ZAM310H Offline Precision Laser Depaneling Machine

El ZAM310H Offline Precision Laser Depaneling Machine provides high-accuracy, stress-free cutting for PCBs and FPCs using UV and CO₂ laser technology. It delivers clean, burr-free edges with minimal heat effect, supporting a wide range of materials including FR4, PI, LCP, ceramics, and RF substrates. With optimised cutting paths, advanced software, and a user-friendly interface, it ensures fast and reliable processing. Designed with cooling, dust extraction, and MES compatibility, the ZAM310H guarantees stable, efficient, and precise performance for batch and mass electronics production in automotive, telecom, and medical industries.

Descripción

Elemento ZAM310H
Platform Type Single Platform
Processing Area 350 × 350 mm
Precisión De Repetición ±2 μm
Overall Accuracy ±25 μm
X/Y Resolution 1 μm
Max. Material Thickness ≤2.0 mm
Platform Structure Steel Structure
Motor Type Servo Motor
Laser Type Nanosecond
Laser Power 15 W
Telecentric Lens Range 50 × 50 mm f=100 mm (Domestic Galvo)
CCD Structure Coaxial
La Precisión De Posicionamiento 0.01 mm
Camera Resolution 1.3 MP
Control Software DreamCreaTor 3
Software De Procesamiento De Datos Circuit CAM 7.5 Standard
File Formats LMD, Standard Gerber (RS-274-D), Extended Gerber (RS-274-X), DXF, Excellon, Sieb & Meier, HP-GL, Barco DPF, ODB++
Working Environment 22℃ ± 2℃
Fuente De Alimentación 380 VAC / 50 Hz / 2 kW
Peso Approx. 580 kg
Dimensions (L × W × H) 930 × 1270 × 1600 mm

El ZAM310H Offline Precision Laser Depaneling Machine is a high-performance solution for precise, stress-free separation of PCBs and flexible circuits. Built for demanding industries, it combines advanced UV and CO₂ laser technology with intelligent software to deliver consistent, burr-free results.

Hardware steel structure

⚡ Precision Laser Cutting

  • UV laser: ultra-fine cut width of 25–40 μm, minimal thermal impact, no carbonisation

  • CO₂ laser: cut width of 120–220 μm, excellent for resin-based materials

  • Non-contact cutting prevents mechanical stress and damage

  • Supports a wide range of materials, including PCBA, FPC, LCP, MPI, PI, PET, FR4, FR5, CEM, HTCC/LTCC ceramics, and RF materials

Versatile Applications

🔄 Flexible Offline Operation

  • Optimised cutting paths for higher efficiency and shorter cycle times

  • Powerful graphic editing software for fast data processing

  • Easy-to-use GUI interface with a low learning curve

  • Optional advanced functions: pulse following, drilling, and Skywriting for enhanced control

Steel mesh inspection

Pulse Following

🛠 Versatile Applications

The ZAM310H is ideal for:

  • FPC outline cutting

  • PCBA depaneling

  • Coverlay window cutting

  • Gold finger processing

  • High-reliability applications in automotive, telecom, medical, and consumer electronics

Laser Cutting Case

🌍 Industrial-Grade Reliability

  • Stable platform and precision motion system for accuracy

  • Advanced cooling and dust extraction ensure clean operation

  • Seamless integration with MES systems for real-time data and traceability

  • Designed for batch and mass production with consistent performance

Automation system

El ZAM310H Offline Precision Laser Depaneling Machine delivers unmatched precision, flexibility, and efficiency. Whether used for FPCs, PCBAs, or specialised materials, it is the perfect choice for manufacturers who demand superior quality and high productivity in electronic assembly.

📩 Contacte con Nosotros para Precios y Detalles

Correo electrónico: sales@seprays.com

WhatsApp: +86-18929266433

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