国电子产品、量子计算机,CRRC有限公司,中国航空航天科学和技术公司,具,并且中兴以及 小型和中小型企业. Seprays'完全小组分离线被广泛使用的工厂在国内和国际。

该公司是 ISO9001,ISO14001,并ISO45001认证持有 CE认证和拥有 超过100硬件和软件专利. 它的工作 两个现代化工厂的复盖超过26,000平方米 在中国大陆和有 服务的地点,在全国九个城市提供 全国范围内售后服务. 销售和服务地点中的31个国家 提供 及时客户服务。

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服务全球

PCB拆板整体解决方案

31

国家和地区

32

多年的经验,在SMT工业设备的制造

180+

专利证书

合作伙伴

Seprays、分割机器—信任的3 000多行业的领导人。

Seprays Partners

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PCB、分割的见解和制造新闻

保持更新最新的PCB、分割技术、路由选择解决方案和行业趋势,从真正的SMT生产环境。
Why Saw Blade Depaneling Is Common in Mass PCB Production

Why Saw Blade Depaneling Is Common in Mass PCB Production

Saw blade depaneling is one of those processes that rarely gets the spotlight, yet it quietly supports high-volume PCB manufacturing every day. If you’ve ever dealt with tight production schedules or cost pressure, you’ve probably seen why this method keeps showing up on factory floors. 🔧 What Makes Saw Blade Depaneling So Widely Used? In mass production, consistency matters more than anything. Saw blade depaneling delivers exactly that. It uses a rotating blade to separate PCBs along straight lines, typically V-grooves. The process is simple, repeatable, and fast. No complex programming.No expensive setup.Just stable throughput. For manufacturers producing thousands—or millions—of identical boards, that reliability becomes a major advantage. ⚙️ Speed vs. Precision — Where It Fits Best Not every depaneling

Why PCB Router Depaneling Is Widely Used in Electronics Manufacturing

Why PCB Router Depaneling Is Widely Used in Electronics Manufacturing

PCB router depaneling remains one of the most common PCB separation methods in electronics manufacturing. Even with newer technologies like laser cutting, many factories still rely heavily on router systems for daily production. Why? Because router depaneling sits in a practical middle ground. It offers flexibility, stable cutting quality, and reasonable operating cost. For many PCB designs, that balance makes it the most reliable choice. In real manufacturing environments, the decision is rarely about technology alone. Engineers care about yield stability, production speed, board design, and long-term reliability. 🔍 Router Depaneling Handles Complex PCB Shapes One of the biggest advantages of router depaneling is its cutting flexibility. Unlike V-cut separation, which only works along straight panel lines, router systems follow

How Do Engineers Decide If PCB Router Depaneling Is Necessary

How Do Engineers Decide If PCB Router Depaneling Is Necessary?

PCB router depaneling is one of the most widely used PCB separation methods in electronics manufacturing. But engineers rarely choose it automatically. In many projects, the decision is made only after reviewing PCB design details, production requirements, and reliability risks. Some boards work perfectly with V-cut separation. Others require laser cutting. In many cases, router depaneling is the most balanced option. So how do engineers actually make that decision in real production environments? 🔍 The First Question Engineers Ask — How Is the PCB Designed? The PCB layout usually determines the depaneling method. Engineers start by checking several key design factors: If the board outline includes curves, internal slots, or complex contours, router depaneling is often necessary because routers can follow

Is Laser PCB Depaneling the Best Choice for High-Density PCBA

Is Laser PCB Depaneling the Best Choice for High-Density PCBA?

Laser PCB depaneling is often discussed when engineers start working with high-density PCBA designs. As boards become smaller and component spacing tighter, traditional mechanical separation methods sometimes reach their limits. Many production teams then begin evaluating laser cutting as an alternative. But is laser depaneling always the best option for high-density PCBA? In practice, the answer depends on board layout, reliability requirements, and production strategy. Let’s look at the issue from a real manufacturing perspective. 🔍 Why High-Density PCBA Changes the Depaneling Challenge High-density PCBA designs are very different from older PCB layouts. Components are packed closer together, and the space near the board edge becomes extremely limited. Common characteristics include: In these situations, depaneling becomes more than just a

Seprays—你PCB、分割的专家。

因为我们知道,即使是最好的产品只能作为强大的人在他们身后。

这就是为什么我们提供的 24/7专家技术支持—无论何时何地,只要你需要它。

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