Japanese 
English 
Spanish 
Korean 
Russian 
Chinese Latest Products
About Seprays
Founded in Taiwan in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support to customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000 square meter modern industrial plant, increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
The company is ISO9001, ISO14001, and ISO45001 certified, holds CE certification, and owns over 100 hardware and software patents. It operates two modern factories covering over 26,000 square meters in mainland China and has service locations in nine cities across China, providing nationwide after-sales service. Sales and service locations in 31 countries worldwide provide timely customer service.
全体のサービス
pcbの完全なソリューションをdepaneling
31
Countries & Regions
32
Years of experience in SMT industrial equipment manufacturing
180+
Patents & Certificates
パートナー
Seprays depaneling machines — trusted by over 3,000 industry leaders worldwide.
新着情報
PCB Depaneling Insights & Manufacturing News
Is saw blade PCB depaneling faster than routing?
In most real production environments, yes—saw blade depaneling is usually faster, but speed alone rarely tells the full story. The better question engineers ask after a few projects is: faster for which boards, at what cost, and with what long-term risk? This article breaks the answer down from a production and reliability perspective. ⚡ Short answer first Speed matters—but only when it doesn’t compromise yield. 🧩 Where the speed difference really comes from 🔪 Cutting path length Saw blade depaneling follows straight, continuous lines. Once aligned, the blade cuts through the panel in a single motion. Routing removes material gradually, following programmed paths, which naturally takes longer. 🔄 Tool motion Routing involves frequent acceleration, deceleration, and direction changes. Saw blade
When Should You Choose Router Depaneling Instead of V-Cut?
Router depaneling vs V-cut is one of the most practical decisions PCB engineers face when balancing cost, quality, and long-term reliability. The short answer is simple: choose router depaneling when mechanical stress, design flexibility, and edge quality matter more than raw speed. Below, we break this down from real production experience—not theory. 🔍 What problem are engineers really trying to solve? Most depaneling issues don’t show up at the cutting stage. They appear later as: The depaneling method often becomes the hidden root cause. ⚙️ When V-cut starts to struggle ⚠️ High mechanical stress V-cut relies on the bending force to separate boards. This force travels through the entire PCB, not just the score line. For simple, low-density boards, this
Safety issues to watch in laser PCB depaneling
Laser PCB depaneling is increasingly used for low-stress, high-precision applications. However, choosing laser technology does not automatically mean “risk-free.” Based on real production experience, most problems come not from the laser itself, but from overlooked safety details in setup, operation, and process design. This checklist-style article highlights where teams often get it wrong—and how to avoid those pitfalls. ⚠️ Why Safety Is Often Underestimated in Laser Depaneling Laser depaneling is a non-contact process, so it feels safer than routing or sawing. No blades, no vibration, no mechanical force.That perception can lead to relaxed standards, especially during early deployment. Common pain points engineers report include: Safety in laser depaneling is not only about people—it directly affects product quality and cost. 👀
Which PCB depaneling method causes the least stress?
This question comes up whenever PCBA reliability, fine-pitch components, or thin substrates are involved. The short, experience-based answer is: laser depaneling introduces the lowest mechanical stress, but it is not always the default choice. Below is a clear comparison to help engineers make a practical decision. 🧠 Why Depaneling Stress Matters More Than You Think Mechanical stress during depaneling is a hidden risk. It may not show up during visual inspection, but it often leads to: As component density increases and boards become thinner, depaneling stress becomes a design constraint, not a secondary process issue. ⚙️ Common PCB Depaneling Methods at a Glance In practice, manufacturers mainly choose between four methods: Each method removes material differently—and that directly affects stress
Seprays — Your PCB Depaneling Expert.
Because we know that even the best products are only as strong as the people behind them.
That’s why we provide 24/7 expert technical support—whenever and wherever you need it.
