ZM30-L Six-blade Aluminum Substrate Depaneling Machine

Características Del Producto:

– Unique multi-stage cutting technology, divided into three groups of cutting units, A, B, and C, and refined cutting in stages to ensure a smooth cutting surface.

– Reduce el estrés de corte por más de un 80%, lo que reduce enormemente el riesgo de la junta de deformación.

– Corte los bordes son planas y libre de rebabas, la junta directiva de la superficie permanece plana sin torcer o torcerse, que cumple con los estrictos requisitos de alta precisión de la placa de circuito de fabricación.

Contact us today! Learn about the SEPRAYS ZM30-L Walkaway Depaneler.

Descripción

Elemento ZM30-L Six-blade ZM30-L Six-blade + 1.2M Platform ZM30-L Six-blade + 2.4M Platform
Dimensiones De La Máquina (W × D × H) 325 × 380 × 333 mm 1200 × 506 × 333 mm 2400 × 506 × 333 mm
Max. Depaneling Length Unlimited Unlimited Unlimited
Depaneling Speed 80, 120, 200, 400 mm/s 80, 120, 200, 400 mm/s 80, 120, 200, 400 mm/s
Depaneling Thickness 0.2 – 5 mm 0.2 – 5 mm 0.2 – 5 mm
Fuente De Alimentación 230V / 50Hz (110V / 60Hz) 230V / 50Hz (110V / 60Hz) 230V / 50Hz (110V / 60Hz)
Machine Weight 33 kg 33 kg + 6 kg 33 kg + 15 kg

ZM30-L Six-blade Aluminum Substrate Depaneling Machine

Application Examples

Suitable for various V-grooved PCBs, aluminum substrates, LED circuit boards, LED light strips, and more.

Mainly used in the LED, SMT, mobile phone, toy, and other electronics industries, as well as various other industries using circuit boards.

Application Examples

El ZM30-L Six-blade Aluminum Substrate Depaneling Machine is a cutting-edge solution designed for high-precision circuit board manufacturing, offering unmatched performance in stress control and cut quality. Engineered with SEPRAYS’ proprietary multi-stage cutting technology, it features three sequential cutting units—A, B, and C—to perform refined, step-by-step separation. This unique approach ensures exceptionally smooth cutting results.

By reducing cutting stress by over 80%, the ZM30-L Six-blade Aluminum Substrate Depaneling Machine significantly lowers the risk of board deformation, making it ideal for fragile or precision-demanding PCBs. The cutting edges remain flat and burr-free, and the board surface stays consistently smooth without any warping or twisting, fully meeting the rigorous standards of advanced electronic manufacturing.

Whether for consumer electronics, automotive systems, or aerospace-grade boards, the ZM30-L delivers precision, consistency, and a superior finish.

📩 Contact us now and discover why over 3,000 leading companies trust SEPRAYS for their PCB depaneling needs.

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