ZM300ASV Fully Automatic Saw Style V-groove PCB Depaneling Machines

El SEPRAYS ZM300ASV fully automated saw-type V-groove PCB depaneling machine offers high-quality, efficient PCB separation with fully automated loading, cutting, discharging, and waste collection. It supports automatic V-groove separation in both X and Y directions and delivers burr-free results on aluminum, copper, FR4, and glass fiber boards. Quick blade and suction cup adjustments save time during line changes, and PCBs can be automatically placed into trays or transported via assembly lines. Trusted by top 500 companies and over a thousand enterprises worldwide, it provides a reliable solution for precise PCB depaneling.

Categoría: Máquina depaneladora de PCB de ranura en V Etiqueta: ZM300ASV PCB depaneling machines

Descripción

Elemento	Especificación
Modelo	ZM300ASV
Valid Cutting Size	350 × 350 mm
Table Size	370 × 400 mm
Working Height	900 ± 20 mm
Process Table	Tablas dobles
Cutting Precision	De ±0,2 mm
Repeat Precision	±0,02 mm
La Velocidad De Corte	100 mm/s
La arquitectura	Rail feeding; manipulator for loading & unloading; circular cutter head / V-cutting head with horizontally adjustable height
El Método De Alimentación	Track entry, PCB directly flows in
Discharging Method	Module output / Belt line output / Track output
El Método De Transferencia De	Manipulator handling, vacuum suction
Movement Direction	De izquierda a derecha o de derecha a izquierda
Max Moving Speed	1000 mm/s
Max Moving Travel	Manipulator X-axis 1: 610 mm; Sub-board X-axis: 530 mm; Sub-board Y-axis: 600 mm
Operation Interface	Windows 10
Program Teaching Method	Manual teaching / CAD import
Programa De Copia De Seguridad	Transferencia de datos por USB
Working Air Pressure	4.5 ~ 6 kgf/cm²
Voltage / Power Requirement	AC 220 V ±10%, 50/60 Hz, 2.5 KW
Dimensions (W × D × H)	1180 × 1246 × 1684 mm
Peso	1000 kg

Introducción De Producto

The “V”-groove PCB splitter provides higher-quality PCB separation.

Fully automated operations include feeding, cutting, finished product discharge, and waste collection.

Automatic PCB separation in both the X and Y directions with the V-groove.

Smooth, burr-free slitting of aluminum, copper, FR4, and fiberglass substrates.

During line changes, operators can swap the cutting die and suction cup, eliminating manual tool adjustments and saving time.

The system automatically places small PCBs in trays or removes them from the assembly line based on customer needs.

Características

Operation Screen

Simple settings for panel separation and milling cutter/fixture parameters.
Processing efficiency and milling cutter usage data are clearly displayed.
A history window facilitates operation log review.
Equipped with milling cutter life management, maintenance alerts, and spindle speed settings.

Four-level user access control

User accounts and passwords can be set to differentiate access levels based on management needs.
You can add a fingerprint login module to simplify management.

CCD vision automatic calibration system

Equipped with a high-speed CCD vision automatic calibration system.
Cutting path simulation assists programming, ensuring accurate cutting paths.
Completa la hoja de exploración y programación fuera de línea de mejorar la ruta de la eficiencia de la edición.

Offline programming and full-sheet scanning

Cutting programs can be edited offline and directly imported into the machine, improving utilization.
Simpler, more user-friendly, automatic cutting path recognition.
Scan and edit the entire PCB board, allowing quick modification of the cutting path and improving programming efficiency.
Selectable cutting line colors facilitate the identification of different PCB colors.

High-speed cutting spindle

Imported high-speed, high-precision spindle
Low cutting stress, smooth board edges, and high precision
High-precision spindle speed of 80,000 rpm/min

High utilization rate

With over 30 years of independent software development, the splitter utilizes independently developed software, ensuring stability and reliability, eliminating board defects caused by bugs.