Author: seprays

Is saw blade PCB depaneling faster than routing?

In most real production environments, yes—saw blade depaneling is usually faster, but speed alone rarely tells the full story. The better question engineers ask after a few projects is: faster for which boards, at what cost, and with what long-term risk? This article breaks the answer down from a production and reliability perspective. ⚡ Short […]

When Should You Choose Router Depaneling Instead of V-Cut?

Router depaneling vs V-cut is one of the most practical decisions PCB engineers face when balancing cost, quality, and long-term reliability. The short answer is simple: choose router depaneling when mechanical stress, design flexibility, and edge quality matter more than raw speed. Below, we break this down from real production experience—not theory. 🔍 What problem […]

Safety issues to watch in laser PCB depaneling

Laser PCB depaneling is increasingly used for low-stress, high-precision applications. However, choosing laser technology does not automatically mean “risk-free.” Based on real production experience, most problems come not from the laser itself, but from overlooked safety details in setup, operation, and process design. This checklist-style article highlights where teams often get it wrong—and how to […]

Which PCB depaneling method causes the least stress?

This question comes up whenever PCBA reliability, fine-pitch components, or thin substrates are involved. The short, experience-based answer is: laser depaneling introduces the lowest mechanical stress, but it is not always the default choice. Below is a clear comparison to help engineers make a practical decision. 🧠 Why Depaneling Stress Matters More Than You Think […]

When should I choose router depaneling over V-cut?

The choice between router depaneling and V-cut largely depends on the design and requirements of your PCBA. While both are popular methods for separating boards, each method offers distinct advantages depending on factors like board thickness, component sensitivity, and precision needs. This article will explore when router depaneling is the better choice over V-cut, with […]

When should you choose laser depaneling over routing?

This is a common question for PCB and PCBA engineers facing tighter tolerances, denser layouts, and rising cost pressure. The short answer: choose laser depaneling when mechanical stress, edge quality, or design freedom becomes a limiting factor. Below is a practical, experience-based breakdown to help you decide. 🔍 Understanding the Core Difference Routing (milling) relies […]

Is laser depaneling suitable for flexible PCBs?

Laser depaneling for flexible PCBs is increasingly popular in high-density electronics. Flexible PCBs are thin, stress-sensitive, and often densely populated. Mechanical methods like routing or V-cut can introduce micro-cracks, fiber pull-out, or board warping. Laser depaneling removes these risks, making it highly suitable when applied correctly. This article shares practical insights, production challenges, and cost […]

What PCB materials are suitable for laser depaneling?

PCB materials suitable for laser depaneling are not unlimited, and laser is not always the right answer. In real SMT production, laser depaneling performs extremely well for specific materials and use cases, while being less effective or inefficient for others. So instead of asking “Can laser cut this PCB?”, engineers usually ask a more practical […]

How close can components be to the PCB edge when milling depaneling?

Milling depaneling component-to-edge clearance is one of the most frequently debated topics between PCB designers, SMT engineers, and manufacturing teams. Everyone wants smaller boards, higher density, and lower cost—but routing physics does not disappear just because layouts become tighter. So, how close can components realistically be to the PCB edge when using milling depaneling? The […]

Will there be burrs after cutting the PCB with a milling cutter PCB depaneling machine?

Milling cutter PCB depaneling machine burr formation is one of the most common concerns raised by process engineers—especially when boards move directly into functional testing, coating, or final assembly. Burrs may look minor, but in high-density or high-reliability electronics, they can become a real quality risk. So, will burrs appear after milling and depaneling? The […]